Formosa MS SMD MOSFET FMBSS84 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2~3 Rating and characteristic curves........................................................ 4~5 Pinning information........................................................................... 6 Marking........................................................................................... 6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Formosa MS SMD MOSFET FMBSS84 Package outline 50V P-Channel Enhancement Mode Power MOSFET Features (B) (C) (A) 0.072 (1.80) 0.024 (0.61) 0.012 (0.30) 0.047 (1.19) Mechanical data 0.014 (0.35) .084(2.10) .068(1.70) 0.108 (2.70) 0.124 (3.10) DS(ON) 0.020 (0.51) 0.042 (1.05) • L ow on-resistance R = 10Ω • L ow input capacitance : 30pF • Fast switching speed : 2.5ns • L ow output capacitance : 10pF • L ow threshole : 2.0V • In compliance with EU RoHS 2002/95/EC directives • Suffix "-H" indicates Halogen-free part, ex.FMBSS84-H 0.034 (0.85) SOT-23 0.120 (3.00) 0.059 (1.47) 0.002 (0.05) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.01 (0.25) 0.084 (2.10) 0.035 (0.88) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.008 gram M aximum ratings (AT T A Dimensions in inches and (millimeters) =25 oC unless otherwise noted) PARAMETER CONDITIONS Drain-source voltage Drain current-continue T A = 25 OC Symbol MIN. TYP. MAX. UNIT V DSS 50 V ID 130 I DM 520 V GS ±20 mA -pulsed Gate- source voltage-continue O Total power dissipation (Derate above 25 C) TJ Storage temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 T STG Page 2 o 556 R θJA Operation junction temperature mW 225 PD Junction to ambient thermal resistance V -55 -65 Document ID Issued Date DS-231142 2009/08/10 o +175 o Revised Date 2010/03/10 C/W +150 Revision B C C Page. 8 Formosa MS SMD MOSFET FMBSS84 Electrical characteristics (At T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Drain-source breakdown voltage V GS = 0V, I D = -250uA BV DSS 50 Zero gate voltage drain current V DS = 25V, V GS = 0V V DS = 50V, V GS = 0V I DSS Gate-body leakage current-forward V GS = 20V, V DS =0 I GSSF 60 uA Gate-body leakage current-reverse V GS = -20V, V DS =0 I GSSR -60 uA 2.0 V 10 Ω OFF CHARACTERISTICS V 0.1 µA 15 ON CHARACTERISTICS (Note 1) Gate threshold voltage Static drain-source on-resistance V DS = V GS , I D = 1.0mA V GS(th) V GS = 5.0V, I D = 100mA R DS(ON) 0.8 5.0 Source-drain current IS 0.130 A Source-drain current (pulse), Note 2 I SM 0.520 A Forward transconductance, Note 1 V DS =25V, I D = 100mA, f = 1kHz* g FS Forward on voltage, Note 1 ms 50 V SD 2.5 V DYNAMIC CHARACTERISTICS Intput capacitance Output capacitance V DS = 5V, V GS = 0V, f=1.0MHz Reverse transfer capacitance C iss 30 C oss 10 C rss Gate charge pF 5.0 QT pC 6000 t d(ON) 25 tr 1.0 t d(OFF) 16 Turn-On Delay Time V DD = -15V, R L =50Ω, I D =-2.5A ns Turn-Off Delay Time tf 8 Note 1. Pulse duration >= 300µs, duty cycle 2.0% 2. Pulse width limited by Max. junction temperature 3. Surface mounted on 1 inch square copper pad of FR4 board; 270°C/W when mounted on min. copper pad. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Rating and characteristic curves (FMBSS84) FIG.2 ON-REGION CHARACTERISTICS FIG.1 TRANSFER CHARACTERISTICS 0.6 0.5 25 OC V DS = 10V ID, DRAIN CURRENT,(A) -55 OC ID, DRAIN CURRENT(A) 150 OC 0.4 0.3 0.2 0.1 0.4 3.25V 0.3 3.0V 0.2 2.75V 0.1 2.5V 2.25V 0 0 1 2 3 4 0 FIG.3 ON-RESISTANCE VS DRAIN CURRENT V GS = 4.5V 8 O 150 C 6 25 OC 4 O -55 C 2 0 0.2 0.4 0.6 I D, DRAIN CURRENT (A) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 2 4 6 8 10 V DS, DRAIN TO SOURCE VOLTAGE(V) R DS(on) , DRAIN- TO- SOURCE RESISTANCE (OHMS) V GS, GATE TO SOURCE VOLTAGE, (V) R DS(on) , DRAIN- TO- SOURCE RESISTANCE (OHMS) V GS = 3.5V O T J =25 C 0.5 FIG.4 ON-RESISTANCE VS DRAIN CURRENT 7 V GS = 10V 6 O 150 C 5 25 OC 4 3 O -55 C 2 0 0.2 0.4 0.6 I D, DRAIN CURRENT (A) Page 4 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Rating and characteristic curves (FMBSS84) FIG.6 GATE CHARGE 2 V GS = 10V I D = 0.52A 1.8 1.6 1.4 V GS = 4.5V I D = 0.13A 1.2 1 0.8 VGS, GATE TO SOURCE VOLTAGE,(V) R DS(on), DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) FIG.5 ON-RESISTANCE VARIATION WITH TEMPERATURE 0.6 8 7 V DS = 40V O T J = 25 C 6 5 4 3 I D = 0.5A 2 1 0 -55 -5 45 95 145 0 O T J, JUNCTION TEMPERAURE, ( C) 500 1000 1500 2000 Q T, TOTAL GATE CHARGE, (pC) FIG.7 BODY DIODE FORWARD VOLTAGE ID, DIODE CURRENT(A) 1 150 OC 0.1 -55 OC 25 OC 0.01 0.001 0 0.5 1.0 1.5 2.0 2.5 3.0 V SD, DIODE FORWARD VOLTAGE, (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Formosa MS SMD MOSFET FMBSS84 Pinning information Pin Simplified outline Symbol D PinD PinG PinS Drain Drain Gate Source Gate G Source S Marking Type number Marking code FMBSS84 PD Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Formosa MS SMD MOSFET FMBSS84 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 55.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 12.0 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8 Formosa MS SMD MOSFET FMBSS84 Reel packing PACKAGE REEL SIZE SOT-23 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) 383*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 8 Document ID Issued Date DS-231142 2009/08/10 Revised Date 2010/03/10 Revision B Page. 8