CBM0805 - Taitron Components, Inc.

Multilayer Chip Bead
CBM0805
RC0201
RC0201
RC0201
Multilayer Chip Bead
Features





Effective EMI protection
Low DC resistance
High soldering heat resistance
Multiple size availability
RoHS compliant
Applications






Computers and Peripheral Equipment
VCRS, Television
Cellular Phones
Digital Communication Equipment
Various Electronics Equipments
Circuit Where a Stable Ground is Unavailable
Constructions
Item
Material
①
Ferrite Substance
(NiO-CuO-ZnO-Ferrite)
②
Silver Electrode
③
Electrode
(Ag/Cu/Ni/Sn)
TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com
Tel: (800)-TAITRON
Fax: (800)-TAITFAX
(800)-824-8766
(800)-824-8329
(661)-257-6060
(661)-257-6415
Rev. A/CW
Page 1 of 8
Multilayer Chip Bead
CBM0805
Dimensions
Unit: mm
Type
Size
Inch (mm)
A
B
C
D
Weight (g)
(1,000pcs)
CBM0805
0805(2012)
2.0±0.20
1.25±0.20
0.9±0.20
0.2~0.8
10
Electrical Specifications
CBM0805 Type:
Impedance
(Ω)
Tolerance
Test Freq.
(MHz)
DCR
(Ω) max.
Rated Current
(mA) max.
5
7
9
10
11
12
15
17
19
22
26
28
30
31
32
33
39
40
42
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
Rev. A/CW
www.taitroncomponents.com
Page 2 of 8
Multilayer Chip Bead
CBM0805
Impedance
(Ω)
Tolerance
Test Freq.
(MHz)
DCR
(Ω) max.
Rated Current
(mA) max.
47
50
52
56
60
70
75
80
90
95
100
120
150
180
200
220
240
300
330
400
420
430
450
470
500
600
680
750
1000
1200
1500
2000
2200
2500
2700
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
±25%
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.1
0.1
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.25
0.25
0.25
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.4
0.4
0.4
0.4
0.4
0.4
0.5
0.5
0.6
0.6
0.7
0.7
0.7
0.7
500
500
500
500
500
500
500
500
500
500
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
200
200
200
200
200
200
200
200
Rev. A/CW
www.taitroncomponents.com
Page 3 of 8
Multilayer Chip Bead
CBM0805
Environment Characteristics
Electrical Characteristic Test
Test Item
Test Condition
Impedance
HP4291B
DCR
Agilent 34401A
Requirement
Refer to standard electrical spec.
Mechanical Characteristic Test
Test Item
Test Condition
Requirement
Test device shall be soldered on the substrate
Substrate Dimension:100x40x1.6mm
Deflection: 2.0mm
Keeping Time: 30sec
Flexure Strength
The forces applied on the right conditions must
not damage the terminal electrode and the ferrite
Vibration
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1min
Amplitude : 1.5mm
Time : 2hrs for each axis (X,Y&Z), total 6hrs
Resistance to
Soldering Heat
Pre-heating: 150°C, 1min
Solder Temperature: 260±5°C
Immersion Time: 10±1sec
Solderability
Pre-heating: 150°C, 1min
Solder Temperature: 245±5°C
Immersion Time: 4±1sec
Test device shall be soldered on the substrate
The electrodes shall be at least 90%
covered with new solder coating
≥1.0kg
Terminal Strength Test
Temperature Cycle
Appearance: No damage
More than 75% of the terminal
electrode should be covered with solder
Impedance: within ±30% of initial value
One cycle:
One cycle/step1: -55±3°C for 30min
step2: 25±2°C for 3.0min
step3:125±3°C for 30min
step4:25±2°C for 3.0min
Total: 100cycles
Measured after exposure in the room condition for
24hrs
Appearance: No damage
Impedance: within±30% of initial value
Rev. A/CW
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Page 4 of 8
Multilayer Chip Bead
CBM0805
Test Item
Test Condition
Requirement
Temperature: 40±2°C
Relative Humidity: 90 ~ 95% time: 1000hrs
Measured after exposure in the room condition for
24hrs
Temperature: 125±3°C
Relative Humidity : 0%
Applied Current: Rated Current time: 1000hrs
Measured after exposure in the room condition for
24hrs
Temperature: -55±3°C
TR elative Humidity : 0% time: 1000hrs
Measured after exposure in the room condition for
24hrs
Humidity Resistance
High Temperature
Resistance
Low Temperature
Resistance
Appearance: No damage
Impedance: within±30% of initial value
■ Operating Temperature: -55°C ~ 125°C
■ Storage Temperature: 25±3°C; Humidity < 80%RH
Packing Information:
Carrier Tape Dimensions
Unit: mm
Type
A
B
T
W
P
F
K
CBM0805
1.42
2.25
1.04
8.0
4.0
3.5
0.22
Rev. A/CW
www.taitroncomponents.com
Page 5 of 8
Multilayer Chip Bead
CBM0805
Reel Dimensions
Unit: mm
Type
A
B
C
D
Quantity
(EA)
CBM0805
178
60
10
2
4,000
Recommended Pattern
Unit: mm
Type
A
B
C
CBM0805
1.2
3.0~4.0
1.0
Rev. A/CW
www.taitroncomponents.com
Page 6 of 8
Multilayer Chip Bead
CBM0805
How to Order
CBM 0805 J 150 - xx -TR70
Packing Code
TR70:7” Reel, RoHS
Factory Location Code
Impedance Code:
150: 15Ω;
J: Material Code
Size Code in inch(mm)
0805(2012)
Taitron Multilayer Chip Bead
Rev. A/CW
www.taitroncomponents.com
Page 7 of 8
Multilayer Chip Bead
CBM0805
How to contact us
US HEADQUARTERS
28040 WEST HARRISON PARKWAY, VALENCIA, CA 91355-4162
Tel: (800)-TAITRON (800)-824-8766 (661)-257-6060
Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415
Email: taitron@taitroncomponents.com
Http://www.taitroncomponents.com
TAITRON COMPONENTS MEXICO, S.A .DE C.V.
BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO
C.P. 42970 MEXICO
Tel: +52-55-5560-1519
Fax: +52-55-5560-2190
TAITRON COMPONENTS INCORPORATED TAIWAN, TAIPEI
6F., No.190, Sec. 2, Zhongxing Rd., Xindian Dist., New Taipei City 23146, Taiwan R.O.C.
Tel: 886-2-2913-6238
Fax: 886-2-2913-6239
TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE
METROBANK PLAZA,1160 WEST YAN’AN ROAD, SUITE 1503, SHANGHAI,200052, CHINA
Tel: +86-21-5424-9942
Fax: +86-21-5424-9931
CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, 200030, CHINA
Tel: +86-21-5424-9942
Fax: +86-21-5424-9931
Rev. A/CW
www.taitroncomponents.com
Page 8 of 8