Formosa MS SMD Switching Diode MMBD914 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Formosa MS SMD Switching Diode MMBD914 200mA Surface Mount Switching Diode-100V Package outline • Low Rever Leakage Current . • High Speed <4ns. • Small Outline Surface Mount SOT-23 Package . • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free parts, ex. ΜΜΒD914-H. (B) (C) (A) 0.063 (1.60) Mechanical data 0.012 (0.30) 0.020 (0.50) .084(2.10) .068(1.70) 0.110 (2.80) 0.120 (3.04) 0.045 (1.15) SOT-23 0.034 (0.85) Features 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) 0.108 (2.75) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.051 (1.30) 0.003 (0.09) 0.007 (0.18) 0.083 (2.10) 0.035 (0.89) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER Symbol Reverse voltage Peak forward surge current T A=25 oC unless otherwise noted) t=1s Forward current MIN. TYP. MAX. UNIT VR 100 Vdc I FM(surge) 0.5 Adc IF 200 mAdc Maximum Forward voltage I F = 10 mAdc VF 1.00 Vdc Maximum Reverse voltage leakage current V R = 20 Vdc IR 25 nAdc V R = 75Vdc IR 5 uAdc Maximum Diode capacitance V R = 0 V , f = 1MHz CT 4.0 pF Maximum Reverse recovery time I F = I R = 10mAdc t rr 4.0 ns 225 mW 1.8 mW/ oC Total device dissipation FR-5 board o T A =25 C PD o Derate above 25 C Typical Thermal resistance Total device dissipation alumina substrate(2) Typical Thermal resistance Junction to ambient R θJA o T A =25 C PD o Derate above 25 C Junction to ambient R θJA TJ Operating Junction Temperature Range T STG Storage Temperature Range o 556 300 mW 2.4 mW/ oC o 417 -55 -55 C/W C/W +150 o C +150 o C 1. FR-5=1.0x0.75x0.062 in 2.Alumina=0.4x0.3x0.024 in. 99.5% alumina. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Rating and characteristic curves (MMBD914) 820 OHM +10V 2K 100uH 0.1 uF IF tp tr IF t 0.1 uF t t rr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA IR VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. Notes: Notes: FIG.1 Recovery Time Equivalent Test Circuit Notes: FIG.2-FORWARD VOLTAGE FIG.3 - LEAKAGE CURRENT REVERSE LEAKAGE CURRENT, (uA) C O 0 -4 J = 85 O T C J = 10 TJ = 25 O C T IF, FORWARD CURRENT,(mA) 100 1 10 T J = 150 OC 1.0 T J = 125 OC 0.1 T J = 85 OC T J = 55 OC 0.01 T J = 25 OC 0.1 0.2 0.4 0.6 0.8 0.001 1.2 1.0 0 VF, FORWARD VOLTAGE,(V) 10 20 30 40 50 VR, REVERSE VOLTAGE, (V) FIG.4-DIODE CAPACITANCE 0.68 CD, DIODE CAPACITANCE,(pF) h 0.64 0.60 0.56 0.52 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Formosa MS SMD Switching Diode MMBD914 Pinning information Type number Simplified outline Symbol Marking code (A) MMBD914 (B) A B 5D (C) C Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Formosa MS SMD Switching Diode MMBD914 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Formosa MS SMD Switching Diode MMBD914 Reel packing PACKAGE SOT-23 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7 Formosa MS SMD Switching Diode MMBD914 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge JESD22-A102 15P SIG at T A=121 OC for 4 hrs. -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 Peak forward surge current MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision DS-221924 2009/02/10 2010/08/10 B Page. 7