SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3 Rating and characteristic curves........................................................ 4 Pinning information........................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 7 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series 200W Surface Mount Transient Voltage Suppressors - 6.8V-39V Package outline Features SOD-123 • 200W peak pulse power capability with a 10/1000 μ S waveform, repetition rate (duty cycle): 0.01%. • Breakdown voltage 6.8V ~ 39V, stand-off voltage 5.8V ~ 33.3V • Low leakage current • Fast response time, less than 1ns typically • ESD rating of class 3 (>16kV) per human body mode • • • • 0.154(3.9) 0.138(3.5) 0.012(0.3) Typ. ESD rating of level 4 (>8kV) per IEC61000-4-2 EFT (Electrical fast transients) rating of 40A per IEC-61000-4-4 Low profile, save the space of mother board Silicon epitaxial plana chip structure . Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free part, ex. VGFM02-C6V8-Μ-H 0.071(1.9) 0.055(1.5) Mechanical data 0.067(1.7) 0.051(1.3) 0.028(0.7) Typ. • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123 / MINI SMA • Terminals :Plated terminals, solderable per MIL-STD-750, 0.028(0.7) Typ. Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.018 gram Maximum ratings (AT o T A=25 C unless otherwise noted) PARAMETER Symbol CONDITIONS VGFM02-M Series UNIT Peak Power Dissipation with a 10/1000 μS waveform, note 1 with a 8/20 μs waveform, note 2 P PK 200 1000 W DC Power Dissipation @T A =25°C, note 3 Derate above 25°C PD 385 4.0 mW mW/°C Thermal Resistance Junction to ambient, note 3 Junction to lead, note 3 R θJA R θJL 325 26 °C / W Operating Temperature Range Storage temperature Range TJ -55 ~ +150 O C T STG -65 ~ +175 O C I IF V C:Clamping Voltage @I PP I PP:Maximum Reverse Peak Pulse Current V BR:Breakdown Voltage @I T I T:Test Current V RWM:Working Peak Reverse Voltage I R:Maximum Reverse Leakage Current @V RWM V F:Forward Voltage @I F I F:Forward Current V C V BR V RWM V IR VF IT I PP http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series Electrical characteristics (at T =25 C unless otherwise noted) o A Reverse Stand-off Voltage Test Current Breakdown Voltage Maximum Clamping Voltage @I PP Maximum Leakage Current Maximum Forward Voltage I R@V RWM V F@I F =12A Marking Code Part No. V RWM V BR Min Nominal V BR Max IT VC I PP Volts mA Volts A A Volts 5.8 6.45 6.80 7.14 10 10.5 19.0 400 3.5 X9 VGFM02-C7V5-M 6.4 7.13 7.50 7.88 10 11.3 17.7 200 3.5 Y1 VGFM02-C8V2-M 7.02 7.79 8.20 8.61 10 12.1 16.6 100 3.5 Y2 VGFM02-C9V1-M 7.78 8.65 9.10 9.55 1.0 13.4 15.0 50 3.5 Y3 VGFM02-C10-M 8.55 9.50 10.0 10.5 1.0 14.5 13.8 25 3.5 Y4 VGFM02-C11-M 9.40 10.5 11.0 11.6 1.0 15.6 12.8 10 3.5 Y5 Volts VGFM02-C6V8-M Volts Volts VGFM02-C12-M 10.2 11.4 12.0 12.6 1.0 16.7 12.0 55 3.5 Y6 VGFM02-C13-M 11.1 12.4 13.0 13.7 1.0 18.2 11.0 2.5 3.5 Y7 VGFM02-C15-M 12.8 14.3 15.0 15.8 1.0 21.2 9.45 1 3.5 Y8 VGFM02-C16-M 13.6 15.2 16.0 16.8 1.0 22.5 8.90 1 3.5 Y9 VGFM02-C18-M 15.3 17.1 18.0 18.9 1.0 25.2 7.95 1 3.5 Z1 VGFM02-C20-M 17.1 19.0 20.0 21.0 1.0 27.7 7.20 1 3.5 Z2 VGFM02-C22-M 18.8 20.9 22.0 23.1 1.0 30.6 6.55 1 3.5 Z3 VGFM02-C24-M 20.5 22.8 24.0 25.2 1.0 33.2 6.0 1 3.5 Z4 VGFM02-C27-M 23.1 25.7 27.0 28.4 1.0 37.5 5.35 1 3.5 Z5 VGFM02-C30-M 25.6 28.59 30.0 31.5 1.0 41.4 4.85 1 3.5 Z6 VGFM02-C33-M 28.2 31.4 33.0 34.7 1.0 45.7 4.40 1 3.5 Z7 VGFM02-C36-M 30.8 34.2 36.0 37.8 1.0 49.9 4.00 1 3.5 Z8 VGFM02-C39-M 33.3 37.1 39.0 41.1 1.0 53.9 3.70 1 3.5 Z9 Stress exceeding Maximum Rating may damage the device. Maximum Rating are stress ratings only. Functional operation above the recommended operating condiditon is not implied. Extended exposure to stresses above the recommended Operating Conditions may affect device reliability. O Note 1. Non-repetitive current pulse at T A =25 C, per waveform of Fig. 2 2. Non-repetitive current pulse at T A =25°C, per waveform of Fig. 3 3. Mounted with recommended minimum pad size, DC board FR-4 4. 1/2 sine wave (or equivalent square wave), PW=8.3ms, duty cycle =4 pulses per minute maximum. 5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (V RWM ) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. V BR measured at pulse test current I T at ambient temperature of 25°C. 7. Surge current waveform per Fig. 2 and derate per Fig. 3 Transients of several thousand volts can be clamped to a safe level by the TVS Transient current is divered to ground thru TVS; the voltage seen by the protected load is limited to the clamping voltage level Transient Peak Transient Voltage Clamping Transient + +30V +20V Protected Load IC Failure Threshold Transient Current TVS Clamping Voltage (V C ) TVS +12V Normal Operating Voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS Rating and characteristic curves (VGFM02-M Series) Fig.2 - Pulse Waveform 1,000 100 10 1.0 μ 10 μ 100 μ 1m 10m 150 Peak Pulse Current, I PPM (%) non-repetitive pulse waveform shown in Fig. 3 T A =25°C pulse width (td) is defined Tr<=10μS as the point where the peak current decays to 50% peak value I PPM 100 half value I PPM /2 10/1000 μS waveform 50 td 0 100m 0 1.0 Peak Pulse Power or Current Derating in Percentage, % Peak Pulse Current, I PPM (%) 150 pulse width (tp) is defined Tr<=10μS as the point where the peak current decays is 8μs peak value I PPM half value I RSM /2 @20μs 50 td 0 0 20 40 60 80 75 50 25 0 0 Junction Capacitance, C J (pF) Fig.5 - Steady State Power Derating Curve 60Hz resistive or inductive load 300 250 200 150 100 50 0 25 50 75 100 125 150 175 200 50 75 100 125 150 175 200 Fig.6 - Typical Junction Capacitance 1,000 measured @ zero bias 100 measured @ 50% V RWM 10 measured in stand-off voltage, V WM 1 1.0 10 100 200 Breakdown Voltage, V BR (Volts) Temperature, T (°C) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 25 Ambient Temperature, T A (°C) 400 0 4.0 100 time, t (mS) 350 3.0 Fig.4 - Pulse Derating Curve Fig.3 - Pulse Waveform 100 2.0 time, t (mS) Pulse Width, tp ( Sec) Maximum Power Dissipation (mW) Peak Pulse Power, P PPM (KW) Fig.1 - Pealk Pulse Power Rating Curve 10,000 Page 4 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series Pinning information Pin Simplified outline Uni-Directional Pin1 cathode Pin2 anode 1 Symbol 2 1 2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123 0.075 (1.90) 0.055 (1.40) 0.075 (1.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.90 3.90 1.68 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series Reel packing PACKAGE SOD-123 REEL SIZE 7" COMPONENT SPACING REEL (pcs) (m/m) 4.0 2500 BOX (pcs) 10,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 185*185*51 178 430*190*220 80,000 5.1 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 7 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8 SMD Transient Voltage Suppressor Formosa MS VGFM02-M Series High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=V RWM, rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T=25 C for 500hrs. MIL-STD-750D METHOD-1026 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 T A = 25 C, I F = I T On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O MIL-STD-750D METHOD-1056 O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-1038 O at T A=85 C , RH=85% for 1000hrs. MIL-STD-750D METHOD-1031 O at 175 C for 1000 hrs. Page 8 Document ID Issued Date Revised Date DS-121811 2008/02/10 2010/03/10 Revision B Page. 8