M62294FP 3.3 V, 2.0 V Fixed 2-Output Voltage DC/DC Converter REJ03D0854-0200 Rev.2.00 Jun 14, 2006 Description M62294FP is 3.3 V and 2.0 V fixed stable 2-output step-down DC/DC converter. It is possible to simplify peripheral circuit and to design compact and low cost sets because this device includes peripheral devices in small size 8-pin package. The IC also has Reset circuit with time delay that monitors power supply (VCC = 5 V) and one regulator output (Vout1 = 3.3 V; IN1 terminal), therefore an application system is protected system errors. Especially this is most suitable for application system with microprocessor and ASIC. Features • • • • • • 3.3 V and 2.0 V step-down converter 4 to 15 V wide input supply voltage (VCC = 5 V typ.) Reset circuit with time delay monitors Supply voltage (VCC = 5 V) and regulator output (3.3 V) 110 kHz fixed frequency oscillator without peripheral devices 8-pin SOP package Application Application system with microprocessor and ASIC Block Diagram Cd 6 VCC 4 IN1; 3.3 V 25 µA Vref 1.25 V + − − Comparator (3.3 V detect) Oscillator (110 kHz) Cout1 1 + 7 RESET + Comparator (VCC detect) 0.6 µA VCC − + PWM comp. + − OP Amp + − OP Amp 8 IN1 (3.3 V) Rev.2.00 Jun 14, 2006 page 1 of 6 3 Cout2 − 5 IN2 (2.0 V) + PWM comp. 2 GND M62294FP Pin Arrangement M62294FP Cout1 1 8 IN1 GND 2 7 RESET Cout2 3 6 Cd VCC 4 5 IN2 (Top view) Outline: PRSP0008DA-A (8P2S-A) Rev.2.00 Jun 14, 2006 page 2 of 6 M62294FP Absolute Maximum Ratings (Ta = 25°C, unless otherwise noted) Item Supply voltage Symbol VCC Ratings 16 Unit V Output current (DC/DC converter block) Output current (Reset block) IO IORESET 30 6 mA mA Power dissipation Thermal derating Pd Kθ 440 4.4 mW mW/°C Operating temperature Storage temperature Topr Tstg −20 to +85 −40 to +125 °C °C Conditions ch1, ch2 Ta = 25°C Ta > 25°C Electrical Characteristics (Ta = 25°C, VCC = 5 V, unless otherwise noted) Symbol Min Limits Typ Max Unit Supply voltage Supply current VCC ICC 4.0 5.0 1.5 15 2.8 V mA DC/DC converter block Error Output voltage Amp. VO1 3.15 3.30 3.45 V Line regulation VO2 Vreg-L 1.90 2.00 5 2.10 15 mV ch2 output VCC = 4 to 12 V Input current 1 Input current 2 Iin Iin 150 100 450 300 µA µA ch1 ch2 Oscillator frequency Maximum on duty fOSC TDUTY 65 110 90 160 kHz % Output leakage current Output saturation voltage ICL Vsat −1 1.2 1 2.0 V V VCC = 12 V, VC = 12 V IO = 10 mA, Darlington connection Vs1 3.6 3.8 4.0 V VCC = 5 V detection Detecting voltage 2 ∆Vs1 Vs2 30 2.46 50 2.58 80 2.70 mV V Hysteresis voltage 2 Cd output current ∆Vs2 IPD 30 −1.1 50 −0.6 80 −0.3 mV µA Delay time RESET output current tpd IOC 5 −40 10 −25 20 −17 ms µA RESET low voltage VOL 0.2 VO1 V RESET high voltage VOH 0.8 VO1 V Block All Blocks Oscillator Output Item Reset circuit block Reset Detecting voltage 1 circuit Hysteresis voltage 1 Rev.2.00 Jun 14, 2006 page 3 of 6 Test Condition Without load ch1 output ch1 output (3.3 V) detection Cd = 4700 pF VCC = 5 V, VO = 1/2 × VCC IORESET = 4 mA M62294FP VCC Reset Block Timing Chart 5V 3.85 V 3.80 V 0V ch1 output (VO1) t 3.3 V 2.63 V 2.58 V 0V RESET output t note: VO1 tpd tpd tpd 0V t −3 tpd: RESET delay time···················tpd (ms) ≈ 2.13 × 10 × Cd (pF) Rev.2.00 Jun 14, 2006 page 4 of 6 M62294FP Application Circuit (3.3 V and 2.0 V 2-output Voltage DC/DC Converter) VIN (5 V) + Cin 4 VCC VOUT1 (3.3 V) Co1 + R2 8 IN1 Q1 Cout1 1 R1 M62294FP D1 L1 R4 VOUT2 (2.0 V) Co2 Q2 Cout2 3 + R3 5 IN2 RESET Cd GND 7 6 2 L2 3.3 V Line 2.0 V Line MCU etc. The Expression of Circuit Constants Constants TON TOFF (TON + TOFF) MAX TOFF (MIN) TON (MAX) L (MIN) lpk Expressions VO + VF VIN − VCE (sat) − VO 1 fOSC: 110 kHz (VCC = 5 V) fOSC (TON + TOFF) / ( 1 + TON TOFF ) 1 − TOFF fOSC (VIN − VCE (sat) − VO) × TON (MAX) ∆lO lO + 1 ∆lO 2 Note: VF: Forward voltage drop of an external diode. Vsat: Output saturation voltage of an external switching transistor. ∆IO: Set to 1/3 to 1/5 of maximum output current. Choose an external transistor, diode and inductor with peak current rating approximately greater than "Ipk". Rev.2.00 Jun 14, 2006 page 5 of 6 D2 M62294FP Package Dimensions JEITA Package Code P-SOP8-4.4x5-1.27 RENESAS Code PRSP0008DA-A MASS[Typ.] 0.07g E 5 *1 HE 8 Previous Code 8P2S-A F 1 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 4 Index mark c A2 *2 A1 D L A Reference Symbol *3 e bp y D E A2 A1 A bp c Detail F HE e y L Rev.2.00 Jun 14, 2006 page 6 of 6 Dimension in Millimeters Min Nom Max 4.8 5.0 5.2 4.2 4.4 4.6 1.5 0.05 1.9 0.35 0.4 0.5 0.13 0.15 0.2 0° 10° 5.9 6.2 6.5 1.12 1.27 1.42 0.1 0.2 0.4 0.6 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .6.0