Formosa MS ESD5Zxx SERIES

Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
Surface Mount Uni-Directional TVS
For ESD Protection Diode - 3.3V - 5.0V
Package outline
Features
• Stand−off Voltage: 3.3V~5.0V
• Peak Power up to 200 [email protected] x 20 u s Pulse
• Low Leakage
• Response Time is Typically < 1 ns
• ESD rating of class 3 ( > 16kV) per human body Model
• IEC61000-4-2 level 4 ESD protection
• IEC61000-4-4 level 4 FET protection
• Lead-free parts meet environmental standards of
0.014(0.35)
0.009(0.25)
0.035(0.90)
0.028(0.70)
SOD-523FL
0.051(1.30)
0.043(1.10)
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free part, ex.ESD5Z2.5-H
0.028(0.70)
0.020(0.50)
0.007(0.20)
0.002(0.05)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-523FL
• Terminals : Solder plated, solderable per
0.067(1.70)
0.059(1.50)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.002 gram
Dimensions in inches and (millimeters)
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Total power dissipation
Symbol
Value
UNIT
P PP
200
W
Peak Pulse Power (tp = 8/20us)
±15
Electrostatic discharge
IEC61000-4-2 Air discharge
IEC61000-4-2 Contact discharge
ESD voltage
Per Human Body Model
16
Electrostatic discharge
IEC61000-4-4
40
kV
±8
kV
A
Lead solder temperature-maximum 10 second duration
TL
260(10s)
o
C
Junction Temperature
TJ
+150
o
C
Storage temperature
T STG
-55~+150
o
C
Operating Temperature
T OP
-40~+125
o
C
Electrical characteristics (at T =25 C unless otherwise noted, V F = 0.9V Max.
o
A
Part No.
V RWM
(V)
I R(uA)
@V RWM
V BR(V)@I T
(Note 2)
Max
Max
Min
IT
(mA)
ESD5Z3.3
3.3
1.0
5.0
1.0
ESD5Z5.0
5.0
1.0
6.2
1.0
@ I F =10mA for all types )
V C(V)(Note 1)
@ I PP=5.0A
I PP(A)
(Note 1)
V C(V)(Note 1)
@Max I PP
Typ
Max
Max
P PK
(W)
(Note 1)
Max
8.4
11.2
14.1
158
11.6
9.4
18.6
174
C(pF)
Typ
105
80
Note 1. Surge current waveform per Fig.1
2. V BR is measured with a pulse test current I T at an ambient temperature of 25°C.
Http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
Typical characteristics (at T =25 C unless otherwise noted)
o
A
I
IF
V C V BR V RWM
IR
IT
V
VF
I PP
Uni-Directional TVS
V C : Clamping Voltage @ I PP
I PP : Maximum Reverse Peak Pulse Current
V RWM : Working Peak Reverse voltage
I R : Maximum Reverse Leakage Current @V RWM
V BR : Breakdown voltage @I T
I T : Test Current
P PK : Peak Power Dissipation
I F : Forward Current
V F : Forward Voltage @ I F
C : Max. Capacitance @V R = 0 and f = 1MHz
Rating and characteristic curves (ESD5Zxx SERIES)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
Application Note
Electrostatic discharge (ESD) is a major cause of failure in electronic system. Transient Voltage Suppressors (TVS)
are an ideal choice for ESD protection. They are capable of clamping the incoming transient to a low enough level such
that damage to the protected semiconductor is prevented. Surface mount TVS offers the best choice for minimal lead
inductance. They serve as parallel protection elements, connected between the signal lines to ground. As the transient
rise above the operating voltage of the device, the TVS becomes a low impedance path diverting the transient current
to ground. The ESD5Zxx Series is the ideal board evel protection of ESD senditive semiconductor components.
The tiny SOD-523FL package allows design flexibility in the design of high density boards where the space is at a
premium. This enables to shorten the routing and contributes to hardening against ESD.
Pinning information
Pin1
Pin2
Pin
Simplified outline
cathode
anode
1
Symbol
1
2
2
Marking
Type number
Marking code
ESD5Z3.3
ESD5Z5.0
ZE
ZF
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
PACKAGE
A
B
C
SOD-523FL
0.032 (0.80)
0.024 (0.60)
0.044 (1.10)
Page 4
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
0.05
0.05
0.1
0.1
0.96
1.94
0.76
1.50
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
D
D1
D2
E
F
P
P0
P1
T
W
W1
1.0
0.4
0.05
0.01
0.05
0.05
0.1
0.05
0.02
0.4
0.2
178.00
54.40
1.30
1.75
3.50
2.00
4.00
2.00
0.18
8.00
12.30
Item
SOD-523FL
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
Reel packing
PACKAGE
SOD-523FL
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
7"
3,000
4.0
BOX
(pcs)
INNER
BOX
(m/m)
30,000 183*183*123
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
178
382*262*387
240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page6
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7
Formosa MS
SMD Transient Voltage Suppressor For ESD Protection
ESD5Zxx SERIES
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V RWM=100% rate at T J=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1026
4. Pressure Cooker
15P SIG at T A=121 OC for 4 hrs.
JESD22-A102
5. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
MIL-STD-750D
METHOD-1051
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1038
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
6. Thermal Shock
7. Humidity
8. High Temperature Storage Life
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
Revision
DS-221824
2009/08/10
2012/01/10
F
Page.
7