Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D 6.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V Package outline Features • Batch process design, excellent power dissipation offers DPAK better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of • 0.264(6.70) 0.248(6.30) 0.048(1.20) 0.031(0.80) 0.098(2.50) 0.083(2.10) 0.217(5.50) 0.201(5.10) 0.024(0.60) 0.016(0.40) 0.244(6.20) 0.228(5.80) MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part, ex.SKFM620C-D-H. 0.114(2.90) 0.098(2.50) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, TO-252 / DPAK • Terminals : Solder plated, solderable per 0.039(1.00) 0.031(0.80) 0.185(4.70) 0.169(4.30) 0.024(0.60) 0.016(0.40) 0.032(0.80) 0.016(0.40) MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) • Mounting Position : Any • Weight : Approximated 0.34 gram PIN 1 PIN 3 Maximum ratings and Electrical Characteristics (AT PARAMETER PIN 2 T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V RMS*2 (V) *3 VR (V) SKFM620C-D 20 14 20 SKFM630C-D 30 21 30 SKFM640C-D 40 28 40 SKFM650C-D 50 35 50 SKFM660C-D 60 42 60 *4 VF (V) Operating temperature T J, ( OC) 0.55 -55 to +125 MAX. UNIT 6.0 A I FSM 75 A 0.5 20 -65 +175 mA O C *1 Repetitive peak reverse voltage *2 RMS voltage 0.70 SKFM680C-D 80 56 80 SKFM6100C-D 100 70 100 SKFM6150C-D 150 105 150 0.90 SKFM6200C-D 200 140 200 0.92 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 TYP. IO T STG *1 V RRM (V) MIN. IR V R = V RRM T J = 100 OC Storage temperature SYMBOLS Symbol 0.85 *3 Continuous reverse voltage -55 to +150 *4 Maximum forward voltage@ I F = 3.0A Document ID Page 2 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Rating and characteristic curves (SKFM620C-D THRU SKFM6200C-D) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 60 80 100 120 140 160 180 200 CASE TEMPERATURE,(°C) PEAK FORWARD SURGE CURRENT,(A) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT -D SK 0C D~ D~ 65 0C - 68 0C - FM 1.0 61 40 FM 20 SK D 0 SK C- 00 D 0 3.0 SK FM 62 62 FM K ~S 0C 64 1 FM -D FM SK 2 10 SK 0C D~ 3 INSTANTANEOUS FORWARD CURRENT,(A) 65 FM 0C 62 4 ~S KF M 64 0C F 50 M -D S 66 CKF 0C D~ M 6 -D SK 10 FM 0C -D 62 00 CD 50 SK 5 FM SK TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 90 75 TJ=25 °C 60 .01 8.3ms Single Half .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) Sine Wave JEDEC method 45 30 15 FIG.4 - TYPICAL REVERSE 0 1 10 CHARACTERISTICS 100 100 NUMBER OF CYCLES AT 60Hz REVERSE LEAKAGE CURRENT, (mA) AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 6 10 1.0 TJ=75 C TJ=25 C .1 .01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D Pinning information Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code SKFM620C-D SKFM630C-D SKFM640C-D SKFM650C-D SKFM660C-D SKFM680C-D SKFM6100C-D SKFM6150C-D SKFM6200C-D SK620 SK630 SK640 SK650 SK660 SK680 SK6100 SK6150 SK6200 Suggested solder pad layout X1 PACKAGE C Y1 L C Y2 DPAK 0.272(6.90) E 0.091(2.30) L 0.457(11.60) X1 0.276(7.00) X2 0.059(1.50) Y1 0.276(7.00) Y2 0.098(2.50) X2 Dimensions in inches and (millimeters) E http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance DPAK Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 6.90 10.50 2.70 1.50 330.00 50.00 13.00 1.75 7.50 8.00 4.00 2.00 0.23 16.00 22.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D Reel packing PACKAGE REEL SIZE DPAK/TO-252 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 8.0 6,000 335*335*43 330 CARTON SIZE (m/m) 350*330*360 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 22.0 48,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7 Formosa MS Chip Schottky Barrier Rectifier SKFM620C-D THRU SKFM6200C-D High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-4066-2 Document ID Page 7 MIL-STD-750D METHOD-1056 DS-121635 Issued Date 2008/02/10 Revised Date 2011/01/10 Revision D Page. 7