Formosa MS

Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3, 4
Rating and characteristic curves........................................................ 5.6
Pinning information........................................................................... 7
Suggested solder pad layout............................................................. 7
Packing information.......................................................................... 8
Reel packing.................................................................................... 9
Suggested thermal profiles for soldering processes............................. 9
High reliability test capabilities...........................................................10
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
500mW Surface Mount Zener
Diodes - 2.4V-51V
Package outline
Features
0.071(1.80)
0.055(1.40)
• Up to 500mW power dissipation.
• Silicon epitaxial planar chip structure.
• Wide zener reverse voltage range 2.4V to 75V.
• Very tiny package size for high density applications.
• Ideally suited for automated assembly processes.
• Lead-free parts meet environmental standards of
0.028(0.70)
0.019(0.50)
SOD-123F
0.110(2.80)
0.098(2.50)
MIL-STD-19500 /228
0.008(0.20)MAX
0.053(1.35)
0.037(0.95)
Mechanical data
0.154(3.90)
0.141(3.60)
• Epoxy:UL94-VO rated flame retardant
• Case : Molded plastic, SOD-123F
• Terminals : Solder plated, solderable per
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.010 gram
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
Forward voltage
CONDITIONS
I F = 100 mA DC
Power Dissipation
Forward surge current
8.3ms single half sine-wave superimposed
on rate load (JEDEC methode)
Storage temperature
MAX.
UNIT
VF
1.00
V
PD
500
mW
I FSM
4000
mA
T STG
Operating temperature
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Symbol
TJ
Page 2
MIN.
TYP.
-65
-55
+175
o
C
+150
o
C
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5229A THRU MMSZ5262A
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Part No.
Marking
code
Zener
voltage
Test
current
Zener
impedance
V Z @ IZT (Volts)
I ZT
Z ZT @ I ZT
Z ZK @ I ZK
Leakage
current
I ZK
IR
VR
Min
Nom
Max
mA
OHMs
OHMs
mA
uA
Volts
MMSZ5229A
D4
4.21
4.3
4.39
20.0
22
2000
0.25
5.0
1.0
MMSZ5230A
D5
4.61
4.7
4.79
20.0
19
1900
0.25
5.0
2.0
MMSZ5231A
E1
5.00
5.1
5.20
20.0
17
1600
0.25
5.0
2.0
MMSZ5232A
E2
5.49
5.6
5.71
20.0
11
1600
0.25
5.0
3.0
MMSZ5234A
E4
6.08
6.2
6.32
20.0
7
1000
0.25
5.0
4.0
MMSZ5235A
E5
6.66
6.8
6.94
20.0
5
750
0.25
3.0
5.0
MMSZ5236A
F1
7.35
7.5
7.65
20.0
6
500
0.25
3.0
6.0
MMSZ5237A
F2
8.04
8.2
8.36
20.0
8
500
0.25
3.0
6.0
MMSZ5238A
F3
8.53
8.7
8.87
20.0
8
600
0.25
3.0
6.5
MMSZ5239A
F4
8.92
9.1
9.28
20.0
10
600
0.25
3.0
6.5
MMSZ5240A
F5
9.80
10
10.20
20.0
17
600
0.25
3.0
8.0
MMSZ5241A
H1
10.78
11
11.22
20.0
22
600
0.25
2.0
8.4
MMSZ5242A
H2
11.76
12
12.24
20.0
30
600
0.25
1.0
9.1
MMSZ5243A
H3
12.74
13
13.26
9.5
13
600
0.25
0.5
9.9
MMSZ5244A
H4
13.72
14
14.28
9.0
15
600
0.25
0.1
10.5
MMSZ5245A
H5
14.70
15
15.30
8.5
16
600
0.25
0.1
11
MMSZ5246A
J1
15.68
16
16.32
7.8
17
600
0.25
0.1
12
MMSZ5247A
J2
16.66
17
17.34
7.5
19
600
0.25
0.1
13
MMSZ5248A
J3
17.64
18
18.36
7.0
21
600
0.25
0.1
14
MMSZ5250A
J5
19.60
20
20.40
6.2
25
600
0.25
0.1
15
MMSZ5251A
K1
21.56
22
22.44
5.6
29
600
0.25
0.1
17
MMSZ5252A
K2
23.52
24
24.48
5.2
33
600
0.25
0.1
18
MMSZ5254A
K4
26.46
27
27.54
5.0
41
600
0.25
0.1
21
MMSZ5255A
K5
27.44
28
28.56
4.5
44
600
0.25
0.1
21
MMSZ5256A
M1
29.40
30
30.60
4.2
49
600
0.25
0.1
23
MMSZ5257A
M2
32.34
33
33.66
3.8
58
700
0.25
0.1
25
MMSZ5258A
M3
35.28
36
36.72
3.4
70
700
0.25
0.1
27
MMSZ5259A
M4
38.22
39
39.78
3.2
80
800
0.25
0.1
30
MMSZ5260A
M5
42.14
43
43.86
3.0
93
900
0.25
0.1
33
MMSZ5261A
N1
46.06
47
47.94
2.7
105
1000
0.25
0.1
36
MMSZ5262A
N2
49.98
51
52.02
2.5
125
1100
0.25
0.1
39
Note : 2% tolerance of Zener voltage
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TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221B THRU MMSZ5262B
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Part No.
Marking
code
Zener
voltage
Test
current
Zener
impedance
V Z @ IZT (Volts)
I ZT
Z ZT @ I ZT
Z ZK @ I ZK
Leakage
current
I ZK
IR
VR
Min
Nom
Max
mA
OHMs
OHMs
mA
uA
Volts
MMSZ5221B
C1
2.28
2.4
2.52
20.0
30
1200
0.25
100
1.0
MMSZ5222B
C2
2.38
2.5
2.63
20.0
30
1250
0.25
100
1.0
MMSZ5223B
C3
2.57
2.7
2.84
20.0
30
1300
0.25
75
1.0
MMSZ5225B
C5
3.85
3.0
3.15
20.0
30
1600
0.25
50
1.0
MMSZ5226B
D1
3.14
3.3
3.47
20.0
28
1600
0.25
25
1.0
MMSZ5227B
D2
3.42
3.6
3.78
20.0
24
1700
0.25
15
1.0
MMSZ5228B
D3
3.71
3.9
4.10
20.0
23
1900
0.25
10
1.0
MMSZ5229B
D4
4.09
4.3
4.52
20.0
22
2000
0.25
5.0
1.0
MMSZ5230B
D5
4.47
4.7
4.94
20.0
19
1900
0.25
5.0
2.0
MMSZ5231B
E1
4.85
5.1
5.36
20.0
17
1600
0.25
5.0
2.0
5.6
MMSZ5232B
E2
5.32
5.88
20.0
11
1600
0.25
5.0
3.0
MMSZ5234B
E4
5.89
6.2
6.51
20.0
7
1000
0.25
5.0
4.0
MMSZ5235B
E5
6.46
6.8
7.14
20.0
5
750
0.25
3.0
5.0
MMSZ5236B
F1
7.13
7.5
7.88
20.0
6
500
0.25
3.0
6.0
MMSZ5237B
F2
7.79
8.2
8.61
20.0
8
500
0.25
3.0
6.0
MMSZ5238B
F3
8.27
8.7
9.14
20.0
8
600
0.25
3.0
6.5
MMSZ5239B
F4
8.65
9.1
9.56
20.0
10
600
0.25
3.0
6.5
MMSZ5240B
F5
9.50
10
10.50
20.0
17
600
0.25
3.0
8.0
MMSZ5241B
H1
10.45
11
11.55
20.0
22
600
0.25
2.0
8.4
MMSZ5242B
H2
11.40
12
12.60
20.0
30
600
0.25
1.0
9.1
MMSZ5243B
H3
12.35
13
13.65
9.5
13
600
0.25
0.5
9.9
MMSZ5244B
H4
13.30
14
14.70
9.0
15
600
0.25
0.1
10.5
MMSZ5245B
H5
14.25
15
15.75
8.5
16
600
0.25
0.1
11
MMSZ5246B
J1
15.20
16
16.80
7.8
17
600
0.25
0.1
12
MMSZ5247B
J2
16.15
17
17.85
7.5
19
600
0.25
0.1
13
MMSZ5248B
J3
17.10
18
18.90
7.0
21
600
0.25
0.1
14
MMSZ5250B
J5
19.00
20
21.00
6.2
25
600
0.25
0.1
15
MMSZ5251B
K1
20.90
22
23.10
5.6
29
600
0.25
0.1
17
MMSZ5252B
K2
22.80
24
25.20
5.2
33
600
0.25
0.1
18
MMSZ5254B
K4
25.65
27
28.35
5.0
41
600
0.25
0.1
21
MMSZ5255B
K5
26.60
28
29.40
4.5
44
600
0.25
0.1
21
MMSZ5256B
M1
28.50
30
31.50
4.2
49
600
0.25
0.1
23
MMSZ5257B
M2
31.35
33
34.65
3.8
58
700
0.25
0.1
25
MMSZ5258B
M3
34.20
36
37.80
3.4
70
700
0.25
0.1
27
MMSZ5259B
M4
37.05
39
40.95
3.2
80
800
0.25
0.1
30
MMSZ5260B
M5
40.85
43
45.15
3.0
93
900
0.25
0.1
33
MMSZ5261B
N1
44.65
47
49.35
2.7
105
1000
0.25
0.1
36
N2
48.45
51
53.55
2.5
125
1100
0.25
0.1
39
MMSZ5262B
Note : 5% tolerance of Zener voltage
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TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Rating and characteristic curves (MMSZ5221 THRU MMSZ5262)
FIG.1-TOTAL POWER DISSIPATION VS.
AMBIENT TEMPERATURE
FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE
o
UNDER OPERATING CONDITIONS AT TA =25 C
1000
500
VOLTAGE CHANGE (mV)
TOTAL POWER DISSIPATION (mW)
600
400
300
200
I Z = 5mA
100
10
100
0
0
0
40
80
120
160
200
0
5
o
15
20
25
ZENER VOLTAGE (V)
FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE
VS. JUNCTION TEMPERATURE
FIG. 4-TEMPERATURE COEFFICIENT OF VZ
VS. Z-VOLTAGE
15
-4
TEMPERATURE COEFFICIENT (10 / K)
1.3
RELATIVE VOLTAGE CHANGE
10
AMIBIENT TEMPERATURE ( C)
1.2
-4
10 x 10 /K
-4
8 x 10 /K
-4
6 x 10 /K
1.1
-4
4 x 10 /K
-4
2 x 10 /K
0
-4
-2 x 10 /K
-4
-4 x 10 /K
1.0
0.9
0.8
10
I Z = 5mA
5
0
-5
-60
0
60
120
180
240
0
o
JUNCTION TEMPERATURE ( C)
10
20
30
40
50
ZENER VOLTAGE (V)
FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE
DIODE CAPACITANCE (pF)
200
150
100
50
0
0
5
10
15
20
25
ZENER VOLTAGE (V)
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Page 5
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Rating and characteristic curves (MMSZ5221 THRU MMSZ5262)
FIG. 7-Z-CURRENT VS. Z-VOLTAGE
100
50
10
40
ZENER CURRENT (mA)
FORWARD CURRENT (mA)
FIG. 6-FORWARD CURRENT
VS. FORWARD VOLTAGE
1
0.1
P tot = 200mW
30
20
10
0.01
0.001
0
0
0.2
0.4
0.6
0.8
1.0
15
25
30
35
ZENER VOLTAGE (V)
FIG. 8-Z-CURRENT VS. Z-VOLTAGE
FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE
1000
DIFFERENTIAL Z-RESISTANCE (ohm)
100
80
60
40
20
0
I Z = 1mA
100
I Z = 5mA
10
I Z = 10mA
1
0
4
8
12
16
20
0
5
ZENER VOLTAGE (V)
10
15
20
25
ZENER VOLTAGE (V)
FIG. 10-THERMAL RESPONSE
THERMAL RESISTANCE FOR PULSE Cond. (K/W)
ZENER CURRENT (mA)
20
FORWARD VOLTAGE (V)
1000
t p / T= 0.5
100
t p / T= 0.2
Single Pulse
t p / T= 0.01
10
t p / T= 0.1
t p / T= 0.02
t p / T= 0.05
1
0.1
1
10
100
1000
PULSE LENGTH (mS)
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Page 6
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123F
0.059 (1.50)
0.059 (1.50)
0.094 (2.40)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123F
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
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Page 8
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
Reel packing
PACKAGE
REEL SIZE
SOD-123F
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
3000
4.0
30,000
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
BOX
(pcs)
183*183*123
178
CARTON
SIZE
(m/m)
CARTON
(pcs)
382*262*387
240,000
APPROX.
GROSS WEIGHT
(kg)
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15%
2.Reflow soldering of surface-mount devices
Critical Zone
T L to T P
tP
TP
Ramp-up
TL
tL
Temperature
T smax
T smin
TS
ts
Preheat
25
Ramp-down
t25 oC to Peak
Wave Soldering
IR Reflow
Time
3.Flow (wave)soldering (solder dipping)
Profile Feature
Soldering Condition
Average ramp-up rate(T L to TP )
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
100oC
150oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL )
-Time(tL )
183oC
60~150sec
255oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(tP )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25oC to Peak Temperature
<6minutes
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Page 9
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10
Formosa MS
SMD Zener Diode
MMSZ5221 THRU MMSZ5262
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260±5 C for 10±2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=V Z rate at T A=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1026
4. Forward Operation Life
Rated zener current at T=25OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25OC, IF = 100mA
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
15P SIG at TA=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
9. Forward Surge
10. Humidity
11. High Temperature Storage Life
12. Solvent Resistance
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MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave superimposed
on rated load, one surge.
at TA=65 OC, RH=98% for 1000hrs.
MIL-STD-750D
METHOD-1038
at 175OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
Dip into Freon at 25OC for 1 min.
MIL-STD-202F
METHOD-215
Page 10
Document ID
Issued Date
Revised Date
Revision
DS-221715
2008/02/10
2009/02/10
B
Page.
10