Formosa MS SMD Schottky Barrier Diode FM751D List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7 Formosa MS SMD Schottky Barrier Diode FM751D 30mA Surface Mount Small Signal Schottky Diode- 40V Package outline SOD-923FL 0.010(0.25) 0.006(0.15) • Slicon Epitaxial Planer • Low Forward Voltage and Low Reverse Current • High Reliability • Schottky Barrier Diodes Encapsulated in a SOD-923FL Package • Lead-free parts for green partner, exceeds environmental 0.026(0.65) 0.022(0.55) Features 0.035(0.85) 0.029(0.75) standards of MIL-STD-19500 /228 0.017(0.43) 0.014(0.36) 0.007(0.17) 0.003(0.07) • Suffix "-H" for Halogen-free part, ex. FM751D-H. Mechanical data 0.042(1.05) 0.037(0.95) • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-923FL • Terminals :Plated terminals, solderable per MIL-STD-750, Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.00044 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Repetitve Peak Reverse Voltage DC Reverse Voltage Mean rectifying current Symbol Value UNIT V RM VR 40 30 V IO 30 mA V Peak forward surge current 60Hz for 1 cyc I FSM 200 mA Thermal Resistance Junction to Ambient R θJA 520 o Power Dissipation PD 150 mW Junction temperature TJ 125 o C Storage temperature T STG -40~+125 o C C/W Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol Forward voltage I F = 1.0 mA Reverse current V R = 30 V IR Diode capacitance V R = 1 V, f = 1MHz CT http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIN. TYP. VF Page 2 MAX. UNIT 0.37 V 0.5 uA 2.0 Document ID Issued Date DS-221658 2011/01/10 Revised Date - pF Revision A Page. 7 Rating and characteristic curves (FM751D) FIG.2 - TYPICAL REVERSE CHARACTERISTICS REVERSE CURRENT , (nA) INSTANTANEOUS FORWARD CURRENT,(mA) FIG.1-TYPICAL FORWARD CHARACTERISTICS REVERSE VOLTAGE , (V) FORWARD VOLTAGE,(mV) CAPACITANCE BETWEEN TERMINALS , (pF) FIG.3-CAPACITANCE BETWEEN TERMINALS CHARACTERISTICS REVERSE VOLTAGE ,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7 Formosa MS SMD Schottky Barrier Diode FM751D Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code 5 FM751D Σ •• (Note 1) Note 1.Σ = Month code Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-923FL 0.016 (0.40) 0.012 (0.30) 0.024 (0.60) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7 Formosa MS SMD Schottky Barrier Diode FM751D Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-923FL Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.05 0.05 0.05 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 0.70 1.12 0.48 1.50 178.00 62.00 13.00 1.75 3.50 2.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7 Formosa MS SMD Schottky Barrier Diode FM751D Reel packing PACKAGE REEL SIZE SOD-923FL 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 8,000 4.0 80,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 382*262*387 APPROX. GROSS WEIGHT (kg) CARTON (pcs) 9.50 640,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7 Formosa MS SMD Schottky Barrier Diode FM751D High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 Document ID Issued Date DS-221658 2011/01/10 Revised Date - Revision A Page. 7