Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 2.0A Surface Mount Schottky Barrier Rectifiers-20V-200V Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • • • SMA better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, l ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. FM220-H. 0.196(4.9) 0.180(4.5) 0.012(0.3) Typ. 0.106(2.7) 0.091(2.3) 0.068(1.7) 0.060(1.5) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA • Terminals : Solder plated, solderable per 0.032(0.8) Typ. 0.032 (0.8) Typ. Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) Symbol CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave (JEDEC methode) MIN. TYP. O V R = V RRM T J = 100 C Thermal resistance Junction to ambient Junction to case Diode junction capacitance 2.0 A I FSM 50 A f=1MHz and applied 4V DC reverse voltage V RMS*2 (V) *3 VR (V) FM220 20 14 20 FM230 30 21 30 FM240 40 28 40 FM250 50 35 50 FM260 60 42 60 *4 VF (V) Operating temperature T J, ( OC) 0.50 -55 to +125 60 30 O C/W pF 160 CJ -65 +175 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 FM280 80 56 80 FM2100 100 70 100 FM2150 150 105 150 0.90 FM2200 200 140 200 0.92 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 mA 10 T STG *1 V RRM (V) SYMBOLS 0.5 IR R θJA R θJC Storage temperature UNIT IO O V R = V RRM T J = 25 C Reverse current MAX. 0.85 *4 Maximum forward voltage@I F=2.0A -55 to +150 Page 2 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Rating and characteristic curves (FM220 THRU FM2200) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 50 2.0 FM 1.2 INSTANTANEOUS FORWARD CURRENT,(A) 1.6 0 00 24 0.8 22 FM FM 0~ 0~ 22 25 FM AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 2.4 0.4 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 20V ~ 40V 10 50V ~ 60V 80V ~ 100V 3.0 150V~200V 1.0 0.1 TJ=25 C Pulse Width 300us 1% Duty Cycle PEAK FORWARD SURGE CURRENT,(A) 50 .01 40 .1 .3 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 FIG.5 - TYPICAL REVERSE 0 1 5 50 10 CHARACTERISTICS 100 100 20V~40V 50V~200V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE 700 JUNCTION CAPACITANCE,(pF) .5 600 500 400 300 200 TJ=100°C 1.0 0.1 TJ=25°C 0.01 100 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Page 3 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM220 FM230 FM240 FM250 FM260 FM280 FM2100 FM2150 FM2200 SK22 SK23 SK24 SK25 SK26 SK28 S210 S215 S220 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.00 1.90 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA 7" 2,000 4.0 20,000 183*155*183 178 382*356*392 160,000 16.0 SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition o Average ramp-up rate(T L to T P ) <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 C o 200 C 60~120sec o Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM220 THRU FM2200 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=125 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date DS-121622 2008/02/10 Revised Date 2010/03/10 Revision D Page. 7