SUPERWORLD L1M-3N9S-10

High Frequency Chip Inductor
L1M SERIES
1. PART NO. EXPRESSION :
(a) Series and Dimension code
L1M-1N0S-10
(a)
(b) (c)
(d) 10 : RoHS Compliant
(b) Inductance code : 1N0 = 1.0nH
(d)
(c) Inductance tolerance : S = ± 0.3nH , J = ± 5% , K = ± 10%
2. CONFIGURATION & DIMENSIONS :
A
D
L
H
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
1.00± 0.10 0.50± 0.10 0.50± 0.10 0.25± 0.10
G
H
L
0.40 Ref.
0.55 Ref.
1.50 Ref.
3. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
4. GENERAL SPECIFICATION :
a) Storage temp. : -40° C to +105° C
b) Operating temp. : -40° C to +105° C ( include self-temp. rise )
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
High Frequency Chip Inductor
L1M SERIES
5. ELECTRICAL CHARACTERISTICS :
DC Resistance
(Ω)
SRF
(MHz)
Rated Current
( mA )
Max.
Min.
Max.
5
0.10
12000
500
100
5
0.12
11500
500
1.2
100
5
0.12
11000
500
L1M-1N3S-10
1.3
100
5
0.15
10000
500
L1M-1N5S-10
1.5
100
6
0.15
9500
500
L1M-1N6S-10
1.6
100
6
0.17
9000
500
L1M-1N8S-10
1.8
100
6
0.17
8500
500
L1M-2N0S-10
2.0
100
6
0.18
8300
500
L1M-2N2S-10
2.2
100
6
0.18
8000
500
L1M-2N4S-10
2.4
100
6
0.20
7800
500
L1M-2N7S-10
2.7
100
6
0.20
7500
500
L1M-3N0S-10
3.0
100
6
0.22
7200
400
L1M-3N3S-10
3.3
100
6
0.22
7000
400
L1M-3N6S-10
3.6
100
6
0.25
6800
400
L1M-3N9S-10
3.9
100
6
0.25
6500
400
L1M-4N3S-10
4.3
100
6
0.28
6300
400
L1M-4N7S-10
4.7
100
6
0.28
6000
400
L1M-5N1S-10
5.1
100
6
0.30
5800
400
L1M-5N6S-10
5.6
100
6
0.30
5700
400
L1M-6N2S-10
6.2
100
6
0.35
5600
400
L1M-6N8□-10
6.8
100
6
0.35
5500
400
Inductance
( nH )
Test
Frequency
( MHz )
Q
Min.
L1M-1N0S-10
1.0
100
L1M-1N1S-10
1.1
L1M-1N2S-10
Part Number
L1M-7N5□-10
7.5
100
6
0.38
5000
350
L1M-8N2□-10
8.2
100
6
0.38
5000
350
L1M-9N1□-10
9.1
100
6
0.42
4800
350
L1M-10N□-10
10
100
6
0.42
4700
350
L1M-12N□-10
12
100
6
0.47
4300
350
L1M-15N□-10
15
100
6
0.50
4000
300
L1M-18N□-10
18
100
6
0.60
4000
250
L1M-22N□-10
22
100
6
0.70
3500
200
L1M-27N□-10
27
100
6
0.80
3000
200
L1M-33N□-10
33
100
6
0.90
2500
200
L1M-39N□-10
39
100
6
1.00
2000
200
L1M-47N□-10
47
100
6
1.20
1800
200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
High Frequency Chip Inductor
L1M SERIES
5. ELECTRICAL CHARACTERISTICS :
DC Resistance
(Ω)
SRF
(MHz)
Rated Current
( mA )
Max.
Min.
Max.
6
1.30
1500
200
100
6
1.50
1400
150
82
100
6
1.80
1300
150
L1M-R10□-10
100
100
6
2.20
1100
100
L1M-R11□-10
110
100
6
2.70
1100
100
L1M-R12□-10
120
100
6
3.00
1100
100
Inductance
( nH )
Test
Frequency
( MHz )
Q
Min.
L1M-56N□-10
56
100
L1M-68N□-10
68
L1M-82N□-10
Part Number
□ : J = ±5% , K = ±10%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
High Frequency Chip Inductor
L1M SERIES
6. CHARACTERISTICS CURVES :
Inductance v.s. Frequency Characteristics
MGI1005F L VS Freq.
1000
INDUCTANCE(nH)
100n
100
33n
10n
10
4.7n
2.2n
1
1.0n
0.1
10
100
1000
10000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
MGI1005F Q VS Freq.
Q
100
10
33n
10n
4.7n
100n
2.2n
1.0n
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
High Frequency Chip Inductor
L1M SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Q Factor
Agilent E4991
Agilent4287
Agilent16192
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be some risk
Refer to standard electrical characteristics list
Inductance (Ls)
Temperature Rise Test
Solder Heat Resistance
Rated Current < 1A ΔT 20°C Max
1. Applied the allowed DC current.
Rated Current ≧ 1A ΔT 40°C Max
2. Temperature measured by digital surface thermometer.
No mechanical damage.
Remaining terminal electrode : 75% min.
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260± 5° C
Flux for lead free: ROL0
Dip Time : 10± 0.5sec.
Preheating
Dipping
260° C
150° C
Solderability
60
seconds
10± 0.5
seconds
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245± 5° C
Flux for lead free: ROL0
Dip Time : 4± 1sec.
More than 95% of the terminal electrode
should be covered with solder.
Preheating
Dipping
245° C
150° C
Terminal Strength
Natural
cooling
60
seconds
Natural
cooling
4± 1.0
seconds
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For L Series :
Size
Force (Kfg)
1
0.2
2
0.5
3
0.6
4
1.0
5
1.0
6
1.0
7
1.5
Time (sec)
> 30
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60
(+ 5) Sec.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
High Frequency Chip Inductor
L1M SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
Bending Strength
PERFORMANCE
TEST CONDITION
The ferrite should not be damaged by forces
applied on the right condition.
Series name
mm (inches)
P-Kgf
2
0.80 (0.033)
0.3
3
1.40 (0.055)
1.0
2.00 (0.079)
2.5
2.70 (0.106)
2.5
1.0(0.039)
R0.5(0.02)
4
5
Chip
6
A
7
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 15 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 15 min.
This cycle shall be performed 12 times in each of three
mutually perpendicular directions (Total 9hours).
Life testing at High
Temperature
Appearance : No damage.
Inductance : within± 10%of initial value.
Q : within± 20%of initial value.
Temperature : 105± 2° C
Applied Current : rated current
Duration : 1008± 12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity
Humidity : 90~95% RH.
Temperature : 60± 2° C
Duration : 504± 8hrs
Measured at room temperature after placing for 2 to 3hrs.
Thermal Shock
Appearance : No damage.
Inductance : within± 10%of initial value.
Q: within± 20%of initial value.
Low temperature storage test
Drop
Phase
Temperature (° C)
Times (min.)
1
-40± 2° C
30± 5
2
room temp.
≦ 0.5
3
+105± 2° C
30± 5
Measured : 500 times
Drop 10 times on a concrete floor from a
height of 75cm.
Condition for 1 cycle
Step1 : -40± 2° C 30± 5 min.
Step2 : +105± 2° C 30± 5 min.
Number of cycles : 500
Measured at room temperature after placing for 2 to 3hrs.
Temperature : -40± 2° C
Duration : 500± 8hrs
Measured at room temperature after placing for 2 to 3hrs.
a. No mechanical damage
b. Inductance change: Within ± 30%.
Derating
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85° C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
85
125
Operating
Temperature(?C)
Operating
Temperature(℃)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
High Frequency Chip Inductor
L1M SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
1.50
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
0.55
0.40
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow
soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If Use Wave soldering is there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be unwitting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.3 Soldering Iron :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature (max)
f) Limit soldering time to 4~5sec.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~150s
60~180s
25
4 80s max.
Preheating
TEMPERATURE ° C
TEMPERATURE ° C
Preheating
Within 4-5s
Natural
cooling
350
150
Time(sec.)
Figure 1. Re-flow Soldering : 3 times max
Soldering
O ve r 1min.
G rad ual
Cooling
Figure 2. Iron Soldering times：1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
High Frequency Chip Inductor
L1M SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
t
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
High Frequency Chip Inductor
L1M SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
C(mm)
D(mm)
Type
A(mm)
B(mm)
7" x 8mm
9.0± 0.5
60.0± 2.0
13.5± 0.5 178.0± 2.0
7" x 12mm
13.5± 0.5
60.0± 2.0
13.5± 0.5 178.0± 2.0
C
D
B
A
2± 0.5
7" x 8mm
13.5± 0.5
7" x 12mm
R10.5
R1.9
R0.5
120°
9-2 Tape Dimension / 8mm
Material of taping is paper
Po:4± 0.1
+0.1
-0.00
t
Bo
P
W:8.0± 0.3
D:1.50
F:3.5± 0.1
E:1.75± 0.1
P2:2± 0.1
Series
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
L
0
0.68± 0.05
0.38± 0.05
0.50max
2.0± 0.05
0.50max
none
Series
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
1
1.12± 0.03
0.62± 0.03
0.60± 0.03
2.0± 0.1
0.60± 0.03
none
2
1.85± 0.05
1.05± 0.05
0.95± 0.05
4.0± 0.1
0.95± 0.05
none
3(09)
2.30± 0.05
1.50± 0.05
0.95± 0.05
4.0± 0.1
0.95± 0.05
none
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
2
1.95± 0.10
1.05± 0.10
1.05± 0.10
4.0± 0.1
0.23± 0.05
none
3(09)
2.25± 0.10
1.42± 0.10
1.04± 0.10
4.0± 0.1
0.22± 0.05
1.0± 0.10
3(12)
2.35± 0.10
1.50± 0.10
1.45± 0.10
4.0± 0.1
0.22± 0.05
1.0± 0.10
4(11)
3.50± 0.10
1.88± 0.10
1.27± 0.10
4.0± 0.1
0.22± 0.05
1.0± 0.10
5
3.42± 0.10
2.77± 0.10
1.55± 0.10
4.0± 0.1
0.22± 0.05
1.0± 0.10
4(09)
3.40± 0.10
1.77± 0.10
1.04± 0.10
4.0± 0.1
0.22± 0.05
1.0± 0.10
Ko
Ao
Po:4± 0.1
+0.1
-0.05
t
Bo
P
W:8.0± 0.1
D:1.56
F:3.5± 0.1
E:1.75± 0.1
P2:2± 0.1
L
Ko
Ao
Material of taping is plastic
Po:4± 0.1
D:1.5+0.1
t
Series
P
A
D1:1± 0.1
Ao
Bo
W:8.0± 0.1
A
F:3.5± 0.05
E:1.75± 0.1
P2:2± 0.05
Ko
Section A-A
L
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
High Frequency Chip Inductor
L1M SERIES
9-2.1 Tape Dimension / 12mm
Po:4± 0.1
P2:2± 0.05
t
A
P
A
Ao
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
6
4.95± 0.1
1.93± 0.1
1.93± 0.1
4.0± 0.1
0.24± 0.05
1.5± 0.1
7
4.95± 0.1
3.66± 0.1
1.85± 0.1
8.0± 0.1
0.24± 0.05
1.5± 0.1
L
Bo
W:12.0± 0.1
Series
F:5.5± 0.05
E:1.75± 0.1
D:1.5+0.1
Ko
Section A-A
D1:1.5± 0.1
9-3. Packaging Quantity
Chip Size
7
6
5
4(11)
4(09)
3(12)
3(09)
2
1
0
Chip / Reel
1000
2000
2500
3000
3000
2000
4000
4000
10000
15000
Inner Box
4000
8000
12500
15000
15000
10000
20000
20000
50000
75000
Middle Box
20000
40000
62500
75000
75000
50000
100000
100000
250000
375000
Carton
40000
80000
125000
150000
150000
100000
200000
200000
500000
750000
Bulk (Bags)
12000
20000
30000
50000
50000
100000
150000
200000
300000
-
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(° C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : -10~ 40° C and 30~70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10