ZMM55C(B)

Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3.4
Rating and characteristic curves........................................................ 5.6
Pinning information........................................................................... 7
Suggested solder pad layout............................................................. 7
Packing information.......................................................................... 8
Reel packing.................................................................................... 9
Suggested thermal profiles for soldering processes............................. 9
High reliability test capabilities...........................................................10
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
500mW Surface Mount Zener
Diodes - 2.0V-100V
Package outline
Features
SOD-80
• Silicon epitaxial planar chip structure.
• Wide zener reverse voltage range 2.0V to 100V.
• Small package size for high density applications.
• Glass hermetically sealed package.
• Ideally suited for automated assembly processes.
• Lead-free parts meet environmental standards of
.142(3.6)
.134(3.4)
MIL-STD-19500 /228
SOLDERABLE
ENDS
.019(.48)
.011(.28)
.063(1.6)
.055(1.4)
Mechanical data
• Case : Glass Mini-MELF / SOD-80
• Terminals :Plated terminals, solderable per MIL-STD-750,
Dimensions in inches and (millimeters)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.03 gram
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
Forward voltage
CONDITIONS
I F = 200 mA DC
MIN.
TYP.
VF
Power Dissipation
PD
Storage temperature
Operating temperature
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Symbol
Page 2
MAX.
UNIT
1.50
V
500
mW
T STG
-65
+175
o
C
TJ
-55
+150
o
C
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C2V0 THRU ZMM55C100
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Test
current
Zener
impedance
Leakage
current
V Z @ I ZT
I ZT
Z ZT @ I ZT
Z ZK @ I ZK
I ZK
IR
VR
I Surge
mA
Surge
current
Part No.
Min.
Nom.
Max.
mA
OHMs
OHMs
mA
uA
Volts
ZMM55C2V0
1.9
2.0
2.1
5.0
100
600
1.0
150
1.0
ZMM55C2V2
2.1
2.2
2.3
5.0
100
600
1.0
150
1.0
ZMM55C2V4
2.2
2.4
2.6
5.0
85
600
1.0
50
1.0
ZMM55C2V7
2.5
2.7
2.9
5.0
85
600
1.0
10
1.0
ZMM55C3V0
2.8
3.0
3.2
5.0
85
600
1.0
4.0
1.0
ZMM55C3V3
3.1
3.3
3.5
5.0
85
600
1.0
2.0
1.0
ZMM55C3V6
3.4
3.6
3.8
5.0
85
600
1.0
2.0
1.0
ZMM55C3V9
3.7
3.9
4.1
5.0
85
600
1.0
2.0
1.0
ZMM55C4V3
4.0
4.3
4.6
5.0
75
600
1.0
1.0
1.0
ZMM55C4V7
4.4
4.7
5.0
5.0
60
600
1.0
0.5
1.0
ZMM55C5V1
4.8
5.1
5.4
5.0
35
550
1.0
0.1
1.0
ZMM55C5V6
5.2
5.6
6.0
5.0
25
450
1.0
0.1
1.0
ZMM55C6V2
5.8
6.2
6.6
5.0
10
200
1.0
0.1
2.0
ZMM55C6V8
6.4
6.8
7.2
5.0
8
150
1.0
0.1
3.0
ZMM55C7V5
7.0
7.5
7.9
5.0
7
50
1.0
0.1
5.0
ZMM55C8V2
7.7
8.2
8.7
5.0
7
50
1.0
0.1
6.2
ZMM55C9V1
8.5
9.1
9.6
5.0
10
50
1.0
0.1
6.8
ZMM55C10
9.4
10
10.6
5.0
15
70
1.0
0.1
7.5
ZMM55C11
10.4
11
11.6
5.0
20
70
1.0
0.1
8.2
ZMM55C12
11.4
12
12.7
5.0
20
90
1.0
0.1
9.1
ZMM55C13
12.4
13
14.1
5.0
26
110
1.0
0.1
10
ZMM55C15
13.8
15
15.6
5.0
30
110
1.0
0.1
11
ZMM55C16
15.3
16
17.1
5.0
40
170
1.0
0.1
12
ZMM55C18
16.8
18
19.1
5.0
50
170
1.0
0.1
13
ZMM55C20
18.8
20
21.2
5.0
55
220
1.0
0.1
15
ZMM55C22
20.8
22
23.3
5.0
55
220
1.0
0.1
16
ZMM55C24
22.8
24
25.6
5.0
80
220
1.0
0.1
18
ZMM55C27
25.1
27
28.9
5.0
80
220
1.0
0.1
20
ZMM55C30
28
30
32
5.0
80
220
1.0
0.1
22
ZMM55C33
31
33
35
5.0
80
220
1.0
0.1
24
ZMM55C36
34
36
38
5.0
80
220
1.0
0.1
27
ZMM55C39
37
39
41
2.5
90
500
1.0
0.1
30
ZMM55C43
40
43
46
2.5
90
600
0.5
0.1
33
ZMM55C47
44
47
50
2.5
110
700
0.5
0.1
36
ZMM55C51
48
51
54
2.5
125
700
0.5
0.1
39
ZMM55C56
52
56
60
2.5
135
1000
0.5
0.1
43
ZMM55C62
58
62
66
2.5
150
1000
0.5
0.1
47
ZMM55C68
64
68
72
2.5
200
1000
0.5
0.1
51
ZMM55C75
70
75
79
2.5
250
1500
0.5
0.1
56
ZMM55C82
78
82
86
2.5
300
2000
0.5
0.1
62
ZMM55C91
86
91
96
1.0
450
5000
0.1
0.1
58
ZMM55C100
95
100
105
1.0
450
5000
0.1
0.1
75
Note : 5% tolerance of Zener voltage
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55B2V0 THRU ZMM55B100
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Test
current
Zener
impedance
Leakage
current
V Z @ I ZT
I ZT
Z ZT @ I ZT
Z ZK @ I ZK
I ZK
IR
VR
I Surge
mA
Surge
current
Part No.
Min.
Nom.
Max.
mA
OHMs
OHMs
mA
uA
Volts
ZMM55B2V0
1.96
2.0
2.04
5.0
100
600
1.0
150
1.0
ZMM55B2V2
2.12
2.2
2.24
5.0
100
600
1.0
150
1.0
ZMM55B2V4
2.35
2.4
2.45
5.0
85
600
1.0
50
1.0
ZMM55B2V7
2.65
2.7
2.75
5.0
85
600
1.0
10
1.0
ZMM55B3V0
2.94
3.0
3.06
5.0
85
600
1.0
4.0
1.0
ZMM55B3V3
3.23
3.3
3.37
5.0
85
600
1.0
2.0
1.0
ZMM55B3V6
3.53
3.6
3.67
5.0
85
600
1.0
2.0
1.0
ZMM55B3V9
3.82
3.9
3.98
5.0
85
600
1.0
2.0
1.0
ZMM55B4V3
4.21
4.3
4.39
5.0
75
600
1.0
1.0
1.0
ZMM55B4V7
4.61
4.7
4.79
5.0
60
600
1.0
0.5
1.0
ZMM55B5V1
5.00
5.1
5.20
5.0
35
550
1.0
0.1
1.0
ZMM55B5V6
5.49
5.6
5.71
5.0
25
450
1.0
0.1
1.0
ZMM55B6V2
6.08
6.2
6.32
5.0
10
200
1.0
0.1
2.0
ZMM55B6V8
6.66
6.8
6.94
5.0
8
150
1.0
0.1
3.0
ZMM55B7V5
7.35
7.5
7.65
5.0
7
50
1.0
0.1
5.0
ZMM55B8V2
8.04
8.2
8.36
5.0
7
50
1.0
0.1
6.2
ZMM55B9V1
8.92
9.1
9.28
5.0
10
50
1.0
0.1
6.8
ZMM55B10
9.8
10
10.2
5.0
15
70
1.0
0.1
7.5
ZMM55B11
10.8
11
11.2
5.0
20
70
1.0
0.1
8.2
ZMM55B12
11.8
12
12.2
5.0
20
90
1.0
0.1
9.1
ZMM55B13
12.7
13
13.3
5.0
26
110
1.0
0.1
10
ZMM55B15
14.7
15
15.3
5.0
30
110
1.0
0.1
11
ZMM55B16
15.7
16
16.3
5.0
40
170
1.0
0.1
12
ZMM55B18
17.6
18
18.4
5.0
50
170
1.0
0.1
13
ZMM55B20
19.6
20
20.4
5.0
55
220
1.0
0.1
15
ZMM55B22
21.6
22
22.4
5.0
55
220
1.0
0.1
16
ZMM55B24
23.5
24
24.5
5.0
80
220
1.0
0.1
18
ZMM55B27
26.5
27
27.5
5.0
80
220
1.0
0.1
20
ZMM55B30
29.4
30
30.6
5.0
80
220
1.0
0.1
22
ZMM55B33
32.3
33
33.7
5.0
80
220
1.0
0.1
24
ZMM55B36
35.3
36
36.7
5.0
80
220
1.0
0.1
27
ZMM55B39
38.2
39
39.8
2.5
90
500
1.0
0.1
30
ZMM55B43
42.1
43
43.9
2.5
90
600
0.5
0.1
33
ZMM55B47
46.1
47
47.9
2.5
110
700
0.5
0.1
36
ZMM55B51
50.0
51
52.0
2.5
125
700
0.5
0.1
39
ZMM55B56
54.9
56
57.1
2.5
135
1000
0.5
0.1
43
ZMM55B62
60.8
62
63.2
2.5
150
1000
0.5
0.1
47
ZMM55B68
66.6
68
69.4
2.5
200
1000
0.5
0.1
51
ZMM55B75
73.5
75
76.5
2.5
250
1500
0.5
0.1
56
ZMM55B82
80.4
82
83.6
2.5
300
2000
0.5
0.1
62
ZMM55B91
89.2
91
92.8
1.0
450
5000
0.1
0.1
58
ZMM55B100
98
100
102
1.0
450
5000
0.1
0.1
75
Note : 2% tolerance of Zener voltage
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100)
FIG.1-TOTAL POWER DISSIPATION VS.
AMBIENT TEMPERATURE
FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE
o
UNDER OPERATING CONDITIONS AT T A =25 C
1000
500
VOLTAGE CHANGE (mV)
TOTAL POWER DISSIPATION (mW)
600
400
300
200
I Z = 5mA
100
10
100
0
0
0
40
80
120
160
200
0
5
o
15
20
25
ZENER VOLTAGE (V)
FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE
VS. JUNCTION TEMPERATURE
FIG. 4-TEMPERATURE COEFFICIENT OF VZ
VS. Z-VOLTAGE
15
-4
TEMPERATURE COEFFICIENT (10 / K)
1.3
RELATIVE VOLTAGE CHANGE
10
AMIBIENT TEMPERATURE ( C)
1.2
-4
10 x 10 /K
-4
8 x 10 /K
-4
6 x 10 /K
1.1
-4
4 x 10 /K
-4
2 x 10 /K
0
-4
-2 x 10 /K
-4
-4 x 10 /K
1.0
0.9
0.8
10
I Z = 5mA
5
0
-5
-60
0
60
120
180
240
0
o
JUNCTION TEMPERATURE ( C)
10
20
30
40
50
ZENER VOLTAGE (V)
FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE
DIODE CAPACITANCE (pF)
200
150
V R = 2V
100
50
0
0
5
10
15
20
25
ZENER VOLTAGE (V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Rating and characteristic curves (ZMM55C(B)2V0 THRU ZMM55C(B)100)
FIG. 7-Z-CURRENT VS. Z-VOLTAGE
100
50
10
40
ZENER CURRENT (mA)
FORWARD CURRENT (mA)
FIG. 6-FORWARD CURRENT
VS. FORWARD VOLTAGE
1
0.1
P tot = 500mW
30
20
10
0.01
0.001
0
0
0.2
0.4
0.6
0.8
1.0
15
25
30
35
ZENER VOLTAGE (V)
FIG. 8-Z-CURRENT VS. Z-VOLTAGE
FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE
1000
DIFFERENTIAL Z-RESISTANCE (ohm)
100
80
P tot = 500mW
60
40
20
0
I Z = 1mA
100
I Z = 5mA
10
I Z = 10mA
1
0
4
8
12
16
20
0
5
ZENER VOLTAGE (V)
10
15
20
25
ZENER VOLTAGE (V)
FIG. 10-THERMAL RESPONSE
THERMAL RESISTANCE FOR PULSE Cond. (K/W)
ZENER CURRENT (mA)
20
FORWARD VOLTAGE (V)
1000
t p / T= 0.5
100
t p / T= 0.2
Single Pulse
t p / T= 0.01
10
t p / T= 0.1
t p / T= 0.02
t p / T= 0.05
1
0.1
1
10
100
1000
PULSE LENGTH (mS)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-80
0.071 (1.80)
0.035 (0.90)
0.102 (2.60)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-80
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.70
1.80
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 8
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
Reel packing
PACKAGE
REEL SIZE
7"
SOD-80
REEL
(pcs)
COMPONENT
SPACING
(m/m)
2500
4.0
25,000
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
BOX
(pcs)
185*120*180
178
CARTON
SIZE
(m/m)
CARTON
(pcs)
400*250*200
100,000
APPROX.
GROSS WEIGHT
(kg)
7.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15%
2.Reflow soldering of surface-mount devices
Critical Zone
T L to T P
tP
TP
Ramp-up
TL
tL
Temperature
T smax
T smin
TS
ts
Preheat
25
Ramp-down
t25 oC to Peak
Wave Soldering
IR Reflow
Time
3.Flow (wave)soldering (solder dipping)
Profile Feature
Soldering Condition
Average ramp-up rate(T L to TP )
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
100oC
150oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL )
-Time(tL )
183oC
60~150sec
255oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(tP )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 9
Document ID
Issued Date
DS-221704
2008/02/10
Revised Date
-
Revision
A
Page.
10
Formosa MS
GLASS MINI-MELF Zener Diode
ZMM55C(B)2V0 THRU ZMM55C(B)100
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260±5 C for 10±2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=V Z rate at T A=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1026
4. Forward Operation Life
Rated zener current at T=25OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25OC, IF = 200mA
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
15P SIG at TA=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
9. Forward Surge
10. Humidity
11. High Temperature Storage Life
12. Solvent Resistance
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave superimposed
on rated load, one surge.
at TA=65 OC, RH=98% for 1000hrs.
MIL-STD-750D
METHOD-1038
at 175OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
Dip into Freon at 25OC for 1 min.
MIL-STD-202F
METHOD-215
Page 10
Document ID
Issued Date
DS-212704
2008/02/10
Revised Date
-
Revision
A
Page.
10