RENESAS HD74HC679RPEL

HD74HC679
12-bit Address Comparator
REJ03D0640-0200
(Previous ADE-205-526)
Rev.2.00
Mar 30, 2006
Description
The HD74HC679 address comparator simplifies addressing of memory boards and/or other peripheral devices. The
four P inputs are normally hard wired with a preprogrammed address. An internal decoder determines what input
information applied to the 12 A inputs must be low or high to cause a low state at the output (Y). For example, a
positive-logic bit combination of 0111 (decimal 7) at the P input determines that inputs A1 through A7 must be low and
that inputs A8 through A12 must be high to cause the output to go low. Equality of the address amplified at the A inputs
to the preprogrammed address is indicated by the output being low.
The HD74HC679 features and enable input (G). When G is low, the device is enabled. When G is high, the device is
disabled and the output is high regardless of the A and P inputs.
Features
• High Speed Operation: tpd (A to Y) = 18 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
• Ordering Information
Part Name
HD74HC679RPEL
Package Type
SOP-20 pin (JEDEC)
Rev.2.00 Mar 30, 2006 page 1 of 6
Package Code
(Previous Code)
PRSP0020DC-A
(FP-20DBV)
Package
Abbreviation
RP
Taping Abbreviation
(Quantity)
EL (1,000 pcs/reel)
HD74HC679
Function Table
Inputs
G
P2
L
P1
L
P0
L
A1
H
A2
H
A3
H
A4
H
A5
H
A6
H
A7
H
A8
H
A9
H
A10
H
A11
H
A12
H
Output Y
L
P3
L
L
L
L
L
L
L
L
H
H
L
L
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
H
H
L
H
L
L
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
L
H
H
L
L
L
L
L
L
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
L
H
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
L
L
L
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
H
H
H
L
L
L
L
H
H
L
H
H
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
H
H
H
H
L
H
H
L
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
H
L
L
H
H
H
H
L
L
L
L
L
L
L
L
L
H
L
L
L
L
All other combinations
H
H :
L :
X :
Any combination
H
high level
low level
irrelevant
Pin Arrangement
A1
1
20 VCC
A2
2
19 G
A3
3
18 Y
A4
4
17 P3
A5
5
16 P2
A6
6
15 P1
A7
7
14 P0
A8
8
13 A12
A9
9
12 A11
GND 10
11 A10
(Top view)
Rev.2.00 Mar 30, 2006 page 2 of 6
L
HD74HC679
Logic Diagram
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
Y
A11
A12
P0
P1
P2
P3
G
Absolute Maximum Ratings
Item
Supply voltage range
Symbol
VCC
Ratings
–0.5 to 7.0
Unit
V
Input / Output voltage
Input / Output diode current
VIN, VOUT
IIK, IOK
–0.5 to VCC +0.5
±20
V
mA
Output current
VCC, GND current
IOUT
ICC or IGND
±25
±50
mA
mA
PT
Tstg
500
–65 to +150
mW
°C
Power dissipation
Storage temperature
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Symbol
Ratings
Unit
Supply voltage
Input / Output voltage
VCC
VIN, VOUT
2 to 6
0 to VCC
V
V
Operating temperature
Ta
–40 to 85
0 to 1000
°C
tr , tf
0 to 500
0 to 400
ns
Input rise / fall time
Note:
*1
1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Rev.2.00 Mar 30, 2006 page 3 of 6
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
HD74HC679
Electrical Characteristics
Ta = 25°C
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Ta = –40 to+85°C
2.0
Min
1.5
Typ
—
Max
—
Min
1.5
Max
—
4.5
6.0
3.15
4.2
—
—
—
—
3.15
4.2
—
—
2.0
4.5
—
—
—
—
0.5
1.35
—
—
0.5
1.35
6.0
2.0
—
1.9
—
2.0
1.8
—
—
1.9
1.8
—
4.5
6.0
4.4
5.9
4.5
6.0
—
—
4.4
5.9
—
—
4.5
6.0
4.18
5.68
—
—
—
—
4.13
5.63
—
—
2.0
4.5
—
—
0.0
0.0
0.1
0.1
—
—
0.1
0.1
6.0
4.5
—
—
0.0
—
0.1
0.26
—
—
0.1
0.33
Input current
Iin
6.0
6.0
—
—
—
—
0.26
±0.1
—
—
0.33
±1.0
Quiescent supply
current
ICC
6.0
—
—
4.0
—
40
Unit
Test Conditions
V
V
V
Vin = VIH or VIL IOH = –20 µA
IOH = –4 mA
IOH = –5.2 mA
V
Vin = VIH or VIL IOL = 20 µA
IOL = 4 mA
IOL = 5.2 mA
µA Vin = VCC or GND
µA Vin = VCC or GND, Iout = 0 µA
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Item
Propagation delay
time
Symbol VCC (V)
Ta = –40 to +85°C
tPLH
tPHL
2.0
Min
—
4.5
6.0
—
—
27
—
62
52
—
—
78
66
tPLH
tPHL
2.0
4.5
—
—
—
18
180
36
—
—
225
45
6.0
2.0
—
—
—
—
31
125
—
—
38
155
4.5
6.0
—
—
14
—
25
21
—
—
31
26
tPLH
tPHL
Typ
—
Max
310
Min
—
Max
390
Output rise/fall
time
tTLH
tTHL
2.0
4.5
—
—
—
5
75
15
—
—
95
19
Input capacitance
Cin
6.0
—
—
—
—
5
13
10
—
—
16
10
Rev.2.00 Mar 30, 2006 page 4 of 6
Unit
Test Conditions
ns
P to Y
ns
A to Y
ns
G to Y
ns
pF
HD74HC679
Test Circuit
VCC
VCC
See Function Table
Input
Pulse Generator
Zout = 50 Ω
G
Output
A1
A12
Y
CL =
50 pF
P0
P3
Note : 1. CL includes probe and jig capacitance.
Waveforms
• Waveform – 1
tr
P or A
tf
90%
50%
10%
90%
50%
10%
tPLH
tPHL
90%
50%
Y
VCC
0V
VOH
90%
50%
10%
VOL
tTHL
tTLH
• Waveform – 2
VCC
G
50%
50%
0V
tPLH
tPHL
90%
50%
10%
Y
tTLH
VOH
90%
50%
10%
tTHL
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
Rev.2.00 Mar 30, 2006 page 5 of 6
VOL
HD74HC679
Package Dimensions
JEITA Package Code
P-SOP20-7.5x12.8-1.27
RENESAS Code
PRSP0020DC-A
*1
Previous Code
FP-20DBV
MASS[Typ.]
0.52g
D
F
20
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
@ DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
@ INCLUDE TRIM OFFSET.
11
HE
c
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
e
*3
bp
x
M
L1
A
Z
Reference
Symbol
10
A1
θ
L
y
Detail F
Rev.2.00 Mar 30, 2006 page 6 of 6
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
12.80 13.2
7.50
0.10 0.20 0.30
2.65
0.34 0.40 0.46
0.20 0.25 0.30
0°
8°
10.00 10.40 10.65
1.27
0.12
0.15
0.935
0.40 0.70 1.27
1.45
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0