Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) 500mW Surface Mount Switching Diode- 100V Package outline Features SOD-80 • Fast speed switching. • Silicon epitaxial planar chip structruction. • Hermetically sealed glass. • Small surface mounting type. • Lead-free parts meet RoHS requirments. .146(3.7) .130(3.3) SOLDERABLE ENDS .019(.48) .011(.28) .063(1.6) .055(1.4) Mechanical data • Case : GLASS MINI-MELF / SOD-80 • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.03 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER CONDITIONS T A=25 oC unless otherwise noted) Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RRM 100 V Reverse voltage VR 75 V I FSM 2000 mA Non-repetitive peak forward current I FM 450 mA Average forward current I FAV 150 mA Power dissipation PD 500 mW Junction temperature TJ Peak forward surge current t p = 1 us Storage temperature T STG I F = 5 mA VF I F = 100 mA -55 -65 o C +150 o C 0.72 V VF 1.00 V V R = 20 V IR 25 nA o V R = 20 V , T J = 150 C IR 50 uA V R = 75 V IR 5.0 uA Diode capacitance V R = 0 V , f = 1MHz CD 4.0 pF Reverse recovery time I F = 10 mA , V R = 6V , I RR = 1mA , R L = 100Ω t rr 4.0 ns Forward voltage Reverse current http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 0.62 +150 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Total Capacitance,(pF) Power Passipation, (mW) Rating and characteristic curves (LL4448 / MM4448) Reverse Voltage,(V) Reverse Voltage,(V) Leakage Current ,(nA) Temperature,(℃) Reverse Voltage ,(V) Forward Voltage ,(mV) Forward Voltage ,(mV) Reverse Current ,(uA) Forw ard Current, (mA) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Forw ard Current ,(mA) Page 3 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code LL4448 cathode band only Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-80 0.071(1.80) 0.035(0.90) 0.102(2.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 2.00 3.70 1.80 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 178.00 50.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Item SOD-80 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) Reel packing PACKAGE SOD-80 REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) 7" 2,500 4.0 BOX (pcs) INNER BOX (m/m) 25,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 200,000 9.6 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7 Formosa MS Glass Sealed SMD Switching Diode LL4448 (MM4448) High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 Peak forward surge current t p = 1 us MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-221946 2009/08/10 2011/07/22 B 7