FM10L45-T7B

SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
Package outline
TO-277B
10.0A Surface Mount
Schottky Barrier Rectifiers-45V
0.170 (4.30)
0.148 (3.75)
0.264 (6.70)
0.250 (6.35)
1
Features
• High Current Density Schottky.
• Low Forward Voltage Drop
• Excellent High Temperature Stability
• Soft, Fast Switching Capability
• Lead Free Finish,RoHS Compliant
• Suffix "-H" indicates Halogen free parts, ex. FM10L45-Τ7Β-H.
0.077 (1.95)
0.065 (1.65)
2
3
0.217 (5.50)
0.207 (5.25)
0.077 (1.95)
0.065 (1.65)
0.029 (0.75)
0.018 (0.45)
0.017 (0.43)
0.006 (0.15)
0.052 (1.30)
0.040 (1.00)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : TO-277B ,molded Plastic
• Terminals: Matte Tin Finish Annealed Over Copper Leadframe.
0.041 (1.05)
0.029 (0.75)
0.041 (1.05)
0.029 (0.75)
Solderable Per MIL-STD-202,Method 208
0.140 (3.55)
0.120 (3.05)
0.052 (1.30)
0.029 (0.75)
• Weight:0.1 grams(approx)
Dimensions in inches and (millimeters)
Maximum ratings (AT
T A=25 C unless otherwise noted)
FM10L45-T7B
Symbol
Parameter
PIN 1
PIN 3
PIN 2
o
Unit
DC Blocking Voltage
Working Peak Reverse Voltage
Repetitive Peak Reverse Voltage
V DC
V RWM
V RRM
45
V
RMS Reverse Voltage
V RMS
31.5
V
Average Forward Rectified Current
I F(AV)
10.0
A
Peak Forward Surge Current, 8.3ms single half
sine-wave (TA=25 ° C)
I FSM
180
A
Operating junction temperature range
TJ
-55 to +150
O
Storage temperature range
T STG
-55 to +150
O
Electrical Characteristics
Parameter
Reverse Breakdown Voltage
Forward voltage
C
(AT T A=25 oC unless otherwise noted)
Test Conditions
Symbol
MIN.
TYP.
I R =0.5mA,T J =25 ° C
VB
45
-
-
I F =1.0A,T J =25 ° C
-
0.28
-
MAX.
I F =2.0A,T J =25 ° C
-
0.32
-
I F =3.0A,T J =25 ° C
-
0.34
-
I F =5.0A,T J =25 ° C
-
0.38
-
-
0.46
0.48
-
0.16
-
I F =10.0A,T J =25 ° C
I F =1.0A,T J =125 ° C
Reverse current
C
VF
I F =2.0A,T J =125 ° C
-
0.21
-
I F =3.0A,T J =125 ° C
-
0.25
-
I F =5.0A,T J =125 ° C
-
0.31
-
I F =10.0A,T J =125 ° C
-
0.44
-
-
0.1
0.5
-
60
-
V R =45V,T J =25 ° C
V R =45V,T J =125 ° C
IR
Unit
V
V
mA
Thermal Characteristics
Parameter
Typical thermal resistance junction to ambient (Note 1)
Typical thermal resistance junction to case (Note 1)
Symbol
FM10L45-T7B
R θJA
R θJC
17
3
Unit
°C/W
°C/W
Note 1: Mounted on FR-4 PCB copper pad area . Cathode pad dimensions 4.95mm x 3.4mm. Anode pad dimensions 1.55mm x 5.0mm.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
Rating and characteristic curves
TYPICAL REVERSE LEAKAGE CHARACTERISTICS
TYPICAL FORWARD CHARACTERISTICS
100
20
Tj=125℃
REVERSE CURRENT , (mA)
FORWARD CURRENT ,(A)
10
Tj=125℃
1
Tj=75℃
Tj=100℃
Tj=50℃
Tj=25℃
0.1
0.01
0. 0
0.1
0.2
0.3
0.4
0.5
Tj=100℃
10
Tj=75℃
1
Tj=50℃
0.1
Tj=25℃
0.01
5
0.6
10
15
FORWARD VOLTAGE, (V)
AVERAGE FORWARD CURRENT,(A)
100
10
30
REVERSE VOLTAGE, (V)
8
6
4
2
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE,(°C)
MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,(A)
JUNCTION CAPACITANCE,(pF)
Ta=25 ℃
f=1MHz
10
45
10
10000
1
1
40
TYPICAL FORWARD CURRENT DERATING CURVE
TYPICAL JUNCTION CAPACITANCE
1000
20
25
30
35
REVERSE VOLTAGE, (V)
240
210
Ta=25°C
8.3ms Single
Half Sine-Wave
180
150
120
90
60
30
0
1
5
10
NUMBER OF CYCLES AT 60Hz
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TEL:886-2-22696661
FAX:886-2-22696141
50
Page 3
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
Pinning information
Pin
Simplified outline
PIN 1 anode
PIN 3 anode
PIN 2 cathode
Symbol
1
2
3
PIN 1
PIN 3
PIN 2
Marking
H10Q45
YMDX
Note 1: YMDX = Date code
Suggested solder pad layout
TO-277B
0.185 (4.70)
0.031 (0.80)
0.035 (0.90)
0.142 (3.60)
0.055 (1.40)
0.152 (3.87)
0.260 (6.60)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
TO-277B
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
4.54
6.80
1.33
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
Reel packing
PACKAGE
TO-277B
REEL SIZE
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
5,000
8.0
BOX
(pcs)
10,000
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
337*337*37
330
CARTON
SIZE
(m/m)
CARTON
(pcs)
350*330*360
APPROX.
GROSS WEIGHT
(kg)
18.0
80,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<3 C /sec
o
o
Time 25 C to Peak Temperature
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
<6minutes
Page 6
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
FM10L45-T7B
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
Revised Date
Revision
DS-22163T
2013/10/21
2014/12/03
B
Page.
7