Formosa MS Switching Diode BAV19 THRU BAV21 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings .............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Taping & bulk specifications for AXIAL devices.................................... 4 Suggested thermal profiles for soldering processes............................. 5 High reliability test capabilities...........................................................6 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-222953 2009/08/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode BAV19 THRU BAV21 200mW Surface Mount Switching Diode-120-250V Package outline Features DO-35G • Axial lead type devices for through hole design. • Fast speed switching. • Silicon epitaxial planar chip structruction. • Hermetically sealed glass. • Small surface mounting type. • Lead-free parts meet RoHS requirments. 0.022 (0.56) 0.018 (0.46) DIA. 1.02 (26.0) MIN. 0.165 (4.2) MAX. Mechanical data 0.079 (2.0) DIA. MAX. 1.02 (26.0) MIN. • Case : Glass, DO-35G • Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.12 gram Dimensions in inches and (millimeters) Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Max. UNIT V RRM 120 200 250 V VR 100 150 200 V I FSM 1000 mA Forward DC current IF 250 mA Average forward current I FAV 200 mA Power dissipation PV 500 mW Junction temperature Tj -55 Storage temperature T STG -65 Repetitive peak forward current I FRM 625 mA VF 1.00 V 100 15 100 15 100 15 nA µA nA µA nA µA Repetitive peak reverse voltage Reverse voltage Peak forward surge current TYPE BAV19 BAV20 BAV21 BAV19 BAV20 BAV21 t p = 1 us Symbol Forward voltage I F = 100 mA Reverse current V R = 100 V V R = 100 V , T j = 100 oC V R = 150 V V R = 150 V , T j = 100 oC V R = 200 V V R = 200 V , T j = 100 oC Diode capacitance V R = 0 V , f = 1MH z CD Reverse recovery time I F = 30 mA , I RR = 3mA , R L = 100 OHM t rr Dynamic forward resistance I F = 10mA rf Junction ambient on PC board 50mm*50mm*1.6mm R thJA http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 BAV19 BAV19 BAV20 BAV20 BAV21 BAV21 Min. Typ. +175 o C +175 o C IR 1.5 pF 50 ns 375 K/W 5 Document ID Issued Date DS-222953 2009/08/10 Ù Revised Date - Revision Page. A 6 Rating and characteristic curves (BAV19 THRU BAV21) FIG.1-MAXIMUM PERMISSIBLE CONTINUOUS FIG.2 - FORWARD CURRENT VS. FORWARD VOLTAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE 300 600 O T J = 25 C typical values T J = 150OC typical values 200 400 IF(mA) IF(mA) O T J = 25 C maximum values 100 200 0 0 0 100 200 0 1 Tamb(OC) 10 FIG.3 - REVERSE CURRENT VS. JUNCTION TEMPERATURE 3 2 VF(V) FIG.4 - DIODE CAPACITANCE VS. REVERSE VOLTAGE (TYPICAL VALUES) 1.8 O REVERSE CURRENT, (uA) T J = 25 C f = 1MHz 10 2 maximum values 1.4 10 Cd(pF) 1.2 1 typical values 1.0 10 -1 VR = VRmax 10 0.8 -2 0 100 o 0 200 10 JUNCTION TEMPERATURE ( C) 20 VR(V) FIG.5 - MAXIMUM PERMISSIBLECONTINUOUS REVERSE VOLTAGE VS. AMBIENT TEMPERATURE 300 BAV100 200 BAV101 VR(V) BAV102 100 0 0 100 200 Tamb(OC) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-222953 2009/08/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode BAV19 THRU BAV21 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Marking Type number 1N4148 Marking code 1N4148 Taping & bulk specifications for AXIAL devices 52.4mm/ 26.2mm 17mm DIA. 55mm Max. A 17mm DIA. 72mm DIA. 71mm Max. 355mm OFF Center both sids 1.0mm Max OFF Alignment 1.2mm 6.3mm REEL PACKING DEVICE Q'TY 1 COMPONENT CARTON Q'TY 2 APPROX. CASE (PCS / REEL) SPACING SIZE (PCS / CARTON) CROSS "A" in FIG. A (m/m) TYPE DO-35G/52mm WEIGHT(kg) 5 mm 360 * 360 * 395 Q'TY 1 INNER CARTON Q'TY 2 APPROX. (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS (m/m) (m/m) 10,000 50,000 11. 4 AMMO PACKING DEVICE CASE TYPE WEIGHT(kg) DO-35G/26mm 5,000 250 * 78 *48 420 * 270 * 330 150,000 16.7 DO-35G/52mm 5,000 250 *7 8 *78 420 * 270 * 330 100,000 15.0 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-222953 2009/08/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode BAV19 THRU BAV21 BULK PACKING DEVICE Q'TY 1 INNER CARTON Q'TY 2 APPROX. CASE (PCS / BOX) BOX SIZE SIZE (PCS / CARTON) CROSS TYPE (m/m) DO-35G 96 * 80 * 4 2 2,000 WEIGHT(kg) (m/m) 120,000 410 * 335 * 265 17.4 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-222953 2009/08/10 Revised Date - Revision Page. A 6 Formosa MS Switching Diode BAV19 THRU BAV21 High reliability test capabilities Item Test Conditions Reference o 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 oC for 5 sec. MIL-STD-202F METHOD-208 3. Pull Test 1kg in axial lead direction for 10 sec. MIL-STD-750D METHOD-2036 4. Bend Lead 0.5kg weight applied to each lead bending arc 90o±5 o for 3 times. MIL-STD-750D METHOD-2036 5. High Temperature Reverse Bias V R=80% rate at T J=150 oC for 168 hrs. MIL-STD-750D METHOD-1026 6. Forward Operation Life Rated average rectifier current at T=25 oC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min, on and off for 500 cycles. MIL-STD-750D METHOD-1036 7. Intermittent Operation Life 8. Pressure Cooker 9. Temperature Cycling 10. Thermal Shock 11. Forward Surge 12. Humidity 13. High Temperature Storage Life 14. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 15P SIG at TA=121 oC for 4 hrs. MIL-STD-750D METHOD-1051 -55 oC to +125oC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1056 0 oC for 5 min. rise to 100 oC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 oC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175oC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25oC for 1 min. MIL-STD-202F METHOD-215 Page 6 Document ID Issued Date DS-222953 2009/08/10 Revised Date - Revision Page. A 6