MMBD4148W

Formosa MS
SMD Switching Diode
MMBD4148W
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Formosa MS
SMD Switching Diode
MMBD4148W
200mW Surface Mount Switching
Diode-100V
Package Outline
0.012 (0.30)
(B)
0.016 (0.40)
0.026 (0.65)Max
.056(1.40)
.048(1.20)
•
standards of MIL-STD-19500 /228
Suffix "-H" indicates Halogen-free part, ex.MMBD4148W-H.
SOT-323
0.072 (1.80)
• Fast switching speed.
• Electrically identical to standard JEDEC.
• Surface mount package ideally suited for automatic insertion.
• Tiny plastic SMD package.
• High Conductance.
• Silicon epitaxial planar chip.
• Lead-free parts for green partner, exceeds environmental
0.088 (2.20)
Features
(C)
(A)
0.054 (1.35)
0.017 (0.42)Min.
0.046 (1.15)
0.096 (2.40)
0.040 (1.00)
0.004 (0.10)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-323
• Terminals : Solder plated, solderable per
0.010(0.25)
0.080 (2.00)
Mechanical data
0.032 (0.80)
MIL-STD-750, Method 2026
• Mounting Position : Any
• Weight : Approximated 0.006 gram
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
Symbol
MMBD4148W
UNIT
Reverse voltage
VR
75
V
Peak reverse voltage
V RM
100
V
RMS voltage
V RMS
53
V
Maximum DC blocking voltage
V DC
75
V
Maximum average forward current at T A = 25 oC
Io
150
mA
Peak forward surge current, 1.0us
1.0s
I FSM
2.0
1.0
A
Power Dissipation derate above 25 oC
PD
200
mW
Maximum forward voltage
VF
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V
Maximum DC reverse current at rated DC blocking voltage T J = 25 oC
IR
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uA
Typical Junction capacitance (Notes 1)
CD
2.0
pF
Maximum reverse recovery time (Notes 2)
t rr
4.0
ns
Typical thermal resistance junction to ambient
R θJA
625
Operating junction temperature range
TJ
-55 to +150
o
C
Storage temperature range
T STG
-55 to +150
o
C
o
C/W
Notes :
1. C J at V R = 0V, f = 1MHZ
2. I F = I R = 10mA to I rr = 0.1 x I R, R L = 100ohm
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TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Rating and characteristic curves (MMBD4148W)
Fig. 1 TYPICAL FORWARD CHARACTERISTICS
Fig. 2 TYPICAL LEAKAGE CURRENT
VS. JUNCTION TEMPERATURE
10000
REVERSE CURRENT : (nA)
FORWARD CURRENT : (mA)
1000
100
10
1.0
0.1
1000
100
10
V R = 20V
0.01
0.2
0.4
0.6
0.8
1.0
1
1.2
100
0
200
O
JUNCTION TEMPERATURE : ( C)
FORWARD VOLTAGE : (V)
Fig. 4 POWER DERATING CURVE
FIG.3-TYPICAL JUNCTION CAPACITANCE
P D, Power Dissipation (mW)
DIODE CAPACITANCE (pF)
0.68
0.64
0.60
0.56
0.52
0
2
4
6
200
150
100
50
0
0
8
REVERSE VOLTAGE : (V)
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250
25
50
75
100
125
150
o
AMBIENT TEMPERATURE ( C )
Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Formosa MS
SMD Switching Diode
MMBD4148W
Pinning information
Type number
Simplified outline
Marking code
(A)
MMBD4148W
Symbol
(B)
A
B
A2
(C)
C
Suggested solder pad layout
SOT-323
0.025(0.65)
0.025(0.65)
0.063(1.6)
0.031(0.80)
0.075(1.90)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Formosa MS
SMD Switching Diode
MMBD4148W
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-323
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.36
2.40
1.20
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Formosa MS
SMD Switching Diode
MMBD4148W
Reel packing
PACKAGE
SOT-323
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
3,000
4.0
30,000
183*183*123
178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7
Formosa MS
SMD Switching Diode
MMBD4148W
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
MIL-STD-750D
METHOD-1051
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
Peak Forward Surge Current
MIL-STD-750D
METHOD-4066-2
9. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
10. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
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TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221940
2009/08/10
2010/03/10
B
7