Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 2.0A Surface Mount Low VF Schottky Barrier Bridge Rectifiers-20-100V Package outline MDLS Features .106(2.7) .090(2.3) free ~ ~ + – wheeling, and polarity protection applications. .004(0.1) max. .236(6.0) .220(5.6) .275(7.00) .260(6.60) • Schottky barrier chips in TO-269AA bridge. • Metal semiconductor junction with guard ring. • Silicon epitaxial planar chips. • Very low forward drop down voltage. • For use in low voltage, high efficiency inverters, .012(0.3) .004(0.1) .063(1.6) .047(1.4) .035(0.9) .019(0.5) • Suffix "-H" indicates Halogen-free part, ex.MDLS22-H. • Lead-free parts meet RoHS requirments. • UL recognized file # E321971 .197(5.00) .181(4.60) .043(1.10) .020(0.50) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic low profile SMD mini-dip (MDLS) bridge case Dimensions in inches and (millimeters) • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.12 gram Maximum ratings (AT T A=25 oC unless otherwise noted) PARAMETER CONDITIONS Average Forward rectified current 2.0x2.0”(5.0x5.0mm) copper pad, See Fig.1 Peak Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T A = 25 OC Reverse current V R = V RRM T A = 100 OC Thermal resistance Diode junction capacitance UNIT I AV 2.0 A I FSM 50 A TYP. 0.5 IR RèJA 85 RèJL 20 f=1MHz and applied 4V DC reverse voltage CJ 150 *1 V RRM (V) V RMS*2 (V) *3 VR (V) MDLS22 20 14 20 MDLS24 40 28 40 MDLS26 60 42 60 MDLS28 80 56 80 MDLS210 100 70 100 *4 VF (V) 0.50 Operating temperature T J, ( OC) -55 to +125 O pF +175 -65 C/W O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage 0.70 0.85 mA 20 Junction to lead T STG http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIN. Junction to ambient Storage temperature SYMBOLS MAX. Symbol -55 to +150 Page 2 per element at 2.0A peak Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Average Forward Current (A) Fig.1 - Forward Current Derating Curve 2.4 MDLS28 - MDLS210 2.0 1.6 MDLS22 - MDLS26 1.2 0.8 single phase half wave 60Hz 0.4 resistive or inductive load 3.75"(9.5mm) lead length 0 25 50 75 100 125 150 Peak Forward Surge Current (A) Rating and characteristic curves (MDLS22 THRU MDLS210) 175 Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 100 10 O T L =110 C 8.3mS single half sine-wave (JEDEC Method) 1 1 10 10 pulse width =300µS 1% duty cycle, Tj =25°C MDLS22 - MDLS24 MDLS26 0.1 MDS28 - MDS210 0.01 0 0.2 0.4 0.6 0.8 Fig. 4A - Typical Reverse Characteristics 100 MDLS22 - MDLS26 10 T J =125°C T J =100°C 1.0 T J =75°C 0.1 0.01 0.001 0 1.0 T J =25°C 20 40 60 80 100 120 140 Instantaneous Forward Voltage (Volts) Percent of Rated Peak Reverse Voltage ( %) Fig. 5 - Typical Junction Capacitance Fig. 4B - Typical Reverse Characteristics 1000 Junction Capacitance (pF) Instantaneous Reverse Current (mA) Fig. 3 - Typical Instantaneour Forward Characteristics 1.0 100 Number of Cycles at 60 Hz 100 T J =25°C f=1.0MHz 10 0.1 1.0 10 100 Instantaneous Reverse Current (µA) Instantaneous Forward Current (A) Lead Temperature ( °C) MDLS28 -MDLS210 1000 T J =150°C T J =125°C 100 T J =100°C 10 1.0 T J =25°C 0.1 0 Reverse Voltage (Volts) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 10000 20 40 60 80 100 Percent of Rated Peak Reverse Voltage ( %) Page 3 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Pinning information Simplified outline ~ ~ + – Symbol + ~ ~ – Marking Type number Marking code MDLS22 MDLS24 MDLS26 MDLS28 MDLS210 MDLS22 MDLS24 MDLS26 MDLS28 MDLS210 Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE A B C D MDLS 0.059 (1.50) 0.047 (1.20) 0.157 (4.00) 0.291 (7.40) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Packing information P0 d P1 E F W B A P C D D1 D2 W1 unit:mm Item Symbol Tolerance MDLS Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 1.5 1.0 1.0 1.0 0.5 0.1 0.05 0.1 0.1 0.25 0.1 0.15 0.50 5.05 7.01 1.70 1.50 330.00 75.00 178.0054.00 13.50 1.75 5.50 8.00 4.00 2.00 0.25 12.00 13.5 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Reel packing and tube packing PACKAGE REEL SIZE 13" MDLS REEL (pcs) COMPONENT SPACING (m/m) 5,000 8.0 BOX (pcs) 10,000 INNER BOX (m/m) REEL DIA, (m/m) 337*337*40 330 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 355*355*355 80,000 18.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 7 Document ID Issued Date DS-241658 2009/08/10 Revised Date - Revision Page. A 7