PRELIMINARY
W199
Spread Spectrum FTG for VIA Apollo Pro-133
Features
Table 1. Mode Input Table
• Maximized EMI suppression using Cypress’s Spread
Spectrum Technology
• Single-chip system frequency synthesizer for VIA
Apollo Pro-133
• Two copies of CPU output
• Six copies of PCI output
• One 48-MHz output for USB
• One 24-MHz output for SIO
• Two buffered reference outputs
• One IOAPIC output
• 13 SDRAM outputs provide support for 3 DIMMs
• Supports frequencies up to 150 MHz
• I2C™ interface for programming
• Power management control inputs
• Available in 48-pin SSOP
Key Specifications
CPU Cycle-to-Cycle Jitter: ......................................... 250 ps
Mode
Pin 2
0
PCI_STOP#
1
REF0
Table 2. Pin Selectable Frequency
Input Address
FS3
FS2
FS1
FS0
CPU_F,
CPU1 (MHz)
PCI_F, 1:5
(MHz)
1
1
1
1
133.3
33.3 (CPU/4)
1
1
1
0
124
31 (CPU/4)
1
1
0
1
150
37.5 (CPU/4)
1
1
0
0
140
35 (CPU/4)
1
0
1
1
105
35 (CPU/3)
1
0
1
0
110
36.7 (CPU/3)
1
0
0
1
115
38.3 (CPU/3)
1
0
0
0
120
40 (CPU/3)
0
1
1
1
100
33.3 (CPU/3)
0
1
1
0
133.3
44.43 (CPU/3)
0
1
0
1
112
37.3 (CPU/3)
PCI to PCI Output Skew: ............................................ 500 ps
0
1
0
0
103
34.3 (CPU/3)
VDDQ3: .................................................................... 3.3V±5%
0
0
1
1
66.8
33.4 (CPU/2)
VDDQ2: .................................................................... 2.5V±5%
0
0
1
0
83.3
41.7 (CPU/2)
SDRAMIN to SDRAM0:11 Delay: ..........................3.7 ns typ.
0
0
0
1
75
37.5 (CPU/2)
SDRAM0:11 (leads) to SDRAM_F Skew: ..............0.4 ns typ.
0
0
0
0
124
41.3 (CPU/3)
CPU to CPU Output Skew: ........................................ 175 ps
[1]
Logic Block Diagram
Pin Configuration
VDDQ3
REF0/(PCI_STOP#)
X1
X2
REF1/FS2
XTAL
OSC
PLL Ref Freq
VDDQ2
Stop
Clock
Control
I/O Pin
Control
IOAPIC
VDDQ2
Stop
Clock
Control
PLL 1
CPU1
CPU_F
÷2,3,4
VDDQ3
PCI_F/MODE
PCI1/FS3
PCI2
Stop
Clock
Control
PCI3
PCI4
SDATA
SCLK
I2C
Logic
{
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
W199
CLK_STOP#
VDDQ3
REF0/(PCI_STOP#)
GND
X1
X2
VDDQ3
PCI_F/MODE
PCI1/FS3
GND
PCI2
PCI3
PCI4
PCI5
VDDQ3
SDRAMIN
GND
SDRAM11
SDRAM10
VDDQ3
SDRAM9
SDRAM8
GND
SDATA
I2 C
SCLK
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VDDQ2
IOAPIC
REF1/FS2*
GND
CPU_F
CPU1
VDDQ2
CLK_STOP#
SDRAM_F
GND
SDRAM0
SDRAM1
VDDQ3
SDRAM2
SDRAM3
GND
SDRAM4
SDRAM5
VDDQ3
SDRAM6
SDRAM7
VDDQ3
48MHz/FS0*
24MHz/FS1*
PCI5
VDDQ3
48MHz/FS0
PLL2
÷2
SDRAMIN
24MHz/FS1
VDDQ3
SDRAM0:11
Stop
Clock
Control
12
SDRAM_F
2
I C is a trademark of Philips Corporation.
Note:
1. Internal pull-up resistors should not be relied upon for setting I/O pins HIGH. Pin function with parentheses determined by MODE pin resistor strapping.
Unlike other I/O pins, input FS3 has an internal pull-down resistor.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134 •
408-943-2600
October 19, 1999, rev. **
PRELIMINARY
W199
Pin Definitions
Pin No.
Pin
Type
CPU_F
44
O
Free-running CPU Clock: Output voltage swing is controlled by the voltage applied to
VDDQ2. See Tables 2 and 6 for detailed frequency information.
CPU1
43
O
CPU Clock Output 1: This CPU clock output is controlled by the CLK_STOP# control
pin. Output voltage swing is controlled by voltage applied to VDDQ2.
PCI2:5
10, 11, 12,
13
O
PCI Clock Outputs 2 through 5: These four PCI clock outputs are controlled by the
PCI_STOP# control pin. Output voltage swing is controlled by voltage applied to VDDQ3.
PCI1/FS3
8
I/O
Fixed PCI Clock Output: As an output. frequency is set by the FS0:3 inputs or through
serial input interface, see Tables 2 and 6. This output is affected by the PCI_STOP#
input. When an input, latches data selecting the frequency of the CPU and PCI outputs.
PCI_F/MODE
7
I/O
Fixed PCI Clock Output: As an output, frequency is set by the FS0:3 inputs or through
serial input interface, see Tables 2 and 6. This output is not affected by the PCI_STOP#
input. When an input, sets function of pin 2.
CLK_STOP#
41
I
CLK_STOP# Input: When brought LOW, affected clock outputs are stopped LOW after
completing a full clock cycle (2–3 CPU clock latency). When brought HIGH, affected
clock outputs start, beginning with a full clock cycle (2–3 CPU clock latency).
IOAPIC
47
O
IOAPIC Clock Output: Provides 14.318-MHz fixed frequency. The output voltage swing
is controlled by VDDQ2. This output is disabled when CLK_STOP# is set LOW.
48MHz/FS0
26
I/O
48-MHz Output: 48 MHz is provided in normal operation. In standard systems, this
output can be used as the reference for the Universal Serial Bus. Upon power-up FS0
input will be latched, which will set clock frequencies as described in Table 2.
24MHz/FS1
25
I/O
24-MHz Output: 24 MHz is provided in normal operation. In standard systems, this
output can be used as the clock input for a Super I/O chip. Upon power-up FS1 input will
be latched, which will set clock frequencies as described in Table 2.
REF1/FS2
46
I/O
I/O Dual-Function REF0 and FS2 pin: Upon power-up, FS2 input will be latched which
will set clock frequencies as described in Table 2. When an output, this pin provides a
fixed clock signal equal in frequency to the reference signal provided at the X1/X2 pins.
REF0/
(PCI_STOP#)
2
I/O
Fixed 14.318-MHz Output 0 or PCI_STOP# Pin: Function determined by MODE pin.
The PCI_STOP# input enables the PCI 1:5 outputs when HIGH and causes them to
remain at logic 0 when LOW. The PCI_STOP signal is latched on the rising edge of
PCI_F. Its effects take place on the next PCI_F clock cycle. When an output, this pin
provides a fixed clock signal equal in frequency to the reference signal provided at the
X1/X2 pins.
SDRAMIN
15
I
Buffered Input Pin: The signal provided to this input pin is buffered to 13 outputs
(SDRAM0:11, SDRAM_F).
38, 37, 35,
34, 32, 31,
29, 28, 21,
20, 18, 17
O
Buffered Outputs: These twelve dedicated outputs provide copies of the signal provided at the SDRAMIN input. The swing is set by VDDQ3, and they are deactivated when
CLK_STOP# input is set LOW.
SDRAM_F
40
O
Free-running Buffered Output: This dedicated output provides a copy of the SDRAMIN
input which is not affected by the CLK_STOP# input
SCLK
24
I
Clock pin for I2C circuitry.
SDATA
23
I/O
Data pin for I2C circuitry.
X1
4
I
Crystal Connection or External Reference Frequency Input: This pin has dual functions. It can be used as an external 14.318-MHz crystal connection or as an external
reference frequency input.
X2
5
I
Crystal Connection: An input connection for an external 14.318-MHz crystal. If using
an external reference, this pin must be left unconnected.
VDDQ3
1, 6, 14, 19,
27, 30, 36
P
Power Connection: Power supply for core logic, PLL circuitry, SDRAM outputs, PCI
outputs, reference outputs, 48-MHz output, and 24-MHz output. Connect to 3.3V supply
VDDQ2
42, 48
P
Power Connection: Power supply for IOAPIC, CPU_F, and CPU1 output buffers. Connect to 2.5V or 3.3V.
3, 9, 16, 22,
33, 39, 45
G
Ground Connections: Connect all ground pins to the common system ground plane.
Pin Name
SDRAM0:11
GND
Pin Description
2
PRELIMINARY
W199
Upon W199 power-up, the first 2 ms of operation is used for
input logic selection. During this period, the five I/O pins (7, 8,
25, 26, 46) are three-stated, allowing the output strapping resistor on the l/O pins to pull the pins and their associated capacitive clock load to either a logic HIGH or LOW state. At the
end of the 2-ms period, the established logic “0” or “1” condition of the l/O pin is latched. Next the output buffer is enabled,
converting the l/O pins into operating clock outputs. The 2-ms
timer starts when VDD reaches 2.0V. The input bits can only
be reset by turning VDD off and then back on again.
Overview
The W199 was developed as a single-chip device to meet the
clocking needs of the VIA Apollo Pro-133 core logic chip set.
In addition to the typical outputs provided by standard
100-MHz FTGs, the W199 adds a thirteenth output buffer, supporting SDRAM DIMM modules in conjunction with the
chipset.
Cypress’s proprietary spread spectrum frequency synthesis
technique is a feature of the CPU and PCI outputs. When enabled, this feature reduces the peak EMI measurements of not
only the output signals and their harmonics, but also of any
other clock signals that are properly synchronized to them.
It should be noted that the strapping resistors have no significant effect on clock output signal integrity. The drive impedance of clock outputs is <40Ω (nominal), which is minimally
affected by the 10-kΩ strap to ground or VDD. As with the series termination resistor, the output strapping resistor should
be placed as close to the l/O pin as possible in order to keep
the interconnecting trace short. The trace from the resistor to
ground or VDD should be kept less than two inches in length to
minimize system noise coupling during input logic sampling.
Functional Description
I/O Pin Operation
Pins 7, 8, 25, 26, are 46 are dual-purpose l/O pins. Upon power-up these pins act as logic inputs, allowing the determination
of assigned device functions. A short time after power-up, the
logic state of each pin is latched and the pins become clock
outputs. This feature reduces device pin count by combining
clock outputs with input select pins.
When the clock outputs are enabled following the 2-ms input
period, the corresponding specified output frequency is delivered on the pin, assuming that VDD has stabilized. If VDD has
not yet reached full value, output frequency initially may be
below target but will increase to target once VDD voltage has
stabilized. In either case, a short output clock cycle may be
produced from the CPU clock outputs when the outputs are
enabled.
An external 10-kΩ “strapping” resistor is connected between
the l/O pin and ground or VDD. Connection to ground sets a
latch to “0,” connection to VDD sets a latch to “1.” Figure 1 and
Figure 2 show two suggested methods for strapping resistor
connections.
VDD
O utput S trapping R esistor
S eries Term ination Resistor
10 kΩ
(Load O ption 1)
W199
Power-on
Reset
Timer
Clock Load
Output
Buffer
Hold
Output
Low
Output Three-state
Q
10 kΩ
(Load O ption 0)
D
Data
Latch
Figure 1. Input Logic Selection Through Resistor Load Option
Jumper Options
Output Strapping Resistor
V DD
Series Termination Resistor
10 kΩ
W199
Power-on
Reset
Timer
R
Output
Buffer
Q
Resistor Value R
Hold
Output
Low
Output Three-state
D
Data
Latch
Figure 2. Input Logic Selection Through Jumper Option
3
Clock Load
PRELIMINARY
W199
Spread Spectrum Frequency Timing Generator
Where P is the percentage of deviation and F is the frequency
in MHz where the reduction is measured.
The device generates a clock that is frequency modulated in
order to increase the bandwidth that it occupies. By increasing
the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure 3.
The output clock is modulated with a waveform depicted in
Figure 4. This waveform, as discussed in “Spread Spectrum
Clock Generation for the Reduction of Radiated Emissions” by
Bush, Fessler, and Hardin produces the maximum reduction
in the amplitude of radiated electromagnetic emissions. The
deviation selected for this chip is specified in Table 7. Figure 4
details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact
your local Sales representative for details on these devices.
As shown in Figure 3, a harmonic of a modulated clock has a
much lower amplitude than that of an unmodulated signal. The
reduction in amplitude is dependent on the harmonic number
and the frequency deviation or spread. The equation for the
reduction is
Spread Spectrum clocking is activated or deactivated by selecting the appropriate values for bits 1–0 in data byte 0 of the
I2C data stream. Refer to Table 7 for more details.
dB = 6.5 + 9*log10(P) + 9*log10(F)
EMI Reduction
Spread
Spectrum
Enabled
NonSpread
Spectrum
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation
MIN (–5%)
Figure 4. Typical Modulation Profile
4
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
FREQUENCY
MAX (0%)
PRELIMINARY
W199
chipset. Clock device register changes are normally made
upon system initialization, if any are required. The interface
can also be used during system operation for power management functions. Table 3 summarizes the control functions of
the serial data interface.
Serial Data Interface
The W199 features a two-pin, serial data interface that can be
used to configure internal register settings that control particular device functions. Upon power-up, the W199 initializes with
default register settings, therefore the use of this serial data
interface is optional. The serial interface is write-only (to the
clock chip) and is the dedicated function of device pins SDATA
and SCLOCK. In motherboard applications, SDATA and
SCLOCK are typically driven by two logic outputs of the
Operation
Data is written to the W199 in eleven bytes of eight bits each.
Bytes are written in the order shown in Table 4.
Table 3. Serial Data Interface Control Functions Summary
Control Function
Description
Common Application
Clock Output Disable
Any individual clock output(s) can be disabled.
Disabled outputs are actively held LOW.
Unused outputs are disabled to reduce EMI
and system power. Examples are clock
outputs to unused PCI slots.
CPU Clock Frequency
Selection
Provides CPU/PCI frequency selections through
software. Frequency is changed in a smooth and
controlled fashion.
For alternate microprocessors and power
management options. Smooth frequency
transition allows CPU frequency change
under normal system operation.
Spread Spectrum
Enabling
Enables or disables spread spectrum clocking.
For EMI reduction.
Output Three-state
Puts clock output into a high-impedance state.
Production PCB testing.
(Reserved)
Reserved function for future device revision or
production device testing.
No user application. Register bit must be
written as 0.
Table 4. Byte Writing Sequence
Byte
Sequence
Byte Name
Bit Sequence
Byte Description
1
Slave Address
11010010
Commands the W199 to accept the bits in Data Bytes 0–6 for internal
register configuration. Since other devices may exist on the same common serial data bus, it is necessary to have a specific slave address for
each potential receiver. The slave receiver address for the W199 is
11010010. Register setting will not be made if the Slave Address is not
correct (or is for an alternate slave receiver).
2
Command Code
Don’t Care
Unused by the W199, therefore bit values are ignored (“don’t care”).
This byte must be included in the data write sequence to maintain
proper byte allocation. The Command Code Byte is part of the standard
serial communication protocol and may be used when writing to another addressed slave receiver on the serial data bus.
3
Byte Count
Don’t Care
Unused by the W199, therefore bit values are ignored (“don’t care”).
This byte must be included in the data write sequence to maintain
proper byte allocation. The Byte Count Byte is part of the standard
serial communication protocol and may be used when writing to another addressed slave receiver on the serial data bus.
4
Data Byte 0
Refer to Table 5
5
Data Byte 1
6
Data Byte 2
The data bits in Data Bytes 0–7 set internal W199 registers that control
device operation. The data bits are only accepted when the Address
Byte bit sequence is 11010010, as noted above. For description of bit
control functions, refer to Table 5, Data Byte Serial Configuration Map.
7
Data Byte 3
8
Data Byte 4
9
Data Byte 5
10
Data Byte 6
11
Data Byte 7
5
PRELIMINARY
W199
Table 6 details additional frequency selections that are available through the serial data interface.
Writing Data Bytes
Each bit in Data Bytes 0–7 control a particular device function
except for the “reserved” bits which must be written as a logic
0. Bits are written MSB (most significant bit) first, which is bit 7.
Table 5 gives the bit formats for registers located in Data Bytes
0–7.
Table 7 details the select functions for Byte 0, bits 1 and 0.
Table 5. Data Bytes 0–7 Serial Configuration Map
Affected Pin
Bit(s)
Pin No.
Bit Control
Pin Name
Control Function
0
1
Default
--
--
0
Data Byte 0
7
--
--
(Reserved)
6
--
--
SEL_2
See Table 6
0
5
--
--
SEL_1
See Table 6
0
4
--
--
SEL_0
See Table 6
0
3
--
--
Hardware/Software Frequency Select
SEL3
Hardware
Software
2
--
--
1–0
--
--
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
40
SDRAM_F
Low
Active
1
2
--
--
--
--
0
1
43
CPU1
Clock Output Disable
Low
Active
1
0
44
CPU_F
Clock Output Disable
Low
Active
1
--
--
--
--
0
6
7
PCI_F
Low
Active
1
5
--
--
--
--
0
4
13
PCI5
Clock Output Disable
Low
Active
1
3
12
PCI4
Clock Output Disable
Low
Active
1
2
11
PCI3
Clock Output Disable
Low
Active
1
1
10
PCI2
Clock Output Disable
Low
Active
1
0
8
PCI1
Clock Output Disable
Low
Active
1
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
26
48MHz
Clock Output Disable
Low
Active
1
4
25
24MHz
Clock Output Disable
Low
Active
1
3
--
--
--
--
0
Bit 1
0
0
1
1
See Table 6
0
Bit 0
0
1
0
1
0
00
Function (See Table 7 for function details)
Spread Spectrum Off (default)
(Reserved)
Spread Spectrum On
All Outputs Three-stated
Data Byte 1
Clock Output Disable
(Reserved)
Data Byte 2
7
(Reserved)
Clock Output Disable
(Reserved)
Data Byte 3
(Reserved)
6
PRELIMINARY
W199
Table 5. Data Bytes 0–7 Serial Configuration Map (continued)
Affected Pin
Bit(s)
Pin No.
Pin Name
2
21, 20,
18, 17
SDRAM8:11
1
32, 31,
29, 28
0
38, 37,
35, 34
Bit Control
Control Function
0
1
Default
Clock Output Disable
Low
Active
1
SDRAM4:7
Clock Output Disable
Low
Active
1
SDRAM0:3
Clock Output Disable
Low
Active
1
Data Byte 4
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
(Reserved)
Data Byte 5
5
--
--
4
47
IOAPIC
--
--
0
Low
Active
1
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
46
REF1
Clock Output Disable
0
2
REF0
Clock Output Disable
Low
Active
1
Low
Active
1
7
--
--
6
--
--
(Reserved)
--
--
0
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
3
--
--
(Reserved)
--
--
0
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
--
--
(Reserved)
--
--
0
0
--
--
(Reserved)
--
--
0
Clock Output Disable
Data Byte 6
Data Byte 7
7
PRELIMINARY
W199
Table 6. Additional Frequency Selections through Serial Data Interface Data Bytes
Input Conditions
Output Frequency
Data Byte 0, Bit 3 = 1
Bit 2
SEL_3
Bit 6
SEL_2
Bit 5
SEL_1
Bit 4
SEL_0
CPU, SDRAM
Clocks (MHz)
PCI Clocks
(MHz)
1
1
1
1
133.3
33.3 (CPU/4)
1
1
1
0
124
31 (CPU/4)
1
1
0
1
150
37.5 (CPU/4)
1
1
0
0
140
35 (CPU/4)
1
0
1
1
105
35 (CPU/3)
1
0
1
0
110
36.7 (CPU/3)
1
0
0
1
115
39.3 (CPU/3)
1
0
0
0
120
40 (CPU/3)
0
1
1
1
100
33.3 (CPU/3)
0
1
1
0
133
44.3 (CPU/3)
0
1
0
1
112
37.3 (CPU/3)
0
1
0
0
103
34.3 (CPU/3)
0
0
1
1
66.8
33.4 (CPU/2)
0
0
1
0
83.3
41.7 (CPU/2)
0
0
0
1
75
37.5 (CPU/2)
0
0
0
0
124
41.3 (CPU/3)
Table 7. Select Function for Data Byte 0, Bits 0:1
Input Conditions
Data Byte 0
Output Conditions
CPU_F,
CPU1
PCI_F,
PCI1:5
REF0:1,
IOAPIC
–0.5%
–0.5%
14.318 MHz
48 MHz
24 MHz
Note 2
Note 2
14.318 MHz
48 MHz
24 MHz
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Function
Bit 1
Bit 0
Spread Spectrum On
1
0
Spread Spectrum Off
(default)
0
0
Three-state
1
1
Hi-Z
Note:
2. CPU and PCI frequency selections are listed in Table 2 and Table 6.
8
48MHZ
24MHZ
PRELIMINARY
W199
Absolute Maximum Ratings
above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability.
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
.
Parameter
Description
Rating
Unit
VDD, VIN
Voltage on any pin with respect to GND
–0.5 to +7.0
V
TSTG
Storage Temperature
–65 to +150
°C
TB
Ambient Temperature under Bias
–55 to +125
°C
TA
Operating Temperature
0 to +70
°C
ESDPROT
Input ESD Protection
2 (min)
kV
DC Electrical Characteristics: TA = 0°C to +70°C; VDDQ3 = 3.3V±5%; VDDQ2 = 2.5V±5%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
IDD
3.3V Supply Current
CPU_F: CPU1 = 100 MHz
Outputs Loaded[3]
260
mA
IDD
2.5V Supply Current
CPU_F: CPU1 = 100 MHz
Outputs Loaded[3]
25
mA
Logic Inputs
VIL
Input Low Voltage
GND – 0.3
0.8
V
VIH
Input High Voltage
2.0
VDDQ3 +
0.3
V
IIL
Input Low Current[4]
–25
µA
IIH
Input High Current[4]
10
µA
50
mV
Clock Outputs
VOL
Output Low Voltage
IOL = 1 mA
VOH
Output High Voltage
IOH = 1 mA
3.1
V
VOH
Output High Voltage
CPU_F:1, IOAPIC
IOH = –1 mA
2.2
V
IOL
Output Low Current
CPU_F, CPU1
VOL = 1.25V
27
57
97
mA
PCI_F, PCI1:5
VOL = 1.5V
20.5
53
139
mA
IOAPIC
VOL = 1.25V
40
85
140
mA
REF0:1
VOL = 1.5V
25
37
76
mA
48-MHz
VOL = 1.5V
25
37
76
mA
IOH
Output High Current
24-MHz
VOL = 1.5V
25
37
76
mA
CPU_F, CPU1
VOH = 1.25V
25
55
97
mA
PCI_F, PCI1:5
VOH = 1.5V
31
55
139
mA
IOAPIC
VOH = 1.25V
40
87
155
mA
REF0:1
VOH = 1.5V
27
44
94
mA
48-MHz
VOH = 1.5V
27
44
94
mA
24-MHz
VOH = 1.5V
25
37
76
mA
Notes:
3. All clock outputs loaded with 6" 60Ω traces with 22-pF capacitors.
4. W199 logic inputs (except FS3) have internal pull-up devices (pull-ups not full CMOS level). Logic input FS3 has an internal pull-down device.
9
PRELIMINARY
W199
DC Electrical Characteristics: (continued) TA = 0°C to +70°C; VDDQ3 = 3.3V±5%; VDDQ2 = 2.5V±5%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Crystal Oscillator
VTH
X1 Input threshold Voltage[5]
CLOAD
Load Capacitance, Imposed on
External Crystal[6]
CIN,X1
X1 Input Capacitance[7]
VDDQ3 = 3.3V
Pin X2 unconnected
1.65
V
14
pF
28
pF
Pin Capacitance/Inductance
CIN
Input Pin Capacitance
Except X1 and X2
5
pF
COUT
Output Pin Capacitance
6
pF
LIN
Input Pin Inductance
7
nH
Notes:
5. X1 input threshold voltage (typical) is VDDQ3/2.
6. The W199 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is
14 pF; this includes typical stray capacitance of short PCB traces to crystal.
7. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
AC Electrical Characteristics
TA = 0°C to +70°C; VDDQ3 = 3.3V±5%; V DDQ2 = 2.5V±5%; fXTL = 14.31818 MHz
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output; Spread Spectrum clocking is disabled.
CPU Clock Outputs, CPU_F, CPU1 (Lump Capacitance Test Load = 20 pF)
CPU = 66.8 MHz
Parameter
Description
Test Condition/Comments
CPU = 100 MHz
CPU = 133 MHz
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
tP
Period
Measured on rising edge at
1.25
15
tH
High Time
Duration of clock cycle above
2.0V
5.2
3.0
1.87
ns
tL
Low Time
Duration of clock cycle below
0.4V
5.0
2.8
1.67
ns
tR
Output Rise
Edge Rate
Measured from 0.4V to 2.0V
1
4
1
4
1
4
V/ns
tF
Output Fall Edge Measured from 2.0V to 0.4V
Rate
1
4
1
4
1
4
V/ns
tD
Duty Cycle
Measured on rising and falling
edge at 1.25V
45
55
45
55
45
55
%
tJC
Jitter,
Cycle-to-Cycle
Measured on rising edge at
1.25V. Maximum difference of
cycle time between two
adjacent cycles.
200
200
200
ps
tSK
Output Skew
Measured on rising edge at
1.25V
175
175
175
ps
fST
Frequency Stabilization from
Power-up (cold
start)
Assumes full supply voltage
reached within 1 ms from power-up. Short cycles exist prior to
frequency stabilization.
3
3
3
ms
Zo
AC Output
Impedance
Average value during switching
transition. Used for determining
series termination value.
10
15.5
20
10
10.5
20
7.5
8.0
20
ns
Ω
PRELIMINARY
W199
SDRAM Clock Outputs, SDRAM, SDRAM0:11 (Lump Capacitance Test Load = 30 pF) (continued)
PCI Clock Outputs, PCI_F and PCI1:5 (Lump Capacitance Test Load = 30 pF)
Parameter
Description
Test Condition/Comments
Min.
Typ.
Max.
Unit
tP
Period
tH
High Time
tL
Low Time
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
1
4
V/ns
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
1
4
V/ns
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
tJC
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.5V. Maximum
difference of cycle time between two adjacent cycles.
250
ps
tSK
Output Skew
Measured on rising edge at 1.5V
500
ps
tO
CPU to PCI Clock Skew
Covers all CPU/PCI outputs. Measured on
rising edge at 1.5V. CPU leads PCI output.
4
ns
fST
Frequency Stabilization
Assumes full supply voltage reached within
from Power-up (cold start) 1 ms from power-up. Short cycles exist prior to frequency stabilization.
3
ms
Zo
AC Output Impedance
Measured on rising edge at 1.5V
30
ns
Duration of clock cycle above 2.4V
12.0
ns
Duration of clock cycle below 0.4V
12.0
ns
1.5
Ω
30
Average value during switching transition.
Used for determining series termination
value.
IOAPIC Clock Output (Lump Capacitance Test Load = 20 pF)
CPU = 66.6/100 MHz
Parameter
Description
Test Condition/Comments
f
Frequency, Actual
Frequency generated by crystal oscillator
tR
Output Rise Edge Rate
Measured from 0.4V to 2.0V
tF
Output Fall Edge Rate
Measured from 2.0V to 0.4V
tD
Duty Cycle
Measured on rising and falling edge at 1.25V
fST
Frequency Stabilization
Assumes full supply voltage reached within
from Power-up (cold start) 1 ms from power-up. Short cycles exist prior
to frequency stabilization.
Zo
AC Output Impedance
Average value during switching transition.
Used for determining series termination value.
11
Min.
Typ.
Max.
14.31818
1
Unit
MHz
4
V/ns
1
4
V/ns
45
55
%
1.5
ms
15
Ω
PRELIMINARY
W199
SDRAM 0:11,_F Clock Outputs (Lump Capacitance Test Load = 22 pF)
SDRAMIN =
66.8 MHz
Parameter
Description
Test Condition/Comments
SDRAMIN =
100 MHz
SDRAMIN =
133 MHz
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
tP
Period
Measured on rising edge at
1.5V
15
tH
High Time
Duration of clock cycle above
2.4V
5.2
3.0
1.87
ns
tL
Low Time
Duration of clock cycle below
0.4V
5.0
2.0
1.67
ns
tR
Output Rise Edge Measured from 0.4V to 2.4V
Rate
1
4
1
4
1
4
V/ns
tF
Output Fall Edge
Rate
Measured from 2.4V to 0.4V
1
4
1
4
1
4
V/ns
tD
Duty Cycle
Measured on rising and falling
edge at 1.5V
45
55
45
55
45
55
%
tJC
Jitter,
Cycle-to-Cycle
Measured on rising edge at
1.5V. Maximum difference of
cycle time between two adjacent cycles.
250
250
250
ps
tSK
Output Skew
Measured on rising and falling
edge at 1.5V
250
250
250
ps
tPD
Propagation
Delay
Measured from SDRAMIN
3.7
3.7
3.7
ns
Zo
AC output
Impedance
Average value during switching
transition. Used for determining series termination value.
15
15
15
Ω
15.5
10
10.5
7.5
8.0
ns
REF0:1 Clock Outputs (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
f
Frequency, Actual
Frequency generated by crystal oscillator
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
tD
Duty Cycle
Measured on rising and falling edge at 1.5V.
fST
Frequency Stabilization
from Power-up (cold
start)
Assumes full supply voltage reached within 1 ms from
power-up. Short cycles exist prior to frequency stabilization.
Zo
AC Output Impedance
Average value during switching transition. Used for determining series termination value.
12
Min.
Typ.
Max.
14.318
Unit
MHz
2
V/ns
0.5
2
V/ns
45
55
%
3
ms
40
Ω
PRELIMINARY
W199
48-MHz Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
f
Description
Test Condition/Comments
Min.
Frequency, Actual
Determined by PLL divider ratio (see m/n below)
fD
Deviation from 48 MHz
m/n
PLL Ratio
tR
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
fST
Frequency Stabilization
from Power-up (cold
start)
Assumes full supply voltage reached within 1 ms from
power-up. Short cycles exist prior to frequency
stabilization.
Zo
AC Output Impedance
Average value during switching transition. Used for determining series termination value.
Typ.
Max.
Unit
48.008
MHz
(48.008 – 48)/48
+167
ppm
(14.31818 MHz x 57/17 = 48.008 MHz)
57/17
2
V/ns
0.5
2
V/ns
45
55
%
3
ms
Ω
40
24-MHz Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
f
Description
Frequency, Actual
Test Condition/Comments
Min.
Determined by PLL divider ratio (see m/n below)
Typ.
ppm
Deviation from 24 MHz (24.004 – 24)/24
+167
m/n
PLL Ratio
57/34
tR
Output Rise Edge Rate Measured from 0.4V to 2.4V
0.5
tF
Output Fall Edge Rate
Measured from 2.4V to 0.4V
tD
Duty Cycle
Measured on rising and falling edge at 1.5V
fST
Frequency Stabilization from Power-up
(cold start)
Assumes full supply voltage reached within 1 ms from
power-up. Short cycles exist prior to frequency stabilization.
Zo
AC Output Impedance
Average value during switching transition. Used for determining series termination value.
Ordering Information
Ordering Code
W199
Package
Name
H
Package Type
48-Pin SSOP (300-mil)
Document #: 38-00858
13
Unit
MHz
fD
(14.31818 MHz x 57/34 = 24.004 MHz)
Max.
24.004
2
V/ns
0.5
2
V/ns
45
55
%
3
ms
40
Ω
PRELIMINARY
W199
Package Diagram
48-Pin Shrink Small Outline Package (SSOP, 300 mils)
Summary of nominal dimensions in inches:
Body Width: 0.296
Lead Pitch: 0.025
Body Length: 0.625
Body Height: 0.102
© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.