Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 2.0A Surface Mount Schottky Barrier Bridge Rectifiers-20-100V Package outline TO-269AA (MDS) Features • Schottky barrier chips in TO-269AA bridge. • Metal semiconductor junction with guard ring. • Silicon epitaxial planar chips. • Very low forward drop down voltage. • For use in low voltage, high efficiency inverters, + .165(4.2) .150(3.8) ~ free wheeling, and polarity protection applications. .008(0.2) MAX ~ .275(7.0) .031(0.8) .019(0.5) • Lead-free parts meet RoHS requirments. • UL recognized file # E321971 • Suffix "-H" indicates Halogen free parts, ex. MDS22-H. MAX .043(1.1) .027(0.7) .193(4.9) .177(4.5) .106(2.7) .090(2.3) Mechanical data .106(2.7) .090(2.3) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, TO-269AA (MDS) • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.13 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Average Forward rectified current 2.0x2.0”(5.0x5.0mm) copper pad, See Fig.1 Peak Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 100 OC Thermal resistance Diode junction capacitance UNIT I AV 2.0 A I FSM 50 A TYP. 0.5 IR RθJA 75 RθJL 20 f=1MHz and applied 4V DC reverse voltage CJ 150 *1 V RRM (V) V RMS*2 (V) *3 VR (V) MDS22 20 14 20 MDS24 40 28 40 MDS26 60 42 60 MDS28 80 56 80 MDS210 100 70 100 *4 VF (V) 0.50 Operating temperature T J, ( OC) -55 to +125 0.70 0.85 -55 to +150 Page 2 mA 20 Junction to lead T STG http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIN. Junction to ambient Storage temperature SYMBOLS MAX. Symbol O C/W pF O +175 -65 C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage @I F =2.0A per element Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Average Forward Current (A) Fig.1 - Forward Current Derating Curve 2.4 2.0 1.6 MDS22 - MDS24 1.2 MDS26- MDS210 0.8 0.4 0 25 50 75 100 125 150 Peak Forward Surge Current (A) Rating and characteristic curves (MDS22 THRU MDS210) 175 Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 100 10 T J = 25° C 8.3m s single half sine-wave (JEDEC Method) 1 1 10 10 pulse width =300µs 1% duty cycle, T j =25°C MDS22 - MDS24 MDS26 0.1 MDS28 - MDS210 0.01 0 0.2 0.4 0.6 0.8 Fig. 4A - Typical Reverse Characteristics 100 MDS22 - MDS26 T J =125°C T J =100°C 10 T J =75°C 1.0 0.1 T J =25°C 0.01 0.001 0 1.0 20 40 60 80 100 120 140 Instantaneous Forward Voltage (Volts) Percent of Rated Peak Reverse Voltage ( %) Fig. 5 - Typical Junction Capacitance Fig. 4B - Typical Reverse Characteristics 1000 Junction Capacitance (pF) Instantaneous Reverse Current (mA) Fig. 3 - Typical Instantaneour Forward Characteristics 1.0 100 Number of Cycles at 60 Hz 100 T J =25°C f=1.0MHz 10 0.1 1.0 10 100 Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) Lead Temperature (°C) MDS28 -MDS210 T J =150°C 1000 T J =125°C T J =100°C 100 10 1.0 T J =25°C 0.1 0 Reverse Voltage (Volts) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 10000 20 40 60 80 100 Percent of Rated Peak Reverse Voltage ( %) Page 3 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 Pinning information Simplified outline Symbol + + ~ ~ - Marking Type number Marking code MDS22 MDS24 MDS26 MDS28 MDS210 MDS22 MDS24 MDS26 MDS28 MDS210 Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE A B C D TO-269AA (MDS) 0.023 (0.58) 0.030 (0.76) 0.070 (1.78) 0.226 (5.75) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 Packing information P0 d P1 T E F + – W B A P C D D1 D2 W1 unit:mm Item Symbol Tolerance TO-269AA (MDS) Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 5.00 7.24 3.33 1.50 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 Reel packing PACKAGE REEL SIZE TO-269AA (MDS) 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 2,500 8.0 5,000 337*337*37 330 CARTON SIZE (m/m) 350*330*360 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 40,000 11.8 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7 Formosa MS SMD Schottky Bridge Rectifier MDS22 THRU MDS210 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 Document ID Issued Date Revised Date Revision Page. DS-241661 2009/08/10 2011/08/22 C 7