Formosa MS SKFM1020Y-D THRU SKFM10100Y-D

SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
10.0A Surface Mount Schottky Barrier
Rectifiers - 20V-100V
Package outline
Features
• Batch process design, excellent power dissipation offers
DPAK
better reverse leakage current and thermal resistance.
• Low power loss, high efficiency.
• High current capability, l ow forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
0.264(6.70)
0.248(6.30)
0.048(1.20)
0.031(0.80)
0.098(2.50)
0.083(2.10)
0.217(5.50)
0.201(5.10)
0.024(0.60)
0.016(0.40)
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free part, ex.SKFM1020Y-D-H.
0.244(6.20)
0.228(5.80)
0.114(2.90)
0.098(2.50)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, TO-252 / DPAK
• Terminals : Solder plated, solderable per
0.039(1.00)
0.031(0.80)
0.185(4.70)
0.169(4.30)
0.024(0.60)
0.016(0.40)
0.032(0.80)
0.016(0.40)
MIL-STD-750, Method 2026
Dimensions in inches and (millimeters)
• Mounting Position : Any
• Weight : Approximated 0.34 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
MAX.
UNIT
IO
10.0
A
I FSM
150
A
Symbol
MIN.
TYP.
O
V R = V RRM T J = 25 C
Reverse current
O
V R = V RRM T J = 100 C
f=1MHz and applied 4V DC reverse voltage
Diode junction capacitance
Storage temperature
V RMS*2
(V)
*3
VR
(V)
SKFM1020Y-D
20
14
20
SKFM1040Y-D
40
28
40
SKFM1045Y-D
45
31.5
45
SKFM1050Y-D
50
35
50
SKFM1060Y-D
60
42
60
SKFM1080Y-D
80
56
80
SKFM10100Y-D
100
70
100
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*4
VF
(V)
Operating
temperature
T J, ( OC)
0.55
-55 to +125
20
mA
700
CJ
T STG
*1
V RRM
(V)
SYMBOLS
0.5
IR
-65
pF
+175
O
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward [email protected] I F = 10.0A
0.70
0.85
-55 to +150
Page 2
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
Rating and characteristic curves (SKFM1020Y-D THRU SKFM10100Y-D)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
FIG.2-TYPICAL FORWARD
0
0
20
40
60
80
100
120
140
160
180
200
CASE TEMPERATURE,(°C)
PEAK FORWARD SURGE CURRENT,(A)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
V
0V
00
~1
80
-D
00Y
01
M1
KF
D
5Y-
104
2
~6
S
D~
FM
SK
D~
0Y-
4
10
50
0Y-
102
6
20
~4
5V
8
INSTANTANEOUS FORWARD CURRENT,(A)
105
FM
SK
10
FM
SK
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
12
1.0
0.1
o
TJ=25 C
175
Pulse Width 300us
1% Duty Cycle
8.3ms Single Half
TJ=25 C
Sine Wave
150
.01
JEDEC method
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
FORWARD VOLTAGE,(V)
125
100
75
FIG.4- TYPICAL REVERSE
50
CHARACTERISTICS
100
25
1
20V~45V
50V~100V
100
10
NUMBER OF CYCLES AT 60Hz
10
REVERSE LEAKAGE CURRENT, (mA)
FIG.5-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE,(pF)
2800
2400
2000
1600
1200
800
TJ=100°C
1.0
0.1
TJ=25°C
0.01
400
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
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0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
Page 3
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
Pinning information
Simplified outline
Symbol
2=4
4
1
2
3
1
3
Marking
Type number
Marking code
SKFM1020Y-D
SKFM1040Y-D
SKFM1045Y-D
SKFM1050Y-D
SKFM1060Y-D
SKFM1080Y-D
SKFM10100Y-D
SK1020Y
SK1040Y
SK1045Y
SK1050Y
SK1060Y
SK1080Y
SK10100Y
Suggested solder pad layout
X1
PACKAGE
C
Y1
L
C
Y2
DPAK
0.272(6.90)
E
0.091(2.30)
L
0.457(11.60)
X1
0.276(7.00)
X2
0.059(1.50)
Y1
0.276(7.00)
Y2
0.098(2.50)
X2
Dimensions in inches and (millimeters)
E
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TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
DPAK
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
6.90
10.50
2.70
1.50
330.00
50.00
13.00
1.75
7.50
8.00
4.00
2.00
0.23
16.00
22.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
Reel packing
PACKAGE
REEL SIZE
DPAK/TO-252
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
3,000
8.0
6,000
335*335*43
330
CARTON
SIZE
(m/m)
CARTON
(pcs)
350*330*360
APPROX.
GROSS WEIGHT
(kg)
22.0
48,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<3 C /sec
o
o
Time 25 C to Peak Temperature
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TEL:886-2-22696661
FAX:886-2-22696141
<6minutes
Page 6
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7
SMD Schottky Barrier Rectifier
Formosa MS
SKFM1020Y-D THRU SKFM10100Y-D
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=125 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
DS-12160V
2008/02/10
Revised Date
2011/11/18
Revision
E
Page.
7