SSC2102S

Discontinuous Conduction Mode (DCM) Interleaved PFC IC
SSC2102S
General Descriptions
Package
SSC2102S is controller ICs intended to implement a
DCM (Discontinuous Conduction Mode) interleaved
PFC (Power Factor Correction) circuit.
Using the two-phase interleaved control incorporated
in this IC, it is possible to achieve a low cost, high
performance PFC system with low input / output ripple
currents, low noises and few external components.
SOP8
Features






COMP
1
8
IS
VIN
2
7
OUT1
VFB
3
6
GND
VCC
4
5
OUT2
Not to scale
No Auxiliary Windings on Inductors Required
Voltage Mode Control
Maximum ON Time Control Circuit
Soft-start Function
Built-in High Speed Response Function (HSR)
Protections
Dual level Overcurrent Protection (OCP) Pulse-by Pulse
Dual level Overvoltage Protection (OVP)---Auto-Restart
Under Voltage Protection (UVP) ---------- Auto-Restart
Thermal Shutdown with Hysteresis (TSD)
--------------------------------------------------- Auto-Restart
Open Loop Detection (OLD) --------------- Auto-Restart
VFB pin /VIN pin / IS pin Open Pin Protection (OPP)
Electrical Characteristics
Maximum ON Time, tONMAX = 20.7 μs(typ.)
Error Amplifier Reference Voltage, VFB(REF) = 3.5 V(typ.)
OUT Pin Peak Source Current, IOUT(SO) = – 0.5 A*
OUT Pin Peak Sink Current, IOUT(SI) = 0.5 A*
*Design assurance item
Applications
Typical Application Circuit
PFC Circuit up to 300 W of Output Power such as:
 AC/DC Power Supply
 Digital Appliances (Large Size LCD Television and
DBYP
BR1
so forth)
L1
VOUT
D1
VAC
L2
Q1
Q2
C2
LINE
GND
RCS
R5
U1
1
RIN1
COMP
IS
forth)
 Communication Facilities
 Other SMPS
D2
C1
 OA Equipment (Computer, Server, Monitor, and so
8
C4
2
VIN
OUT1
VFB
GND
VCC
OUT2
7
ROUT1
RIN2
CP
4
NC
3
6
5
SSC2102S
External Power
supply
ROUT2
Cf
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
1
SSC2102S
CONTENTS
General Descriptions ----------------------------------------------------------------------- 1
1. Absolute Maximum Ratings --------------------------------------------------------- 3
2. Electrical Characteristics ------------------------------------------------------------ 3
3. Functional Block Diagram ----------------------------------------------------------- 6
4. Pin Configuration Definitions ------------------------------------------------------- 6
5. Typical Application Circuit --------------------------------------------------------- 7
6. Package Outline ------------------------------------------------------------------------ 8
7. Marking Diagram --------------------------------------------------------------------- 8
8. Operational Description -------------------------------------------------------------- 9
8.1
Operational Description of Interleaved DCM -------------------------- 9
8.2
Startup Operation ------------------------------------------------------------ 9
8.3
Voltage Control Operation ------------------------------------------------ 10
8.4
High Speed Response Function (HSR) ---------------------------------- 11
8.5
Gate Drive --------------------------------------------------------------------- 12
8.6
Overcurrent Protection (OCP) ------------------------------------------- 12
8.7
Overvoltage Protection (OVP) -------------------------------------------- 13
8.8
Open Loop Detection (OLD) ---------------------------------------------- 14
8.9
Open Pin Protection (OPP) ------------------------------------------------ 14
8.10 Input Undervoltage Protection (UVP) ---------------------------------- 14
8.11 Thermal Shutdown (TSD) ------------------------------------------------- 14
9. Parameters Design -------------------------------------------------------------------- 15
9.1
Inductor Design -------------------------------------------------------------- 15
9.2
Overcurrent Detection Resistor, RCS ------------------------------------ 17
10. Design Notes --------------------------------------------------------------------------- 18
10.1 External Components------------------------------------------------------- 18
10.2 PCB Trace Layout and Component Placement ----------------------- 18
OPERATING PRECAUTIONS -------------------------------------------------------- 20
IMPORTANT NOTES ------------------------------------------------------------------- 21
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
2
SSC2102S
1.
Absolute Maximum Ratings
 The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
 Unless otherwise specified TA = 25 °C
Parameter
Symbol
Pins
Rating
Units
VCOMP
1–6
− 0.3 to 5.5
V
VIN Pin Voltage
VIN
2–6
− 0.3 to 5.5
V
VIN Pin Current
IIN
2–6
− 1 to 1
mA
VFB Pin Voltage
VFB
3–6
− 0.3 to 5.5
V
VFB Pin Current
IFB
3–6
− 1 to 1
mA
VCC Pin Voltage
VCC
4–6
− 0.3 to 30
V
OUT2 Pin Voltage
VDR2
5–6
− 0.3 to 30
V
OUT1 Pin Voltage
VDR1
7–6
− 0.3 to 30
V
IS Pin Voltage
VIS
8–6
− 16.0 to 5.5
V
IS Pin Current
IIS
8–6
− 1.75 to 1
mA
Operating Frame Temperature
TFOP
−
− 40 to 85
°C
Storage Temperature
Tstg
− 40 to 125
°C
Junction Temperature
Tj
− 40 to 125
°C
COMP Pin Voltage
2.
Test Conditions
−
Electrical Characteristics
 The polarity value for current specifies a sink as "+," and a source as "−," referencing the IC.
 Unless otherwise specified, TA = 25 °C, VCC =15 V
Parameter
Symbol
Test
Conditions
Pins
Min.
Typ.
Max.
Units
Power Supply Startup Operation
Operation Start Voltage
VCC(ON)
4–6
10.8
11.6
12.4
V
Operation Stop Voltage
VCC(OFF)
4–6
9.8
10.6
11.4
V
VCC Pin Voltage Hysteresis
Circuit Current in
Pre-operation
Circuit Current in Operation
Circuit Current in Overvoltage
Protection Operation
Circuit Current in Standby
Operation
VCC(HYS)
4–6
0.8
1.0
1.2
V
4–6
−
40
100
µA
4–6
−
11.0
15.0
mA
Oscillation Control
OUT1 Pin Maximum ON
Time
On-time matching between
OUT1 and OUT1
OUT1 Pin and OUT2 pin
Phase Difference
SSC2102S-DS Rev.1.2
Dec. 08, 2014
ICC(OFF)
VCC = 11 V
ICC(ON)
ICC(OVP)
VFB = 3.9 V
4–6
−
8.0
10.0
mA
ICC(Standby)
VFB = 0.5 V
4–6
−
100
200
μA
7–6
19.2
20.7
22.2
μs
−5
0
5
%
170
180
190
deg
tONMAX
tRATIO
PHASE
5–6
7–6
5–6
7–6
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SSC2102S
Parameter
Symbol
Error Amplifier Operation
Error Amplifier Reference
Voltage
Error Amplifier
Transconductance Gain
Error Amplifier Maximum
Source Current
Error Amplifier Maximum
Voltage
VFB Pin High Speed Response
Enable Voltage(1)
VFB Pin High Speed Response
Activating Voltage
COMP Pin Source Current in
High Speed Response
Operation
VFB Pin Input Bias Current
COMP Pin Voltage in Output
Open Loop Detection
Operation
Test
Conditions
Pins
Min.
Typ.
Max.
Units
VFB(REF)
3–6
3.4
3.5
3.6
V
gmEA
―
80
100
120
μS
ICOMP(SO)
VFB = 2.8 V
1–6
– 36
– 30
– 24
μA
VCOMP(MAX)
VFB = 3.0 V
1–6
4.00
4.12
4.25
V
VFB(HSR)EN
3–6
3.3
3.4
3.5
V
VFB(HSR)AC
3–6
3.1
3.2
3.3
V
ICOMP(SO)HSR
VFB = 2.5 V
1–6
– 120
– 100
– 80
μA
IFB(BIAS)
VFB = 3.5 V
3–6
―
―
1.5
μA
ICOMP = 100 µA
1–6
0.7
0.9
1.1
V
−
−
0.3
V
−
10.2
−
V
−
70
−
ns
−
35
−
ns
−
– 0.5
−
A
−
0.5
−
A
VCOMP(OLD)
Drive Output
OUT1 and OUT2 Pin Voltage
(Low)
OUT1 and OUT2 Pin Voltage
(High)
OUT1 and OUT2 Pin
Rise Time(2)
OUT1 and OUT2 Pin
Fall Time(2)
OUT1 and OUT2 Pin
Peak Source Current(1)
OUT1 and OUT2 Pin
Peak Sink Current(1)
(1)
Design assurance item
(2)
Shown in Figure 3-1
VOUT(L)
IOUT = 20 mA
VOUT(H)
VCC = 12 V
tr
VCC = 20 V
tf
VCC = 20 V
IOUT(SO)
IOUT(SI)
5–6
7–6
5–6
7–6
5–6
7–6
5–6
7–6
5–6
7–6
5–6
7–6
90%
VOUT
10%
tr
tf
Figure 3-1 Switching time
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
4
SSC2102S
Parameter
Protection Operation
VFB Pin Output Open Loop
Detection Voltage
VFB Pin Output Open Loop
Detection Release Voltage
VFB Pin Soft Overvoltage
Protection Threshold Voltage
VFB Pin Overvoltage
Protection Threshold Voltage
IS Pin Overcurrent Protection
Threshold Voltage (Low)
IS Pin Overcurrent Protection
Threshold Voltage (High)
COMP Sink Current in
Protection Mode
VIN Pin Protection Threshold
Voltage
VIN Pin Protection Delay
Time
Thermal Shutdown Activating
Temperature (1)
Thermal Shutdown Release
Temperature (1)
Hysteresis Temperature of
Thermal Shutdown(1)
Thermal Resistance
Thermal Resistance from
Junction to Frame
(1)
Design assurance item
SSC2102S-DS Rev.1.2
Dec. 08, 2014
Symbol
Test
Conditions
Pins
Min.
Typ.
Max.
Units
VFB(OLDL)
3–6
0.46
0.50
0.54
V
VFB(OLDH)
3–6
0.64
0.70
0.76
V
VFB(SOVP)
3–6
3.60
3.68
3.76
V
VFB(OVP)
3–6
3.64
3.72
3.80
V
VIS(OCPL)
8–6
− 0.48
− 0.42
− 0.36
V
VIS(OCPH)
8–6
− 0.62
− 0.55
− 0.48
V
1–6
80
100
120
μA
VIN(P)
2–6
0.1
0.3
0.5
V
tVIN
2–6
7
14
21
ms
TjTSDH
–
150
–
–
°C
TjTSDL
–
140
–
–
°C
TjTSDHYS
–
–
10
–
°C
θｊ-F
–
−
65
85
°C/W
ICOMP(SI)
VIS = − 0.5 V
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SSC2102S
3.
Functional Block Diagram
COMP
+
Gain
Control
WDT
IS
-
Peak Current
Limitation
VCC
VIN(P)
-
R
Q
S
Qb
+
VFB
3.5V
gm
+
GND
3.72V
-
OVP
+
R
Q
S
Qb
+
0.7/0.5V
OUT1
OUT2
OLD
+
Phase
Management
-
VIN
0.3V
VIN(P) OLD
UVLO
+
VCC
4.
Vreg5V
OVP
TSD
Pin Configuration Definitions
COMP
1
8
IS
VIN
2
7
OUT1
VFB
3
6
GND
VCC
4
5
OUT2
SSC2102S-DS Rev.1.2
Dec. 08, 2014
Pin
Name
Descriptions
1
COMP
Error amplifier output and phase compensation
2
VIN
3
VFB
Rectified input voltage detection
Constant voltage control signal input /
Overvoltage signal input / Open loop detection
signal input
4
VCC
Power supply for control circuit input
5
OUT2
2nd Gate driver output
6
GND
Ground
7
OUT1
1st Gate driver output
8
IS
Peak current detection signal input
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SSC2102S
5.
Typical Application Circuit
DBYP
BR1
L1
VAC
D1
VOUT
L2
D2
Q2
Q1
C1
C2
R2
RCS
RIN1
COMP
R1
R3
LINE
GND
R5
U1
1
R4
IS
8
C4
2
VIN
OUT1
7
ROUT1
RS
RIN2
CVIN
CS
4
CP
VFB
GND
VCC
OUT2
6
5
SSC2102S
CFB
SSC2102S-DS Rev.1.2
Dec. 08, 2014
NC
3
Cf
External Power
supply
SANKEN ELECTRIC CO.,LTD.
ROUT2
7
SSC2102S
6.
Package Outline
SOIC8
NOTES:
 All liner dimensions are in mm
 Pb-free. Device composition compliant with the RoHS directive
7.
Marking Diagram
8
SC2102
Part Number
SKYMD
1
Lot Number
Y is the last digit of the year (0 to 9)
M is the month (1 to 9,O,N or D)
D is a period of days
1 : 1st to 10th
2 : 11th to 20th
3 : 21st to 31st
Sanken Control Number
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
8
SSC2102S
8.
Operational Description
IL1
D1
L1
All of the parameter values used in these descriptions
are typical values. With regard to current direction, "+"
indicates sink current (toward the IC) and "–" indicates
source current (from the IC).
ION1
VAC
Q1
IL1
D1
L2
IL
Q2
C1
8.1 Operational Description of Interleaved
DCM
Figure 8-1 through Figure 8-4 show the PFC (Power
Factor Correction) circuits and the operational
waveforms of both single phase and two phase
interleaved DCM (Discontinuous Conduction Mode).
Single phase DCM is well known as a technique that
achieves low switching noises because the drain current
increases from zero when a power MOSFET turns on,
and is not steep shape waveforms as shown in Figure 8-2.
However, the usable power level of the single phase
DCM is limited by the very high input / output ripple
currents.
The two phase interleaved DCM incorporates two
boost converters, and is able to cancel the input ripple
currents and to reduce the output ripple currents due to
the phase difference of 180°between two converters as
shown in Figure 8-3.
The interleaved DCM achieves a PFC system with
lower switching noise and smaller input filter areas,
compared with the single phase DCM. Because lower
input / output ripple currents increase the filtering effect
of EMI filters and reduce switching noises.
IOFF1
C2
ION2
IOFF2
RCS
Figure 8-3 Two phase interleaved DCM PFC circuit
Inductor
Ccurrent
ION1
Composite inductor current　ILCMP
IL1
IL2
IOFF1
ION2
IOFF2
Figure 8-4 Operational waveform of two phase
interleaved DCM
D1
IOFF
C1
VAC
ION
Q1
C2
RCS
Figure 8-1 Single phase PFC circuit
IL
ILPEAK
1
 ILPEAK
2
The peripheral circuits around VCC pin and COMP
pin is shown in Figure 8-5.
VCC pin is the external power supply for the IC. AC
input voltage and the external voltage for VCC terminal
are provided, and when following conditions are
satisfied, the control circuit starts switching operation.
 FB pin voltage increases to more than
VFB(OLDH) = 0.70 which is equivalent to about 20% of
rated output voltage.
 VCC pin voltage
VCC(ON) = 11.6 V.
ION
IOFF
Figure 8-2 Operational waveform of single phase DCM
SSC2102S-DS Rev.1.2
Dec. 08, 2014
8.2 Startup Operation
increases
to
more
than
When VFB pin voltage decreases to VFB(OLDL) = 0.50
V or less, the control circuit stops switching operation
and enters into the standby mode even if VCC pin
voltage increases to VCC(ON) or more.
Figure 8-6 shows the operational waveform at startup.
At startup, COMP pin is charged by ICOMP(SO) = – 30 μA,
and thus the output power increases gradually until VFB
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SSC2102S
pin voltage becomes 3.2V (corresponds to about 90% of
rated output voltage). This Soft-start Function reduces
the stress on power devices.
External
Power supply
8 VCC
8.3 Voltage Control Operation
The PFC circuit with a general single phase DCM is
shown in Figure 8-8. The L1 current is detected by
auxiliary winding D and the off time of MOSFET is
controlled.
U1
ICOMP(SO)
Cf
VIN(DC)
RS
CP
D1
L1
COMP
3
GND
C2
C1
VAC
Control
IC
6
CS
VOUT
D
Q1
Figure 8-5 Peripheral circuit of VCC pin and COMP pin
Figure 8-8 General current detection circuit of single
phase PFC
Soft start period Constant voltage operation
Drain Current,
IDS(Q1), IDS(Q2)
In the boost PFC converter, the tON is a function of
load power. In case of DCM, tOFF is expressed as
follows:
0
VFB pin voltage
VFB(REF)
about 3.2V
t OFF >
VFB(OLDH)
0
VIN(DC)
VOUT－VIN(DC)
 t ON
(8-1)
COMP pin current
where,
VIN(DC): C1 voltage
VOUT: Output voltage
tON: On time of MOSFET
0
ICOMP(SO)
VCC pin voltage
VCC(ON)
0
Time
Figure 8-6 operational waveforms at startup
As shown in Figure 8-7, when VCC pin voltage
decreases to VCC(OFF) = 10.6 V or less, the control circuit
stops switching operation by UVLO (Undervoltage
lockout) circuit, and reverts to the standby mode before
startup.
ICC
Since the IC does not require the D winding for
current detection, simple PFC circuit is achieved. Figure
8-9 shows the peripheral circuit of VIN pin, VFB pin
and COMP pin.
The IC makes both tON and tOFF internally using VIN
pin voltage, FB pin voltage and COMP pin voltage.
VAC
VIN(DC)
L1
D2
C1
Q1
ICC（ON）
VOUT
D1
L2
Q2
C2
LINE
GND
Startup
Stop
RCS
ROUT1
U1
RIN1
2
GND
VIN
VFB
RV
VCC（OFF）
VCC（ON）
VCC pin
voltage
RIN2
6
3
COMP
1
CVIN RS
CFB
CP
ROUT2
CS
Figure 8-7 Relationship of VCC pin voltage and circuit
current ICC
Figure 8-9 Peripheral circuit of VIN, VFB and COMP
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
10
SSC2102S
tON is proportional to COMP pin voltage which
depends on the output voltage. The maximum on time
tONMAX = 20.7 µs is specified by VIN= 0.5 V and
VCOMP= 4V.
The maximum on time depends on VIN pin voltage.
Figure 8-10 shows the typical relationship between VIN
pin voltage and the maximum on time tONMAX(VIN)
(VCOMP= 4V).
Maximum on time tONMAX(VIN)
(µs)
22
20
18
16
14
12
10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VIN pin voltage (V)
Figure 8-10 relation between VIN pin voltage and
maximum on time (VCOMP= 4 V)
 VIN Pin and VFB Pin Parameter Design
VIN pin detects input voltage and VFB pin detects
output voltage. Since these voltages are used for
internal calculation of off time, the voltage detection
circuits should be well matched. Thus RIN1、RIN2 、
CVIN values of the input portion should be equal to
ROUT1、ROUT2、CFB values of the output portion. RIN1
and ROUT1 are recommended the resistors in several
hundreds kΩ to several MΩ range and
anti-electromigration type, such as metal oxide film
resistor. The variation in the value of RIN1, RIN2, ROUT1
and ROUT2 affect the accuracy of output voltage. Thus
these resistors are recommended to be high accuracy
type. As shown in Figure 8-9, resistor RV is
recommended to add for adjustment.CIN and CFB are
for noise reduction. Capacitors of about 0.1 nF to 10
nF are recommended, if necessary.
Since the dividers of input portion and output portion
are designed to be equal, Equation(8-1) can be
expressed as Equation(8-2) using VIN pin voltage and
VFB voltage.
t OFF >
VIN
 t ON
VFB－VIN
 COMP Pin Parameter Design （Error Amplifier
Phase Compensation）
COMP pin is the output of the internal error amplifier.
The error amplifier system consists of a
transconductance amplifier and switched current
sources that implement the enhanced response
functions. The phase compensation circuit is
connected between COMP and GND COMP pins.
This response is set below 20 Hz to maintain power
factor correction at standard commercial power
frequencies of 50 or 60 Hz.
In Figure 8-9, the phase compensation components,
CP, CS and RS, are recommended as follows and may
be adjusted to reduce ripple or to enhance transient
load response at the output voltage.
CP: 0.047 μF to 0.47 μF
CS: 0.47 μF to 10 μF
RS: 10 kΩ to 100 kΩ
8.4 High Speed Response Function (HSR)
The boost PFC is input the sinusoidal waveform of
AC input voltage with commercial frequency, and the
voltage control has the characteristic of responding to
low frequency. As a result, the dynamic load response
becomes slow, and may cause the output voltage VOUT to
drop more easily.
High Speed Response Function (HSR) is built-in to
reduce variation of the output voltage under dynamic
load change conditions.
Figure 8-11 shows the operational waveform of HSR.
When VFB terminal voltage increases to
VFB(HSR)EN = 3.4 V or more, the control circuit enables
HSR operation.
After this, when VFB terminal voltage decreases to
VFB(HSR)AC = 3.2 V or less due to dynamic load change
conditions or others, the control circuit starts HSR
operation. During this operation, COMP terminal is
charged by ICOMP(SO)HSR = – 100 μA and the output power
increases until VFB pin voltage increases to 3.2 V.
VFB(HSR)AC = 3.2 V is equivalent to about 91.4% of the
rated output voltage, VOUT.
VFB pin voltage
HSR Enable
VFB(REF)
VFB(HSR)EN
VFB(HSR)AC
(8-2)
HSR Active
0
COMP pin current
0
where,
VIN: VIN pin voltage
VFB: FB pin voltage
tON: On time of MOSFET
ICOMP(SO)
Time
ICOMP(SO)HSR
Figure 8-11 Operational waveform of HSR
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
11
SSC2102S
8.5 Gate Drive
8.6 Overcurrent Protection (OCP)
OUT1 pin and OUT2 pin are the gate drive pins for
driving the external MOSFET directly. The specification
is listed in Table 8-1.
Table 8-1 Current and Voltage specifications of
OUT1pin and OUT2 pin
Parameter
OUT1, OUT2 Pin
Voltage (Low)
OUT1, OUT2 Pin
Voltage (High)
OUT1, OUT2 Pin
Peak Source Current
OUT1, OUT2 Pin
Peak Source Current
Symbol
Figure 8-13 shows IS pin peripheral circuit. The
Overcurrent Protection (OCP) detects the inductor
current of both L1 and L2 by using current detection
resistor RCS. The voltage of both ends of RCS is induced
into IS pin
BR1
Rating
VOUT(L)
0.3 V(max.)
VOUT(H)
10.2 V
IOUT(SO)
– 0.5 A
IL1 + IL2
IOUT(SI)
R1
R3
1
COMP
LINE
GND
R5
U1
0.5 A
IS
8
C4
OUT1
VFB
GND
VCC
OUT2
NC
4
VIN
7
6
5
SSC2102S
Figure 8-13 Peripheral circuit of IS pin
There are two threshold voltages, VIS(OCPL) and
VIS(OCPH) in OCP operation. The details are as follows.
 IS Pin Overcurrent Protection Threshold Voltage
(Low)：VIS(OCPL)
When the inductor current increases and IS terminal
voltage decreases to VIS(OCPL) = − 0.42 V, control
circuit turns off the external power MOSFET. The
control is different depending on the state of V OUT1
and VOUT2.
1) When either VOUT1 or VOUT2 is High, the output,
which is set High, is set to Low as shown in Figure
8-14.
D1
L2
OUT1
R4
RCS
D2
U1
VIN
C2
R2
L1
2
Q2
Q1
3
IS
VOUT
D2
C1
Figure 8-12 shows the peripheral circuit of OUT1 and
OUT2.
Resistors, R1, R2, R3 and R4 in Figure 8-12 should
be adjusted for actual operation because these values
relate to the board layout patterns and power MOSFET
capacitances.
The gate resistors R1 and R3 are recommended in
several to several tens of Ω range, and should be
adjusted to reduce gate voltage ringing and EMI noise.
R2 and R4 help to prevent malfunctions caused by
steep dV/dt during power MOSFET turns off. The
recommended values are in the 10k to 100kΩ range, and
should be placed close to power MOSFET’s gate and
source terminals.
Power MOSFET should be selected so that these
VGS(th) threshold voltages are less than VOUT(H) enough
over entire operating temperature range.
COMP
D1
L2
2
1
L1
VAC
8
7
IS pin voltage
Q1
R1
0
C2
VFB
NC
3
GND
6
R2
4
VCC
OUT2
5
SSC2102S
Q2
R3
VIS(OCPL)
OUT1 pin
voltage,VOUT1
R4
0
Figure 8-12 Peripheral circuit of OUT1 pin and OUT2
pin
OUT2 pin
voltage, VOUT2
0
Figure 8-14 OCP operation by VIS(OCPL)
(either VOUT1 or VOUT2 is high)
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
12
SSC2102S
L1
2) When both VOUT1 and VOUT2 are High, the output
which is set to High ahead is set to Low as shown
in Figure 8-15。.
VOUT
D1
L2
D2
C1
Q1
Q2
C2
RCS
IS pin voltage
ICOMP(SI)
0
U1
1
COMP
VFB
RS
VIS(OCPL)
GND
6
ROUT1
3
CP
CFB
CS
LINE
GND
ROUT2
OUT1 pin
voltage, VOUT1
Figure 8-17 VFB pin peripheral circuit
0
OUT2 pin
voltage, VOUT2
VFB pin voltage
VFB(OVP)
VFB(SOVP)
0
VFB(REF)
Figure 8-15 OCP operation by VIS(OCPL)
(Both VOUT1 and VOUT2 are High)
 IS Pin Overcurrent Protection Threshold Voltage
(High)：VIS(OCPH)
This protection operates on such abnormal conditions
as the inductor is shorted or is saturated. When the
inductor current of L1 and L2 increases abnormally
and IS terminal voltage decreases to VIS(OCPH) = − 0.55
V or less, the control circuit sets both VOUT1 and
VOUT2 to Low on pulse-by-pulse basis as shown in
Figure 8-16.
IS pin voltage
0
VIS(OCPH)
OUT1 pin voltage,
VOUT1
OUT1 pin voltage,
VOUT1
OUT2 pin voltage,
VOUT2
Figure 8-18 Operational waveform of OVP
 Soft Overvoltage Protection (SOVP)
When VFB pin voltage increases to VFB(SOVP) = 3.68
V, Soft Overvoltage Protection (SOVP) is activated.
Thus, COMP pin is discharged by ICOMP(SI) = 100 μA
and the output voltage is decreased.
VFB(SOVP) is equivalent to about 105% of the rated
output voltage. The output voltage, which operates
SOVP, is calculated approximately as follows.
VOUT (SOVP ) 
0
OUT2 pin voltage,
VOUT2
0
Figure 8-16 OCP operation by VIS(OCPH)
8.7 Overvoltage Protection (OVP)
Figure 8-17 shows VFB pin peripheral circuit and
Figure 8-18 shows the operational waveforms of
Overvoltage Protection (OVP).
The output overvoltage is detected by using VFB pin.
There are two threshold voltages, VFB(SOVP) for Soft
Overvoltage Protection (SOVP) and VFB(OVP) for OVP.
The operations are shown below.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
ICOMP(SK)
COMP pin current
VOUT
 VFB (SOVP ) (V)
VFB(REF)
(8-3)
where,
VOUT
：Output voltage in normal operatioin
VFB(REF) ：Error AMP reference voltage, 3.5 V
 Overvoltage Protection (OVP)
When VFB pin voltage increases to VFB(OVP) = 3.72 V,
Overvoltage Protection (OVP) is activated. And thus
both OUT1 and OUT2 are set to Low. When VFB pin
voltage decreases to VFB(SOVP), the control circuit
deactivate both OVP and SOVP, and reverts to
switching operation. VFB(OVP) is equivalent to about
106 % of the rated output voltage. The output voltage,
which operates OVP, is calculated approximately as
follows.
SANKEN ELECTRIC CO.,LTD.
13
SSC2102S
8.10 Input Undervoltage Protection (UVP)
VOUT ( OVP ) 
VOUT
 VFB ( OVP ) (V)
VFB(REF)
(8-4)
where,
VOUT
：Output voltage in normal operatioin
VFB(REF) ：Error AMP reference voltage, 3.5 V
8.8 Open Loop Detection (OLD)
Figure 8-19 shows VFB pin peripheral circuit.
The Open Loop Detection (OLD) is activated when
the output voltage detection resistor ROUT1 is open.
In case the ROUT1 becomes open in normal operation,
VFB pin voltage starts to decrease. When VFB pin
voltage decreases to VFB(OLDL) = 0.50 V, the IC stops
switching operation.
When VFB pin voltage increases to VFB(OLDH) = 0.70
V or more, the control circuit starts switching operation.
VFB(OLDH) is equivalent to about 20% of the rated output
voltage.
L1
L2
C1
VOUT
D1
Instantaneous
power failure Soft start
VIN pin
voltage
tVIN
D2
Q1
Q2
C2
RCS
6
Input voltage is detected by VIN pin. When input
voltage decreases due to the instantaneous power
interruption etc., Input Undervoltage Protection (UVP)
is activated. Figure 8-20 shows the operational
waveforms.
When input voltage decrease and the VIN pin voltage
decreases to VIN(P) = 0.3 V or more for the internal
setting delay time, tVIN = 14 ms or more, the High Speed
Response Function (HSR) (refer to Section 8.4) is
disabled, the capacitor connected to COMP pin is
discharged by ICOMP(SI) and COMP pin voltage is nearly
zero.
After instantaneous power failure, input voltage
increases and VIN pin voltage increase to VIN(P) or more,
output power is increased slowly by Soft-start Function
(refer to Section 8.2) in order to reduce the stress on
power devices.
Since the over current is inhibited by UVP at return
from instantaneous power failure, output voltage can
increase again smoothly.
GND
LINE
GND
0
COMP pin
current
U1
VFB
VIN(P)
ROUT1
3
ICOMP(SI)
0
ROUT2
COMP pin
voltage
CFB
Figure 8-19 VFB pin peripheral circuit
0
Output
Voltage
8.9 Open Pin Protection (OPP)
VFB, IS and VIN pins have Open Pin Protection
(OPP) internally.
These pins are internally connected with pull-up
current sources. In case the pins are open, each pin
voltage is pulled up to each internal supply voltage. The
protection operations are as follows.
 VFB pin Open: VFB pin voltage increases and the
Overvoltage Protection (OVP) is activated. Thus, both
OUT1 and OUT2 are set to Low.
 IS pin Open: IS pin voltage increases and Overcurrent
Protection (OCP) is activated. Thus, both OUT1 and
OUT2 are set to Low.
0
Figure 8-20 the instantaneous power failure
operationwaveform
8.11 Thermal Shutdown (TSD)
When the temperature of the IC increases to
TjTSDH = 150 °C (min.) or more, the control circuit stops
switching operation. Conversely, when that decreases to
TjTSDL = 140 °C (min.) or less, the control circuit starts
switching operation.
 VIN pin Open: VIN pin voltage increases and the
control circuit limits its operation, or stops.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
14
SSC2102S
9.
Parameters Design
PIN( MAX ) 
 Symbols in this section are defined as follows.
PO: PFC Output power per phase (W)
η: PFC Efficiency
tON: On time (s)
VINRMS(MIN): Minimum input RMS voltage (V)
VINRMS(MAX): Maximum input RMS voltage (V)
VOUT: PFC output voltage (V)
IINRMS: Input RMS current (A)
DBYP
L1
VIN(DC)
VOUT
D1
VAC
L2
D2
C1
Q1
Q2
RIN1
COMP
IS
LINE
GND
8
VIN
OUT1
VFB
GND
VCC
OUT2
7
ROUT1
RIN2
CP
4
NC
3
I LPEAK( MAX ) 
2 2  PIN( MAX )
VINRMS ( MIN )
(A)
(9-3)
(3) Calculation of Maximum On Time
The IC makes both on time and off time internally
using VIN pin voltage, FB pin voltage and COMP
pin voltage. Maximum on time is calculated as
follows.
C4
2
 Calculation of Maximum Inductor Peak Current
Maximum inductor peak current, I LPEAK(MAX) is
calculated using the above results and Equation (9-3).
R3
U1
1
(9-2)
The values of KOM and KLM are generally in the
range of 1.2 to 1.3. η depends on the ON-resistance,
RDS(ON), of the power MOSFET and the forward
voltage, VF of the rectifier diode. η is generally in
the range of 0.90 to 0.97.
C2
RCS
(W)
Where,
KOM: Coefficient of the output power margin
KLM: Coefficient of the inductor saturation margin
η: PFC Efficiency
 The symbols of components are defined as shown in
Figure 9-1.
BR1
K OM  K LM  PO

6
5
SSC2102S
External Power
supply
 Calculation of VIN pin voltage, VIN
Defining the VIN pin voltage as VIN and the voltage
of C2 as VIN(DC), The relationship between VIN(DC) and
input detection resistors, RIN1 and RIN2 is as follows.
ROUT2
Cf
Figure 9-1 IC peripheral circuit
R IN1  R IN 2 VIN( DC )

R IN 2
VIN
9.1 Inductor Design
Inductor is designed as follows.
(1) Setting of Output Voltage, VOUT
At farst, output voltage of PFC should be set. Input
voltage must always be lower than output voltage in
a boost converter. Generally, output voltage, VOUT, is
set to at least 10 V higher than the peak voltage of
the maximum commercial AC input voltage.
VOUT  2  VINRMS ( MAX )  10　(V)
(9-1)
(2) Calculation of Maximum Inductor Peak Current
(per phase)
The waveform of the inductor current is triangular.
The maximum peak current, ILPEAK(MAX), running
through each inductor is calculated as follows.
 Calculation of Maximum Input Power
Maximum input power, PIN(MAX) is calculated as
follows.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
(9-4)
The relationship between output voltage, VOUT and
output detection resistors, ROUT1 and ROUT2 is as
follows.
R OUT 1  R OUT 2
VOUT

R OUT 2
VFB ( REF)
(9-5)
The values of RIN1 and RIN2 should be equal to the
values of ROUT1 and ROUT2.
From Equation (9-4) and Equation (9-5), VIN is
calculated as follows.
VIN( DC )
VIN

⇒ VIN 
SANKEN ELECTRIC CO.,LTD.
VOUT
VFB ( REF)
VIN( DC )  VFB ( REF)
VOUT
(V)
15
SSC2102S
In case of minimum AC input voltage, on time
becomes maximum. VIN at maximum on time is
calculated as follows.
VIN 
2  VINRMS ( MIN )  VFB ( REF)
VOUT
(V)
(9-6)
 Maximum on time
Maximum on time depends on VIN pin voltage as
shown in Figure 8-10 (Section 8.2). Maximum on
time can be gotten from result of Esuation (9-6) and
Figure 8-10.
(2) Calculation of ILPEAK(MAX)
In case KOM = 1.2, KLM = 1.2, η = 0.92 and
VINRMS(MIN) = 85 V, the maximum input power for a
single phase is calculated as follows.
PIN( MAX ) 

2  VINRMS ( MIN )  t ONMAX ( VIN )
I LPEAK ( MAX )
(H)
(9-7)
(5) Calculation of Inductor Turns
The turns number of inductor, N is calculated as
follows using the results of (2) and (4).
N
I LPEAK( MAX )  L MAX
Ae  BMAX
(turns)
(9-8)
where,
Ae : the effective area of inductor core (m2)
ΔBMAX : maximum magnetic flux density (T)
< Inductor Design Example >
Inductor design examle is shown below. The
specifications of power suply are as follows.
VINRMS(MIN) = 85V
VINRMS(MAX) = 265V
PO = 150 W for each phase
(Total output power of two phase Interleaved
PFC = 300 W)
(1) Setting of Output Voltage, VOUT
VOUT  2  VINRMS ( MAX )  10
 2  265  10  385(V)
hence, VOUT is set to 390 V(DC)
SSC2102S-DS Rev.1.2
Dec. 08, 2014
1.2 1.2 150
 235( W)
0.92
Then the maximum peak inductor current for a
single phase is calculated as follows.
I LPEAK( MAX ) 
(4) Calculation of Inductance value for a single phase.
The maximum inductance for a single phase, LMAX is
calculated as follows using the results of (2) and (3).
L MAX 
K OM  K LM  PO


2 2  PIN( MAX )
VINRMS ( MIN )
2 2  235
 7.8　( A)
85
(3) Calculation of tONMAX(VIN)
Using VFB(REF) = 3.5 V(typ.) and the result of (1),
VIN is calculated as follows.
VIN 

2  VINRMS ( MIN )  VFB ( REF)
VOUT
2  85  3.5
 1.08　( V)
390
The relation in Figure 8-10 shows tONMAX(VIN) at
VIN = 1.08 V is about 18.6 μs.
(4) Using the results of (2) and (3)
L MAX 

2  VINRMS ( MIN )  t ONMAX ( VIN )
I LPEAK ( MAX )
2  85 18.6 10 6
7.8
 286 10 6 (H)
(5) When Ae is 102 mm2 and ΔBMAX is 250 mT, N is
calculated as follows using the results of (2) and
(4).
N

I LPEAK( MAX )  L MAX
Ae  BMAX
7.8  286 10 6
102 10 6  0.25
 87(turns)
SANKEN ELECTRIC CO.,LTD.
16
SSC2102S
9.2 Overcurrent Detection Resistor, RCS
Overcurrent detection resistor, RCS, detects the
composite inductor current of both converters.
As the peak value of composite inductor current
varies by ON-duty DON(MAX), the coefficient defined as
KR is calculated from its DON(MAX) and RCS is calculated
by ILCMP.
(1) Calculation of Maximum ON-duty DON(MAX)
DON(MAX) is calculated as follows using VOUT derived
in Section 9.1 (1).
D ON ( MAX ) 
VOUT－ 2  VINRMS ( MIN )
(9-9)
VOUT
(2) Calculation of Inductor Current Coefficient, KR
From the result of (1),
R CS 
VIS( OCPL )
I LCMP ( MAX )
(Ω)
(9-13)
where,
VIS(OCPL) : IS Pin Overcurrent Protection Threshold
Voltage (Low) is − 0.42 V(typ.)
<RCS Design Example>
RCS design example is shown below. The
specifications of power suply are as follows.
VINRMS(MIN) = 85V
VINRMS(MAX) = 265V
PO = 150 W for each phase
(Total output power of two phase Interleaved
PFC = 300 W)
Output Voltage: VOUT = 390 V
 When DON(MAX) ≥ 0.5
(1) Calculation of DON(MAX)
KR  1
D ON ( MAX )  0.5
(9-10)
D ON ( MAX )
 When DON(MAX) < 0.5
KR  1

0.5  D ON ( MAX )
(9-11)
1  D ON ( MAX )
VOUT  2  VINRMS ( MIN )
D ON ( MAX ) 
VOUT
390  2  85
 0.69
390
(2) Calculation of KR
Using the the result of (1) and Equation (9-10), KR is
calculated as follows.
(3) Calculation of Composite Inductor Current,
ILCMP(MAX)
Using the result of (2), ILCMP(MAX) is calculated as
follows.
KR  1
 1
I LCMP(MAX)  K R 
2 2  K OM  PO
(A)
η  VINRMS(MIN)
D ON ( MAX )
0.69  0.5
 1.28
0.69
(9-12)
where,
KOM ：Output power margin coefficient
PO ：Output power for a single phase (W)
η
：PFC efficiency
Generally, KOM is the range of 1.2 to 1.3. η depends
on the ON-resistance, RDS(ON), of the power
MOSFET and the forward voltage, VF of the rectifier
diode. η is generally in the range of 0.90 to 0.97.
(4) Calculation of Over Current Detection Resistor,
RCS
Using the result of (3), RCS is calculated as follows.
(3) Calculation of ILCMP(MAX)
I LCMP(MAX)  K R 
2 2  K OM  PO
η  VINRMS(MIN)
 1.28 
2 2 1.2 150
 8.3(A)
0.92  85
(4) Calculation of RCS
Using the result of (3), RCS is calculated as follwos.
R CS 

SSC2102S-DS Rev.1.2
Dec. 08, 2014
D ON ( MAX )  0.5
VIS( OCPL )
I LCMP ( MAX )
 0.42
SANKEN ELECTRIC CO.,LTD.
8.3
 0.05()
17
SSC2102S
 Output Electrolytic Capacitor, C2
Apply proper derating to ripple current, voltage, and
temperature rise. Use of high ripple current and low
impedance types, designed for switch mode power
supplies, is recommended.
10. Design Notes
10.1 External Components
Take care to use properly rated, including derating as
necessary and proper type of components. Figure 10-1
shows the IC peripheral circuit.
 Inductor, L1 and L2
Apply proper design margin to temperature rise by
core loss and copper loss.
DBYP
BR1
L1
VIN(DC)
VOUT
D1
VAC
L2
D2
C1
Q1
Q2
C2
LINE
GND
RCS
R3
U1
1
RIN1
COMP
IS
8
C4
2
VIN
OUT1
VFB
GND
VCC
OUT2
7
10.2 PCB Trace Layout and Component
Placement
Since the PCB circuit trace design and the component
layout significantly affects operation, EMI noise, and
power dissipation, the high frequency PCB trace should
be low impedance with small loop and wide trace.
In addition, the ground traces affect radiated EMI noise,
and wide, short traces should be taken into account.
ROUT1
RIN2
CP
4
NC
3
6
Figure 10-2 shows the circuit design example.
5
SSC2102S
External Power
supply
ROUT2
Cf
Figure 10-1 The IC peripheral circuit.
 High Resistance and High Voltage Applied
Resistor, RIN1 and ROUT1
Since RIN1 and ROUT1 have applied high voltage and
have high resistance value, RIN1 and ROUT1 should be
selected
from
resistors
designed
against
electromigration or use a combination of resistors for
that.
 Current Detection Resistor, RCS
RCS is the resistor for the current detection. A high
frequency switching current flows to RCS, and may
cause poor operation if a high inductance resistor is
used. Choose a low inductance and high
surge-tolerant type.
 Boost Diode, D1 and D2
Choose a boost diode having proper margin of a peak
reverse voltage VRSM against output voltage VOUT.
A fast recovery diode is recommended to reduce the
switching noise and loss. Please ask our staff about
our lineup. The size of heat sink is chosen taking into
account some loss by VF and recovery current of
boost diode.
 Bypass Diode, DBYP
Bypass diode protects the boost diode from a large
current such as an inrush current. A high surge current
tolerance diode is recommended. Please ask our staff
about our lineup.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
(1) Main Circuit Trace Layout
This is the main trace containing switching currents,
and thus it should be as wide trace and small loop as
possible.
(2) Control Ground Trace Layout
Since the operation of IC may be affected from the
large current of the main trace that flows in control
ground trace, the control ground trace should be
separated from main trace and connected at a single
point grounding of point A in Figure 10-2 as close to
the RCS pin as possible.
(3) RCS Trace Layout
RCS should be placed as close as possible to the
Source pin and the IS pin.
The peripheral components of IS pin should be
connected by dedicated pattern from root of RCS.
The connection between the power ground of the
main trace and the IC ground should be at a single
point ground (point A in Figure 10-2) which is close
to the base of RCS.
(4) Peripheral Component of IC
The components for control connected to the IC
should be placed as close as possible to the IC, and
should be connected as short as possible to the each
pin.
(5) Gate Resistor (R2 and R4) Trace Layout
Gate resistor should be connected as short as
possible to the Source pin and Gate pin of each
MOSFET.
SANKEN ELECTRIC CO.,LTD.
18
SSC2102S
DBYP
BR1
L1
VAC
L2
D2
Q2
Q1
(1) Main trace should be wide
trace and small loop
C1
C2
(3)RCS should be as close to
Source pin as possible.
(3) Connected by dedicated
pattern from root of RCS
CP
RS
RIN2
1
COMP
2
CFB
4
OUT1
VFB
GND
VCC
OUT2
NC
3
VIN
A
(5)Gate resistor
should be as close to Source
pin and Gate pin as possible.
8
RIN1
CVIN
External Power
supply
R5
IS
R4
R2
RCS
U1
CS
VOUT
D1
7
C4
6
LINE
GND
R1
(2) Control GND trace should be
connected at a single point as
close to the RCS as possible
5
R3
Cf
ROUT2
ROUT1
(4)The components connected to the IC should be as close to the IC
as possible, and should be connected as short as possible
Figure 10-2 Example of connection of peripheral component
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
19
SSC2102S
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C
10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
20
SSC2102S
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
 Application examples, operation examples and recommended examples described in this document are quoted for
the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any
infringement of industrial property rights, intellectual property rights, life, body, property or any other rights of
Sanken or any third party which may result from its use.
 Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
SSC2102S-DS Rev.1.2
Dec. 08, 2014
SANKEN ELECTRIC CO.,LTD.
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