YAS532B

YAS532B
MS-3R
Magnetic Field Sensor Type 3R
■ Overview
The YAS532B is a 3-axis geomagnetic sensor device with the following circuits integrated on one
chip: a buffer amplifier, an AD converter, a clock generator circuit, and a serial data interface circuit
(compliant with I2C bus interface).
The YAS532B allows a compact electronic compass with high sensitivity and low power consumption
in mobile phones or mobile GPS systems.
YAS532B Catalog
CATALOG No. LSI-4AS532B40
2012.10
■ Features
■
YAS532B
Features
■
■
■
■
■
■
3-axis magnetic sensors and peripheral circuits integrated on one chip
High sensitivity geomagnetic sensors
Supports the I2C bus interface (100kbps/400kbps, slave mode)
Small footprint with the small-sized package
Automatic power-down control after the acquisition, and low-power consumption
Reduced communication load with a host controller via deferred acquisition and interrupt outputs
Package
Lead-free 6-ball
Size
1.46mm × 1.46mm
Core supply voltage (VDD)
Digital interface supply voltage (IOVDD)
Power Supply
Operating
Temperature
WLCSP (YAS532B-PZ)
1.7V to 3.6V
1.7V to VDD
−40°C to +95°C
Current
4mA (VDD=2.6 V, during the acquisition)
Consumption
32µA (Average consumption in 8Hz)
Magnetic Sensor
Manufacturing process
CMOS＋Magnetic Sensor
Maximum measurable magnetic field
1200 μT
Magnetic field sensitivity (X, Y)
0.15 μT/count
Magnetic field sensitivity (Z)
0.25 μT/count
1 ms
Acquisition Time
(Magnetic sensor acquisition +
Temperature acquisition)
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■ Pin Assignments
■
YAS532B
Pin Assignments
The figure below shows the pin assignment and its description:
2A
2B
2C
1A
1B
1C
< 6-pin WLCSP Top View >
Pin No.
Pin Name
I/O
Function
1A
INT
O
Interrupt output pin
1B
VSS
-
GND
1C
SDA
Is/Od
Serial data
2A
IOVDD
-
Interface power supply (Typ. 1.8V)
2B
SCL
Is
Serial clock
2C
VDD
-
Core power supply (Typ. 2.6V)
Is : Schmitt trigger input
Od : Open-drain output
O : Output
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■ Pin Descriptions
■
YAS532B
Pin Descriptions
● Power supply pins (VDD, IOVDD, VSS)
These are power supply pins:
VDD
: Core power supply (Typ. 2.6V)
IOVDD : Interface power supply (Typ. 1.8V)
VSS
: GND
● Interface pins (SCL, SDA, INT)
SCL
: Serial clock input pin
Pull up this pin externally.
SDA
: Serial data input and output pin
Pull up this pin externally.
INT
: Interrupt output pin. An interrupt signal is sent through this output pin when the acquisition
is completed. A high or low level output can be select with the configuration registers.
Leave this pin open when not used.
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■ Block Diagram
■
YAS532B
Block Diagram
Magnetic
Sensor 1
Powerdown
Control
Magnetic
Sensor 2
Gain
A/D
Magnetic
Sensor 3
Reset Coils
Test Coils
Clock
Generator
Temperature
Sensor
Serial
Data
Interface
(Registers)
Power-on
Reset
VDD
IOVDD
INT
SCL
SDA
VSS
Block Diagram
• Magnetic Sensor
Three magnetic sensors are on the chip.
The supply voltage is supplied only to the sensor corresponding to the axis to be measured.
•
Buffer Amplifier
The buffer amplifier, operating only when measuring the magnetic field, amplifies the magnetic
sensor output.
• Temperature Sensor
The temperature sensor, operating only when measuring the temperature, can be used to compensate
for the temperature characteristics of the sensor.
• A/D Converter (ADC)
The ADC, operating only when measuring the magnetic field, transforms the magnetic sensor output
amplified with the buffer amplifier or the temperature sensor output, to the digital form.
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■ Block Diagram
YAS532B
• Clock Generator
The clock generator, operating only when measuring the magnetic field or the temperature, supplies
clocks to the ADC and the digital circuits.
• Power-on Reset Circuit
The power-on reset circuit detects the ramp-up of the core supply voltage and resets the internal
circuit.
• Reset Coils
The Reset coils are used to restore the function of a damaged magnetic sensor because of the high
magnetic field received.
Generating magnetic field with the reset coils restores the magnetic sensor characteristics.
• Serial Data Interface
The YAS532B serial data interface is compliant with I2C bus interface and operates in slave mode.
Data are transferred via the following pins:
SCL— Serial clock input pin
SDA— Serial data input and output pin
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■ Electrical Characteristics
■
YAS532B
Electrical Characteristics
● Absolute Maximum Ratings
Item
Symbol
Min.
Max.
Unit
VDD
-0.3
4.2
V
Interface Supply Voltage
IOVDD
-0.3
4.2
V
Digital Input Pin Voltage
(SCL, SDA)
VIND1
-0.3
4.2
V
Tstg
-50
125
°C
500
mT
Core Supply Voltage
Storage Temperature
Maximum Applicable Magnetic Field
Typ.
Hmax
● Recommended Operating Conditions
Item
Core Supply Voltage
Interface Supply Voltage
Operating Ambient Temperature
Symbol
Min.
Typ.
Max.
Unit
VDD
1.7
2.6
3.6
V
IOVDD
1.7
1.8
VDD
V
Top
-40
25
95
°C
Typ.
Max.
Unit
1
μA
10
μA
● Drawn Currents
Item
Min.
Standby Current (TOP=25°C,
SCL=SDA= IOVDD=VDD=3.0V）
Standby Current (TOP=95°C,
SCL=SDA= IOVDD=VDD=3.0V）
Current drawn from IOVDD during communication
Current drawn from VDD during magnetic field
acquisition * See Note.
Current drawn from VDD during temperature acquisition
* See Note.
Current drawn from VDD (Reset coil is ON)
1
μA
4.0
mA
2.0
mA
50
mA
Note: After the acquisition the device automatically powers down to enter the standby state.
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■ Electrical Characteristics
YAS532B
● Magnetic Sensor Characteristics
(Conditions: TOP = 25ºC, VDD = 2.6 V)
Item
Min.
Typ.
Max.
Unit
Maximum Measurable Magnetic Field
1200
μT
Magnetic Field Sensitivity (X,Y)
0.15
μT/count
Magnetic Field Sensitivity (Z)
0.25
μT/count
Sensitivity Axis Deviation
±5
deg
Note: Y and Z sensitivities are for Y1-Y2 and Y1+Y2, respectively. And, the sensitivity axis deviation is for the
value corrected with CAL register values. For details, see the application manual.
● Temperature Sensor Characteristics
(Conditions: see “Recommended Operating Conditions”)
Item
Min.
Temperature Acquisition Range
Typ.
-40
Temperature Resolution
Max.
Unit
95
°C
0.18
°C/count
● Acquisition Time
(Conditions: see “Recommended Operating Conditions”)
Item
Min.
Acquisition Time
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Typ.
Max.
Unit
1.0
1.5
ms
■ Electrical Characteristics
YAS532B
● DC Characteristics
Serial Data Interface: SCL, SDA
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
Max.
Unit
“L” level input voltage
VIL
-0.3
0.3×IOVDD
V
“H” level input voltage
VIH
0.7×IOVDD
IOVDD+0.3
V
“L” level output voltage (sink current 3mA)
VOL
0
0.2×IOVDD
V
Ii
-1
1
μA
10
pF
Input leakage Current at the input voltage of 0.1
× IOVDD to 0.9 × IOVDD
Input Capacitance
Interrupt Output
Ci
INT
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
“L” level output voltage (IOL=1mA)
VOL
“H” level output voltage (IOH=-1mA)
VOH
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Min.
0.8×IOVDD
Typ.
Max.
Unit
0.2×IOVDD
V
V
■ Electrical Characteristics
YAS532B
● AC Characteristics
The table below shows the rules on the power supply power-on sequence.
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
Max.
Unit
Power Supply Ramp Up Time
TVON
10
ms
Time from when all the power supplies are
completely powered up till when the I2C interface
becomes available
TDOP
4
ms
When applying IOVDD first, and then VDD:
・Access to the I2C bus is not allowed while IOVDD is ramping up to its operating range.
・Access to the I2C bus is not allowed while VDD is ramping up to its operating range.
Otherwise, there are no restrictions on the I2C bus access.
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■ Electrical Characteristics
YAS532B
Serial Data Interface: SCL, SDA
(Conditions: see “Recommended Operating Conditions”)
Item
Symbol
Min.
Max.
Unit
fSCL
0
400
kHz
tHD;STA
0.6
μs
SCL Clock “L” Time
tLOW
1.3
μs
SCL Clock “H” Time
tHIGH
0.6
μs
Setup Time of the repeat start conditions
tSU;STA
0.6
μs
Data Hold Time
tHD;DAT
0
Data Setup Time
tSU;DAT
0.1
SCL Clock Frequency
Hold Time (repeat) Start Condition
μs
0.9
μs
SDA and SCL signals rise time (input)
tr
300
ns
SDA and SCL signals fall time (input)
tf
300
ns
SDA signal fall time (output)
tof
20+0.1×Cb
250
ns
tSU;STO
0.6
μs
Bus Free Time between stop and start conditions
tBUF
1.3
μs
SDA and SCL Capacitive Load
Cb
Stop Condition Setup Time
400
pF
Cb: Load capacitance for each bus line (pF)
t LOW t r
tf
SCL
tf
t HIGH
t HD;STA
t HD;DAT
t SU;STA
t SU;STO
t HD;STA
t SU;DAT
SDA
tBUF
Start
Repeated
Start
Stop
Serial Data Interface Timing Specification
[Notes]
・ YAS532B serial data interface is compliant to I2C bus as far as described in this document.
・ Spike noise with the width of about 50ns can be suppressed.
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■ System Configuration Examples
■
YAS532B
System Configuration Examples
The figure below shows an example of the application.
Leave the INT pin open (N.C.) when not used.
Note: For a geomagnetic sensor to deliver its performance, its placement on the board needs to be carefully designed.
Contact Yamaha sales staff for details.
1.8V
2.6V
VDD
GND
VSS
1.8V
IOVDD
INT
YAS532B
Host
CPU
(I2C Master)
SCL
SDA
I2C Device
I2C Device
Example 1 (INT pin used)
1.8V
2.6V
VDD
INT
YAS532B
GND
VSS
1.8V
IOVDD
SCL
N.C.
SDA
Host
CPU
(I2C Master)
I2C Device
I2C Device
Example 2 (INT pin not used)
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■ Package Information
■
YAS532B
Package Information
Caution
The product of the WLCSP package should be used under light-shielded conditions.
Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer,
the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric
effect.
注）
1. 表面実装LSIは、保管条件、および、半田付けについての特別な配慮が必要です。
2. 組立工場により、寸法や形状などが異なる場合があります。
詳しくはヤマハ代理店までお問い合わせください。
Note:　1. Special attention needs to be paid to the storage conditions and soldering method of the
surface mount IC.
2. Dimension, form, etc. may differ depending on assembly plants.
For details, please contact your local Yamaha agent.
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YAS532B
PRECAUTIONS AND INSTRUCTIONS FOR SAFETY
WARNING
Prohibited
Prohibited
Prohibited
Instructions
Do not use the device under stresses beyond those listed in Absolute Maximum Ratings.
Such stresses may become causes of breakdown, damages, or deterioration, causing explosion
or ignition, and this may lead to fire or personal injury.
Do not mount the device reversely or improperly and also do not connect a supply voltage in
wrong polarity. Otherwise, this may cause current and/or power-consumption to exceed the
absolute maximum ratings, causing personal injury due to explosion or ignition as well as causing
breakdown, damages, or deterioration.
And, do not use the device again that has been improperly mounted and powered once.
Do not short between pins.
In particular, when different power supply pins, such as between high-voltage and low-voltage
pins, are shorted, smoke, fire, or explosion may take place.
As to devices capable of generating sound from its speaker outputs, please design with safety of
your products and system in mind, such as the consequences of unusual speaker output due to a
malfunction or failure. A speaker dissipates heat in a voice-coil by air flow accompanying
vibration of a diaphragm. When a DC signal (several Hz or less) is input due to device failure,
heat dissipation characteristics degrade rapidly, thereby leading to voice-coil burnout, smoking or
ignition of the speaker even if it is used within the rated input value.
CAUTION
Prohibited
Instructions
Instructions
Instructions
Instructions
Instructions
Instructions
Instructions
Do not use Yamaha products in close proximity to burning materials, combustible substances, or
inflammable materials, in order to prevent the spread of the fire caused by Yamaha products, and
to prevent the smoke or fire of Yamaha products due to peripheral components.
Generally, semiconductor products may malfunction and break down due to aging, degradation,
etc. It is the responsibility of the designer to take actions such as safety design of products and
the entire system and also fail-safe design according to applications, so as not to cause property
damage and/or bodily injury due to malfunction and/or failure of semiconductor products.
The built-in DSP may output the maximum amplitude waveform suddenly due to malfunction from
disturbances etc. and this may cause damage to headphones, external amplifiers, and human
body (the ear). Please pay attention to safety measures for device malfunction and failure both in
product and system design.
As semiconductor devices are not nonflammable, overcurrent or failure may cause smoke or fire.
Therefore, products should be designed with safety in mind such as using overcurrent protection
circuits to control the amount of current during operation and to shut off on failure.
Products should be designed with fail safe in mind in case of malfunction of the built-in protection
circuits. Note that the built-in protection circuits such as overcurrent protection circuit and
high-temperature protection circuit do not always protect the internal circuits. In some cases,
depending on usage or situations, such protection circuit may not work properly or the device
itself may break down before the protection circuit kicks in.
Use a robust power supply.
The use of an unrobust power supply may lead to malfunctions of the protection circuit, causing
device breakdown, personal injury due to explosion, or smoke or fire.
Product's housing should be designed with the considerations of short-circuiting between pins of
the mounted device due to foreign conductive substances (such as metal pins etc.). Moreover,
the housing should be designed with spatter prevention etc. due to explosion or burning.
Otherwise, the spattered substance may cause bodily injury.
The device may be heated to a high temperature due to internal heat generation during
operation. Therefore, please take care not to touch an operating device directly.
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YAS532B
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