REV A DESCRIPTION DATE 4/23/14 NIR-52399 PREP DF/SM APPD LT Oscillator Specification, Hybrid VCXO For MOUNT HOLLY SPRINGS, PA 17065 THE RECORD OF APPROVAL FOR THIS DOCUMENT IS MAINTAINED ELECTRONICALLY WITHIN THE ERP SYSTEM Hi-Rel Standard, LVDS Output CODE IDENT NO SIZE 00136 A DWG. NO. UNSPECIFIED TOLERANCES: N/A VECTRON INTERNATIONAL PROPRIETARY REV DOC204899 A SHEET 1 0F 15 1. SCOPE 1.1 General. This specification defines the design, assembly and functional evaluation of high reliability, hybrid voltage controlled oscillators produced by Vectron International. Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP) Program developed, implemented and certified for advanced applications and extended environments. 1.2 Applications Overview. The designs represented by these products were primarily developed for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options imbedded within DOC204899 bridge the gap between Space and COTS hardware by providing custom hardware with measures of mechanical, assembly and reliability assurance needed for Military or Ruggedized COTS environments. 2. APPLICABLE DOCUMENTS 2.1 Specifications and Standards. The following specifications and standards form a part of this document to the extent specified herein. The issue currently in effect on the date of quotation will be the product baseline, unless otherwise specified. In the event of conflict between the texts of any references cited herein, the text of this document shall take precedence. Military MIL-PRF-55310 MIL-PRF-38534 Standards MIL-STD-202 MIL-STD-750 MIL-STD-883 MIL-STD-1686 Other DOC204943 QSP-90100 VL-65339 DOC203982 Oscillators, Crystal Controlled, General Specification For Hybrid Microcircuits, General Specification For Test Method Standard, Electronic and Electrical Component Parts Test Method Standard, Test Methods for Semiconductor Devices Test Methods and Procedures for Microelectronics Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment Test Specification, Hybrid VCXO, Hi-Rel Standard, LVDS Output Quality Systems Manual, Vectron International Identification Common Documents, Materials and Processes, Hi-Rel XO DPA Specification 3. GENERAL REQUIREMENTS 3.1 Classification. All devices delivered to this specification are of hybrid technology conforming to Type 1, Class 2 of MIL-PRF-55310 and have a Class 1C ESDS rating. Primarily developed as a Class S equivalent specification, options are imbedded within it to also produce Class B, Engineering Model and Ruggedized COTS devices. 3.2 Item Identification. Unique Model Number Series’ are utilized to identify device package configurations as listed in Table 1. SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 2 VECTRON INTERNATIONAL PROPRIETARY 3.3 Absolute Maximum Ratings. a. Supply Voltage Range (VCC): b. Storage Temperature Range (TSTG): c. Junction Temperature (TJ): d. Lead Temperature (soldering, 10 seconds): e. Weight f. Control Voltage Input (Vc) 0.3Vdc to +4.0Vdc -65°C to +125°C +150°C +300°C 5 grams -0.3Vdc to +4.0Vdc 3.4 Design, Parts, Materials and Processes, Assembly, Inspection and Test. 3.4.1 Design. The ruggedized designs implemented for these devices are proven in military and space applications under extreme environments. Designs utilize 4-point crystal mounting in combination with Established Reliability (MIL-ER) components where possible. When specified, radiation hardening up to 100krad (Si) (RHA level R) can be included without altering the device’s internal topography. 3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting passive chip component values to offset component tolerances, there will not be fundamental changes to the design or assembly or parts, materials and processes after first product delivery of that item without written approval from the procuring activity. 3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MILPRF-55310. These designs have also passed extended dynamic levels of at least: Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.) Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms) Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms) 3.4.2 Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high reliability devices produced to this specification. a. Gold metallization of package elements without a barrier metal. b. Zinc chromate as a finish. c. Cadmium, zinc, or pure tin external or internal to the device. d. Plastic encapsulated semiconductor devices. e. Ultrasonically cleaned electronic parts. f. Heterojunction Bipolar Transistor (HBT) technology. g. ‘getter’ materials 3.4.3 Assembly. Manufacturing utilizes standardized procedures, processes and verification methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices. MIL-PRF38534 Group B Option 1 in-line inspection is included on radiation hardened part numbers to further verify lot pedigree. Traceability of all components and production lots are in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part of the deliverable data package. Devices are handled in accordance with MIL-STD-1686 for Class 1 devices. 3.4.4 Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to this document. Inspection conditions and standards are documented in accordance with the Quality Assurance, ISO-9001 derived, System of QSP-90100. SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 3 VECTRON INTERNATIONAL PROPRIETARY 3.4.5 Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to eliminate costs associated with the development/maintenance of device-specific documentation packages while maintaining performance integrity. 3.4.6 Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310. 3.4.7 Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the same robust designs found in the other device pedigrees. They do not include the provisions of traceability or the Class-qualified components noted in paragraphs 3.4.3 and 4.1. 4. DETAIL REQUIREMENTS 4.1 Components 4.1.1 Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the devices. The optional use of Premium Q swept quartz can, because of its processing to remove impurities, be specified for better frequency aging characteristics. In accordance with MIL-PRF55310, the manufacturer has a documented crystal element evaluation program. 4.1.2 Passive Components. Established Reliability (ER) failure level R minimum passive components are procured from QPL suppliers where possible. Lot evaluations are in accordance with MILPRF-55310 or Enhanced Element Evaluation as specified in Table 7. 4.1.3 Class S Active Devices. Devices are assembled with semiconductors and an LVDS chip used to provide the LVDS output. The semiconductors are procured from wafer lots that have passed MIL-PRF-55310 Lot Acceptance Tests for Class S devices. The LVDS microcircuit die is sourced in accordance with Standard Microcircuit Drawing 5962R9865105V9A, Class V (MILPRF-38535) qualified device. Although radiation testing is not performed at the oscillator level, active devices are acceptable for use in environments of up to 100 krads total dose by analysis, design or certification of the individual components. In addition, the semiconductors are considered insensitive to Single Event Effects. 4.1.3.1 Class B Active Devices. Active devices for design Pedigree letters “B” and “C” are procured from wafer lots that have passed MIL-PRF-55310 element evaluations for Class B devices, at a minimum. 4.1.4 Packages. Packages are procured that meet the construction, lead materials and finishes as specified in MIL-PRF-55310. Package lots are upscreened in accordance with the requirements of MIL-PRF-38534 as applicable. 4.1.5 Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing details of the autoclave lot, as applicable. All other elements and materials are traceable to their manufacturer and incoming inspection lots. 4.1.6 Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be implemented for the highest reliability preference. SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 4 VECTRON INTERNATIONAL PROPRIETARY 4.2 Mechanical. 4.2.1 Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a corresponding package style. Mechanical Outline information of each package style is found in the referenced Figure. 4.2.2 Thermal Characteristics. The worst case thermal characteristics of each package style and active device are found in Table 4. 4.3 Electrical. 4.3.1 Input Power. Devices are designed for standard +3.3 volt dc operation, ±5%. Current is measured, no load, at maximum rated operating Voltage. 4.3.2 Temperature Range. Operating range is -40°C to +85°C. Units may be operated from -55°C to +125°C; however, electrical performance may be degraded. 4.3.3 Absolute Pull Range. Absolute pull range is defined as the minimum guaranteed amount the VCXO can be varied, about the center frequency (fo). It accounts for degradations including temperature stability (-40 to 85°C), aging (15 years), radiation effects, power supply variations (±5%) and load variations (±10%). 4.3.4 Frequency Aging. When tested in accordance with MIL-O-55310 Group B inspection, the 15year aging projection shall not cause the minimum APR limit to be exceeded. 4.3.5 Operating Characteristics. Symmetrical square wave limits are dependent on the device frequency and are in accordance with Table 2 and Figure 1. Start-up time is 10.0 msec. maximum. 4.3.6 Output Load. See Figure 2. 5. QUALITY ASSURANCE PROVISIONS AND VERIFICATION 5.1 Verification and Test. Device lots shall be tested prior to delivery in accordance with the applicable Screening Option letter as stated by the 15th character of the part number. Table 5 tests are conducted in the order shown and annotated on the appropriate process travelers and data sheets of the governing test procedure. For devices that require Screening Options that include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A Electrical Test are combined into one operation. 5.1.1 Screening Options. The Screening Options, by letter, are summarized as: A Modified MIL-PRF-38534 Class K B Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance Inspection (QCI) C Modified MIL-PRF-55310 Class S Screening & Group A QCI E Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 5 VECTRON INTERNATIONAL PROPRIETARY F G X Modified MIL-PRF-55310 Class S Screening, Groups A & B QCI Modified MIL-PRF-55310 Class B Screening & Post Burn-in Nominal Electricals Engineering Model (EM) 5.2 Optional Design, Test and Data Parameters. The following is a list of design, assembly, inspection and test options that can be selected or added by purchase order request. a. Design Pedigree (choose one as the 5th character in the part number): (E) Enhanced Element Evaluation, 100krad Class S die, Premium Q Swept Quartz (R) Hi-Rel design w/ 100krad Class S die, Premium Q Swept Quartz (V) Hi-Rel design w/ 100krad Class S die, Cultured Quartz (X) Hi-Rel design w/ Cultured Quartz, Class S die (B) Hi-Rel design w/ Swept Quartz, Class B die (C) Hi-Rel design w/ Cultured Quartz, Class B die (D) Hi-Rel design w/ Cultured Quartz and commercial grade components b. Input Voltage, (B) for 3.3V as the 14th character c. Frequency-Temperature Slew Test d. Radiographic Inspection e. Group C Inspection: MIL-PRF-55310 (requires 8 test specimens) f. Group C Inspection: MIL-PRF-38534 [requires 8 test specimens – Life (5), RGA (3)] g. Internal Water-Vapor Content (RGA) samples and test performance h. MTBF Reliability Calculations i. Worst Case/Derating Analysis j. Deliverable Process Identification Documentation (PID) k. Customer Source Inspection (pre-cap / final) 5.3 Test Conditions. Unless otherwise stated herein, inspections are performed in accordance with those specified in MIL-PRF-55310 and MIL-PRF-38534, in that order. Process travelers identify the applicable methods, conditions and procedures to be used. Examples of electrical test procedures that correspond to MIL-PRF-55310 requirements are shown in Table 3. 5.4 Special Tests and Descriptions. 5.4.1 Frequency-Temperature Slew. Frequency-Temperature Slew Test has been developed as an indicator of higher than normal internal water vapor content. The incremental temperature sweep from +85°C to -40°C and back to +85°C records output frequency fluctuations emulating the mass loading of moisture deposited on the crystal blank surface. Though not replacing a customer’s internal water-vapor content (RGA) requirement, confidence is increased without destructively testing otherwise good devices. 5.5 Deliverable Data. The manufacturer supplies the following data, as a minimum, with each lot of devices: a. Completed assembly and screening lot travelers, including rework history. b. Electrical test variables data, identified by unique serial number. c. Frequency-Temperature Slew plots, Radiographic films, Group C data and RGA data as required by purchase order. 5.6 Discrepant Material. All MRB authority resides with the procuring activity. SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 6 VECTRON INTERNATIONAL PROPRIETARY 5.7 Failure Analysis. Any catastrophic failure (no clocking, no current) at Post Burn-In or after will be evaluated for root cause. The customer will be notified after occurrence and upon completion of the evaluation. 6. PREPARATION FOR DELIVERY 6.1 Packaging. Devices will be packaged in a manner that prevents handling and transit damage during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1 devices. 7. ORDERING INFORMATION 7.1 Ordering Part Number. The ordering part number is made up of an alphanumeric series of 15 characters. Design-affected product options, identified by the parenthetic letter on the Optional Parameters list (¶ 5.2a and b), are included within the device part number. The Part Number breakdown is described as: 5219 R 160M0000 B F Model # (Table 1) Screening Option per Table 5, 5.1.1 Input Voltage B = 3.3V Design Pedigree E = Enhanced Element Evaluation, 100krad Class S die, Swept Quartz Frequency R = 100krad Class S die, Swept Quartz V = 100krad Class S die, Non-Swept Quartz X = Class S die, Non-Swept Quartz B = Class B die, Swept Quartz C = Class B die, Non-Swept Quartz D = Ruggedized COTS: Commercial Grade Components, Non-Swept Quartz 7.1.1 Model Number. The device model number is the four (4) digit number assigned to a corresponding package and output combination per Table 1. 7.1.2 Design Pedigree. Class S variants correspond to either letter “E”, “R”, “V” or “X” and are described in paragraph 5.2a. Class B variants correspond to either letter “B” or “C” and are SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 7 VECTRON INTERNATIONAL PROPRIETARY described in paragraph 5.2a. Ruggedized COTS, using commercial grade components, corresponds to letter “D”. 7.1.3 Output Frequency. The nominal output frequency is expressed in the format as specified in MILPRF-55310 utilizing eight (8) characters. 7.1.4 Input Voltage. Voltage is the 14th character, letter “B” represents +3.3V. 7.1.5 Screening Options. The 15th character is the Screening Option (letter A thru G or X) selected from Table 5. 7.2 Optional Design, Test and Data Parameters. Test and documentation requirements above that of the standard high reliability model shall be specified by separate purchase order line items (as listed in ¶ 5.2c thru k). HI-REL STANDARD MODEL # 5219 PACKAGE Vcc Vc 16 Lead Flatpack 16 1 PIN I/O 1/ Q Qnot 7 8 5221 16 Lead Flatpack 16 1 7 8 1/. All unassigned pins have no internal connections or ties. Gnd/Case MECHANICAL OUTLINE 9, 11 FIGURE 2 9, 11 FIGURE 3 TABLE 1 - Item Identification and Package Outline Frequency Range @ 3.3V Operation: 80 MHz to 200 MHz 1/ Temperature Range: -40°C to +85°C Absolute Pull Range: ±20 ppm min. Control Voltage (Vc) Range: 0.0V to +3.3V Slope: Positive Linearity: ±10% max. F vs. V Gain: 55 ppm/V typical Sub-Harmonics: -30 dBc max. Frequency-Voltage Tolerance: ±4 ppm max. (Vcc ±5%) Frequency Aging: 15 year projection based on 30 day test included in APR calculation Start-up Time: 10.0 ms max. Differential Output Voltage VOD: 250mV to 450mV Offset Voltage VOS: 1.125V to 1.450V Frequency Current Rise / Fall Duty Cycle BW Jitter, Range (No load, 3.465V) Times 12kHz-20MHz (MHz) (mA max) (ps max.) (%) (ps rms max) 80.0 – 100.0 35 600 40 to 60 1.0 >100.0 – 200.0 40 500 40 to 60 0.5 1/. Waveform measurement points and logic limits are in accordance with Figure 1. 2/. Measured with Wavecrest SIA-3000 Signal Integrity Analyzer TABLE 2 - Electrical Performance Characteristics SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 8 VECTRON INTERNATIONAL PROPRIETARY OPERATION LISTING REQUIREMENTS AND CONDITIONS 1/ @ all Electrical tests Input Current (no load) MIL-PRF-55310, Para 4.8.5.1 Initial Accuracy @ Ref. Temp. MIL-PRF-55310, Para 4.8.6 Output Logic Voltage Levels MIL-PRF-55310, Para 4.8.21.3 Rise and Fall Times MIL-PRF-55310, Para 4.8.22 Duty Cycle MIL-PRF-55310, Para 4.8.23 @ Post Burn-In Electrical only Overvoltage Survivability MIL-PRF-55310, Para 4.8.4 Initial Freq. – Temp. Accuracy MIL-PRF-55310, Para 4.8.10.1 Freq. – Voltage Tolerance MIL-PRF-55310, Para 4.8.14 Start-up Time (fast/slow start) MIL-PRF-55310, Para 4.8.29 1/. Waveform measurement points and logic limits are in accordance with Figure 1. TABLE 3 - Electrical Test Parameters Model # 5219/5221 Thermal Resistance Junction to Case θjc (°C / W) 150 ∆ Junction Temp. Tj (°C @ max. power) Weight (Grams) 2.1 7.2 Note. These oscillators contain multiple active devices. This calculation shows the worst case θjc and temperature rise of those devices. TABLE 4 - Thermal Characteristics and Weight SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 9 VECTRON INTERNATIONAL PROPRIETARY OPN. NO. OPERATION LISTING REQUIREMENTS AND CONDITIONS MIL Class Similarity SCREENING 1 2 Non-Destruct Bond Pull 3/ Internal Visual MIL-STD-883, Meth 2023 MIL-STD-883, Meth 2017 Class K, Meth 2032 Class K MIL-STD-883, Meth 1008, Cond C, 150°C, 48 hours min. MIL-STD-883, Meth 1011, Cond A 3 Stabilization (Vacuum) Bake 4 Thermal Shock 5 Temperature Cycle 6 Constant Acceleration 7 Particle Impact Noise Detection 8 Electrical Testing, Pre Burn-In 9 Freq-Temp Slew Test 10 1st Burn-In 11 Electrical Testing, Intermediate 12 2nd Burn-In 13 14 Electrical Testing, Post Burn-In (Group A) Seal: Fine Leak 15 16 Seal: Gross Leak Radiographic Inspection 17 18 19 Solderability External Visual & Mechanical Aging, 30 Day (M55310 Group B) Option A K Option B B- Option C S- Option E B Option F S Option G Option X EM 100% 100% 100% 100% 100% 100% 100% Completed During Assembly NR NR X NR X NR NR MIL-STD-883, Meth 1010, Cond. B, 10 cycles min. MIL-STD-883, Meth 2001, Cond A, Y1 plane only, 5000 g’s MIL-STD-883, Meth 2020, Cond B X X X X X X NR X X X X X X NR X X X X X NR X Perform tests in Table 3. Nominal Vcc, nominal temperature Operating temp. range, frequency plotted at 1.0°C steps MIL-STD-883, Meth 1015, Condition B X X X X X X X AR AR AR AR AR NR NR X 160 hrs. X X 160 hrs. NR X 240 hrs. NR X 160 hrs. NR X 240 hrs. NR X 160 hrs. NR NR NR X 160 hrs. X NR NR NR NR NR NR X X X X NR X X X X X X nom. Vcc X X X X AR X AR X AR X X X NR X NR 1/ X NR 1/ X 2/ NR 1/ X 2/ NR 1/ X 2/ 13 pcs. 1/ X 2/ X 1/ X 2/ NR NR X 2/ NR Perform tests in Table 3. Nominal Vcc, nominal temperature MIL-STD-883, Meth 1015, Condition B Perform tests in Table 3. Nominal Vcc & extremes, nominal temperature & extremes MIL-STD-883, Meth 1014, Cond A2 5 x 10-8 atm cc/sec max MIL-STD-202, Meth 112, Cond D MIL-STD-883, Meth 2012 MIL-STD-883, Meth 2003 MIL-STD-883, Meth 2009 MIL-PRF-55310, para. 4.8.35.1 LEGEND: X = Required, NR = Not Required, AR = As Required TABLE 5 - Test Matrix 1/ Performed at package LAT. Include LAT data sheet 2/ When specified, RGA samples will be removed from the lot after completion of this operation. Use of Screening failures require customer concurrence. 3/ Not performed on Option B, E, G and X units. SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 10 VECTRON INTERNATIONAL PROPRIETARY X Subgroup Class Test Condition (accept number) Mil-PRF38534 Reference Paragraph Perform at room ambient 100% C.3.3.1 100% C.3.3.2 10(0) or 22(0) (Notes 1 & 2) C.3.3.3 C.3.3.4.2 C.3.3.3 Mil-STD-750 K Method Quantity Element Electrical A. May perform at wafer level B. All failures shall be removed from the lot 1 X 2 X Element Visual 3 X Internal Visual 4 X X Temperature Cycling Surge Current (when applicable) Constant Acceleration X 2069, 2070, 2072, 2073 2069, 2070, 2072, 2073, 2074 1051 4066 C A or B as specified Y1 direction 20,000 G / 10,000 G for Pd ≥ 10W 2006 2001 X 10(0) 22(0) (See Notes 1 & 2) Interim Electrical C.3.3.4.3 1039 1042 1038 X High Temperature Reverse Bias (HTRB) X Interim Electrical & Delta X Burn-In 240 hours X Post Burn-In Electrical X Steady State Life 1000 hours X Final Electrical 1039, 1042 1038 1040 A B A Complete Within 16 hrs of HTRB completion B A B C.3.3.4.3 1026 1037 1042 1048 5 X Wire Bond Evaluation 2011 6 X SEM 2018 2077 C.3.3.4.3 C.3.3.3 C.3.3.5 10(0) wires or 20(1) wires See method 2018 or 2077 & Note 2 C.3.3.6 NOTES: 1. Subgroups 3, 4, & 5 shall be performed on a sample of 10 die if the wafer lot is from a QPL/QML line. If the die are from commercial wafer lots, then the sample size shall be 22 die. Die from QPL/QML wafers not meeting the QPL/QML requirements and downgraded to commercial grade shall not be used. 2. Subgroups 3, 4 & 5 shall be performed in the order listed in Table 1. Subgroup 6 may be performed at any time. TABLE 6 - SEMICONDUCTOR ENHANCED ELEMENT EVALUATION SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 11 VECTRON INTERNATIONAL PROPRIETARY Parts Type Ceramic Capacitors M55681 FRL S or M123 (chips) Resistors M55342 FRL R or S Inductors Custom Test Requirement Paragraph Sample size Allowable Reject(s) N/A N/A N/A N/A N/A N/A N/A N/A Group A Group B Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 Mil-Std-981 TABLE 7: PASSIVE COMPONENT ENHANCED ELEMENT EVALUATION SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 12 VECTRON INTERNATIONAL PROPRIETARY FIGURE 1 Differential Output Waveform FIGURE 2 Output Load, 100Ω between outputs SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 13 VECTRON INTERNATIONAL PROPRIETARY FIGURE 3 Model 5219 Package Outline FIGURE 4 Model 5221 Package Outline SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 14 VECTRON INTERNATIONAL PROPRIETARY DOCUMENT CHANGE RECORD Revision - Change Preliminary Release SIZE CODE IDENT NO. A 00136 UNSPECIFIED TOLERANCES DWG NO. REV. SHEET N/A DOC204899 A 15 VECTRON INTERNATIONAL PROPRIETARY