N-Channel SMD MOSFET Formosa MS FMSBSS138 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2~3 Rating and characteristic curves........................................................ 4~5 Pinning information........................................................................... 6 Marking ........................................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 N-Channel SMD MOSFET Formosa MS FMSBSS138 50V N-Channel Small Signal MOSFET Package outline SOT-23 0.020 (0.50) (B) 0.012 (0.30) .084(2.10) .068(1.70) 0.120 (3.04) 0.110 (2.80) 0.045 (1.15) • Low On-Resistance : 3.5 Ω • Low Input Capacitance: 40pF • Low Out put Capacitance : 12pF • Low Threshole :1 .5V • Fast Switching Speed : 20ns • In compliance with EU RoHS 2002/95/EC directives. • Suffix "-H" for Halogen-free part, ex. FMS BSS138-H. 0.034 (0.85) Features (C) (A) 0.063 (1.60) 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) 0.108 (2.75) 0.051 (1.30) 0.003 (0.09) Mechanical data 0.007 (0.18) 0.083 (2.10) 0.035 (0.89) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram M aximum ratings (AT T o A =25 C unless otherwise noted) PARAMETER CONDITIONS Drain-source voltage Gate-source voltage SYMBOL MAX. UNIT V DSS MIN. TYP. 50 V V GS ±20 V Continuous drain current T A =25 C ID 200 mA Pulsed drain current t P<=10us I DM 800 mA PD 225 mW R θJA 556 o o Maximum power dissipation T A =25 C Thermal resistance Junction to ambient Operation junction and storage temperature range http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 T J , T STG Page 2 -55 o C/W o +150 C Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 N-Channel SMD MOSFET Formosa MS FMSBSS138 Electrical characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT STATIC(1) V GS = 0V, I D = 250μA Drain-source breakdown voltage V DS = V GS , I D = 1.0mA Gate-source threshold voltage V (BR)DSS 50 V GS(th) 0.5 V GS = 2.75V, I D < 200mA, TA=-40 ° C to + 85 ° C V 1.5 5.6 10 R DS(on) Drain-source on-state resistance Ω V GS = 5.0V, I D = 200mA V DS = 25V, V GS = 0V Zero gate voltage drai n current V DS = 50V, V GS = 0V Gate-source leakage current Forward transconductance V V GS = ± 20V, V DS = 0V V DS=25V, I D=200mA, f=1.0KHZ 3.5 0.1 I DSS ±0 . 1 I GSS g fS μA 0.5 100 μA ms DYNAMIC Input capacitance C iss V DS = 25V, V GS = 0V f = 1.0 MHz Output capacitance Reverse transfer capacitance 40 50 C oss 12 25 C rss 3.5 5.0 pF SWITCHING(2) Turn-On Delay Time V DD = 30V, I D = 200mA t d(on) 20 Turn-Off Delay Time V DD = 30V, I D = 200mA t d(off) 20 ns Note: 1. Pulse Test : PW<=300μs, Duty Cycle<=2% 2. Switching Time is essentially independent of operating temperature. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 Rating and characteristic curves (FMSBSS138) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 Rating and characteristic curves (FMSBSS138) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 N-Channel SMD MOSFET Formosa MS FMSBSS138 Pinning information Pin Simplified outline Symbol D PinD PinG PinS D Drain Gate Source G G S S Marking Type number Marking code J1 FMSBSS138 Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 N-Channel SMD MOSFET Formosa MS FMSBSS138 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 55.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 12.0 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8 N-Channel SMD MOSFET Formosa MS FMSBSS138 Reel packing PACKAGE SOT-23 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3,000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 CARTON (pcs) 382*262*387 APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 8 Document ID Issued Date Revised Date Revision Page. DS-231147 2009/08/10 2011/07/21 C 8