TSP1-FF1608H6-N2P2 0603 Package Chip LED (0.6mm Height)

0603 Package Chip LED
(0.6mm Height)
TSP1-FF1608H6-N2P2
0603 Package Chip LED (0.6mm Height)
Features
• Package in 8mm tape on 7" diameter reel
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow
solder process
• Mono-color type
• Pb-free
Applications
•
•
•
•
•
Automotive: Backlighting in dashboard and switch
Telecommunication: indicator and backlighting in telephone and fax
Flat backlight for LCD, switch and symbol
General use
Indoor signboard use
QSLP1FF1
Descriptions
• The TSP1 SMD LED is much smaller than lead frame type components, thus enable smaller board
size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
• Besides, lightweight makes them ideal for miniature applications. etc.
Quick Device Selection
Chip
Part No.
TSP1-FF1608H6-N2P2
Material
Emitted Color
AlGaInP
Brilliant Yellow Green
TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com
Tel: (800)-247-2232 (800)-TAITRON (661)-257-6060
Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415
Lens Color
Water Clear
Rev. A/JG 2006-02-22
Page 1 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Absolute Maximum Ratings (Tamb=25°C)
Parameter
Symbol
Value
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
Operating Temperature
Topr
-40 ~ +85
°C
Storage Temperature
Tstg
-40 ~ +90
°C
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
60
mA
Electrostatic Discharge (HBM)
ESD
2000
V
Pd
60
mW
Tsol
260 (for 5 seconds)
°C
Power Dissipation
Soldering Temperature
Electro-Optical Characteristics (Tamb=25°C)
Parameter
Symbol
Min.
Typ.
Max.
Unit
IV
36.0
-----
72.0
mcd
2θ1/2
-----
120
-----
deg
Peak Wavelength
λp
-----
575
-----
nm
Dominant wavelength
λd
567.5
-----
575.5
nm
Spectrum Radiation Bandwidth
△λ
-----
20
-----
nm
Forward Voltage
VF
1.75
-----
2.35
V
Reverse Current
IR
-----
-----
10
µA
Luminous Intensity
Viewing Angle
Condition
IF =20mA
VR=5V
Notes:
1. Tolerance of Luminous Intensity ±10%
2. Tolerance of Dominant Wavelength ±1nm
3. Tolerance of Forward Voltage ±0.1V
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 2 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Typical Electro-Optical Characteristics Curves
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 3 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Reliability Test Items and Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
No.
Items
Test Condition
Test Hours /
Cycles
Sample
Size
Ac/Re
Temp.: 260°C ±5°C
Min. 5sec.
6 Min.
22 PCS.
0/1
1
Reflow Soldering
2
Temperature Cycle
H: +100°C 15min
∫ 5 min
L: -40°C 15min
300 Cycles
22 PCS.
0/1
3
Thermal Shock
H: +100°C 5min
∫ 10 sec
L: -10°C 5min
300 Cycles
22 PCS.
0/1
4
High Temperature Storage
Temp: 100°C
1000 Hrs.
22 PCS.
0/1
5
Low Temperature Storage
Temp: -40°C
1000 Hrs.
22 PCS.
0/1
6
DC Operating Life
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
7
High Temperature / High Humidity
85°C / 85%RH
1000 Hrs.
22 PCS.
0/1
Rev. A/JG 2006-02-22
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Page 4 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Package Dimensions (In mm)
-
+
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 5 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Carrier Tape Dimensions:
Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm, Unit = mm
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 6 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Ordering Information
TS P 1- F F 1608
H6 –N2P2 -92-TR70
Lead Free Tape & Reel
7=7˝ reel 0=3k per reel
Factory location code
Code of luminous Range
Height <=0.6mm
Size in mm
Flat top
Brilliant Yellow Green
Concave (Dipping Type)
PCB Type
Taitron SMD LED
Bin Range of Dom. Wavelength
Bin
Min
Max
C15
567.5
569.5
C16
569.5
571.5
C17
571.5
573.5
C18
573.5
575.5
Unit
Condition
nm
IF=20mA
Bin Range of Luminous Intensity
Bin
Min
Max
N2
36.0
45.0
P1
45.0
57.0
P2
57.0
72.0
Unit
Condition
mcd
IF=20mA
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 7 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
Bin Range of Forward Voltage
Bin
Min
Max
0
1.75
1.95
1
1.95
2.15
2
2.15
2.35
Unit
Condition
V
IF=5mA
Notes:
1. Tolerance of Luminous Intensity ±10%
2. Tolerance of Dominant Wavelength ±1nm
3. Tolerance of Forward Voltage ±0.1V
Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big current
change (Burn out will happen).
2. Storage
2.1 Do not open moisture proofs bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30°C or less and 90% RH or less.
2.3 The LEDs should be used within a year.
2.4 After opening the package, The LEDs should be kept at 30°C or less and 70% RH or less.
2.5 The LEDs should be used within 168 hours (7 days) after opening the package.
2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions. Baking
treatment: 60±5°C for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile.
Rev. A/JG 2006-02-22
www.taitroncomponents.com
Page 8 of 9
0603 Package Chip LED (0.6mm Height)
TSP1-FF1608H6-N2P2
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4. Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 280°C for 3 seconds
within. Once in less than the soldering iron capacity 25W, leave two seconds and more intervals,
and do soldering of each terminal. Be careful because the damage of the product is often started
at the time of the hand solder.
5. Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand
whether the characteristics of the LEDs will or will not be damaged by repairing.
How to contact us:
US HEADQUARTERS
28040 WEST HARRISON PARKAWAY, VALENCIA, CA 91355-4162
Tel: (800) TAITRON (800) 247-2232 (661) 257-6060
Fax: (800) TAITFAX (800) 824-8329 (661) 257-6415
Email: [email protected]
Http://www.taitroncomponents.com
TAITRON COMPONENTS MEXICO, S.A .DE C.V.
BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO
C.P. 42970 MEXICO
Tel: +52-55-5560-1519
Fax: +52-55-5560-2190
TAITRON COMPONETS INCORPORATED E REPRESENTAÇÕES DO BRASIL LTDA
RUA DOMINGOS DE MORAIS, 2777, 2.ANDAR, SALA 24 SAÚDE - SÃO PAULO-SP 04035-001
BRAZIL
Tel: +55-11-5574-7949
Fax: +55-11-5572-0052
TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE
CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, 200030, CHINA
Tel: +86-21-54249942
Fax: +86-21-5424-9931
Rev. A/JG 2006-02-22
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Page 9 of 9