Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 10.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V Package outline Features SMC-T3 • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. 0.264(6.7) 0.248(6.3) • Low profile surface mounted application in order to • • • • • • • • 0.020(0.5) Typ. optimize board space. Low power loss, high efficiency. High current capability, l ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. FM1020-Τ3-H. 0.185(4.7) 0.170(4.3) 0.067(1.7) 0.059(1.5) 0.047(1.2) Typ. 0.047(1.2) Typ. Mechanical data 0.120(3.05) 0.104(2.65) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AB / SMC-T3 • Terminals : Solder plated, solderable per 0.041(1.05) 0.026(0.65) 0.142(3.60) 0.126(3.20) MIL-STD-750, Method 2026 0.063(1.6) Typ. • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.1443gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave (JEDEC methode) Symbol MIN. TYP. O Diode junction capacitance V R = V RRM T J = 100 C f=1MHz and applied 4V DC reverse voltage Storage temperature 10.0 A I FSM 150 A *1 V RRM (V) V RMS*2 (V) *3 VR (V) FM1020-T3 20 14 20 FM1030-T3 30 21 30 FM1040-T3 40 28 40 FM1045-T3 45 31.5 45 FM1050-T3 50 35 50 *4 VF (V) Operating temperature T J, ( OC) 0.55 -55 to +125 50 mA 700 CJ -65 pF +175 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 FM1060-T3 60 42 60 FM1080-T3 80 56 80 FM10100-T3 100 70 100 FM10150-T3 150 105 150 0.90 FM10200-T3 200 140 200 0.92 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.5 IR T STG SYMBOLS UNIT IO O V R = V RRM T J = 25 C Reverse current MAX. 0.85 *4 Maximum forward voltage@I F=10.0A -55 to +150 Document ID Page 2 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Rating and characteristic curves (FM1020-T3 THRU FM10200-T3) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 0-T 3~F M10 2 -T3 3 5-T 104 200 4 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 10 150 V-2 00V 105 M 3~F 0-T 102 6 INSTANTANEOUS FORWARD CURRENT,(A) FM 8 20V -45 V 50V -60 V 80V -10 0V 50 10 FM AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 12 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 PEAK FORWARD SURGE CURRENT,(A) 250 .01 200 .1 .3 .7 .9 1.1 1.3 1.5 150 8.3ms Single Half TJ=25 C Sine Wave 100 JEDEC method 50 FIG.5 - TYPICAL REVERSE CHARACTERISTICS 0 1 5 50 10 100 100 20V~45V 50V~200V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE 2800 JUNCTION CAPACITANCE,(pF) .5 FORWARD VOLTAGE,(V) 2400 2000 1600 1200 800 TJ=100°C 1.0 0.1 TJ=25°C 0.01 400 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Document ID Page 3 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM1020-T3 FM1030-T3 FM1040-T3 FM1045-T3 FM1050-T3 FM1060-T3 FM1080-T3 FM10100-T3 FM10150-T3 FM10200-T3 SS102 SS103 SS104 SS104 SS105 SS106 SS108 SS110 S1015 S1020 Suggested solder pad layout SMC-T3 0.016(0.4) 0.112(2.85) 0.063(1.60) 0.142(3.60) 0.197(5.00) 0.063(1.60) 0.025(0.65) 0.175(4.45) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMC-T3 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 4.85 6.95 1.85 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 Reel packing PACKAGE SMC-T3 REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 337*337*37 330 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 350*330*360 17.2 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <3 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 6 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM1020-T3 THRU FM10200-T3 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=125 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Document ID Page 7 DS-121638 Issued Date 2013/04/25 Revised Date - Revision A Page. 7