Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W 30mA Surface Mount Small Signal Schottky Diodes - 40V~ 45V Package outline 0.016 (0.40) .056(1.40) .048(1.20) 0.026 (0.65)Max standards of MIL-STD-19500 /228 0.072 (1.80) 0.088 (2.20) • Low current rectification • Tiny surface mount type. • Extremely fast switching speed. • Low forward voltage drop • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental (B) 0.012 (0.30) SOT-323 Features (C) (A) 0.054 (1.35) 0.017 (0.42)Min. 0.046 (1.15) 0.096 (2.40) Mechanical data 0.040 (1.00) 0.004 (0.10) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-323 • Terminals : Solder plated, solderable per 0.010(0.25) 0.080 (2.00) 0.032 (0.80) MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.006 gram Maximum ratings (T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MMBD706W MMBD715W MMBD717W UNIT Repetitive peak reverse voltage V RRM 45 40 V Reverse voltage Peak Repetitive forward current VR I FSM 45 40 V 60HE for 1 cycle 200 mA mA Average forward current IF 30 Junction temperature TJ -55 ~ +125 o C Storage temperature T STG -65 ~ +175 o C Electrical Characteristics (T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Reverse Breakdown Voltage MMBD706W MMBD715W/MMBD717W I R = 10µA Forward voltage Symbol V (BR)R I F = 1.0 mA VF Diode capacitance V R = 1 V, f = 1MH z CD Reverse leakage current V R = 10 V http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Min. Typ. Max. 45 40 V V 0.37 pF 2.0 IR Page 2 UNIT µA 0.5 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W Rating and characteristic curves for each diode (MMBD706W / 715W / 717W) Fig.1-Derating Curve h 100 h 120 Fig.2-Typical Junction Capacitance Junction Capacitance, CD(pF) 50 Percentage of Current,(%) 100 80 60 40 20 0 0 25 150 75 100 125 20 10 5 2 1 150 0 2 100 Fig.3 - Leakage Current 1000 8 10 12 14 Fig.4-Typical Forward Characteristics (1) (2) (3) (4) 100 FORWARD CURRENT,(mA) 10 Reverse Current, IR (A) 6 handbook, halfpage (1) (2) 1 (3) 0.1 0.01 0.001 0 4 Reverse Voltage, VR(Volts) Ambient Temperature, TA(°C) 10 15 20 1 0.1 0.01 (4) 5 10 25 0.001 0 30 0.2 (1) TA = 125 OC (2) TA = 85 OC (1) TA = 125 OC (3) TA = 25 OC (4) T = -25°C http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.4 0.6 0.8 1.0 1.2 1.4 Forward Voltage, VF(Volts) Reverse Voltage, VR(Volts) A Page 3 (2) TA = 85 OC (3) TA = 25 OC (4) T = -25°C A Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W Pinning information Type number Symbol Marking code A MMBD706W B JF, 3J C A MMBD715W B JD, 3D C A MMBD717W B JE, 3E C Suggested solder pad layout SOT-323 0.025(0.65) 0.025(0.65) 0.063(1.6) 0.031(0.80) 0.075(1.90) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-323 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.36 2.40 1.20 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W Reel packing PACKAGE REEL SIZE SOT-323 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7 Formosa MS SMD Schottky Barrier Diode MMBD706W / 715W / 717W High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 7 Document ID Issued Date Revised Date DS-22161U 2009/02/10 2009/02/10 Revision Page. B 7