Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 5 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW 200mW Surface Mount Switching Diode Array - 100V Package outline SOT-363 Features • Fast speed switching. • For general purpose switching application. • High conductance. • Easily connected as full wave bridge • Silicon epitaxial planar chip. • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free part, ex.BAV70DW-H .087(2.20) .079(2.00) .087(2.20) .079(2.00) .018(0.46) .010(0.26) .053(1.35) .045(1.15) Mechanical data .026(0.65)Typ. .010(0.25) .003(0.08) .014(0.35) .006(0.15) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-363 • Terminals : Solder plated, solderable per .004(0.10) Max. .043(1.10) .035(0.90) .016(0.40) .012(0.30) MIL-STD-750, Method 2026 • Mounting Position : Any • Weight : Approximated 0.006 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT T A=25 oC unless otherwise noted) PARAMETER Symbol Value UNIT Non-Repetitive Peak Reverse Voltage V RM 100 V Peak Repetitive Reverse Voltage DC Blocking Voltage V RRM VR 75 V V R(RSM) 53 V IO 150 mA Non-Repetitive Forward Current @t=1.0us @ t=1.0s I FSM 2.0 1.0 A Typical Thermal Resistance Junction to Ambient (Note 1, 3) R θJA 625 Power Dissipation(Note 1, 3) PD 200 Operating Temperature Range TJ -55 ~ +150 o C Storage Temperature Range T STG -65 ~ +150 o C RMS Reverse Voltage Average Rectified Output Current (Note 1, 3) Maximum Reverse Voltage Leakage Current ( Note 2) at V R = 75V IR at V R = 20V Maximum Total Capacitance ,V R = 0V, f = 1.0MHz CD Maximum Reverse Recovery Time(I F = I R = 10mA,V R = 5.0Vdc, I RR = 1.0mAdc, R L = 100Ω) t rr O mW 2.5 µA 25 nA 2.0 pF 4.0 ns 715 Maximum Forward Voltage (Note 2) at I F = 1.0mA 855 at I F = 10mA VF at I F = 50mA mV 1000 1250 at I F = 150mA Note: 1. Device mounted on FR-4 PC board with recommended pad layout 2. Short duration test pulse used to minimize self-heating effect. 3. One or more diodes loaded. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 C/W Page 2 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Rating and characteristic curves for each diode (BAV70DW/BAV99DW/BAW56DW/BAV99BRW/BAV756DW/BAW567DW) FIG.1-TYPICAL FORWARD FIG.2 - LEAKAGE CURRENT IF, FORWARD CURRENT,(A) IR, REVERSE CURRENT,(nA) CHARACTERISTICS VR, REVERSE VOLTAGE (V) VF, FORWARD VOLTAGE,(V) FIG.3 - TOTAL CAPACITANCE FIG.4 - POWER DERATING CURVE PD, POWER DISSIPATION (mW) CD, DIODE CAPACITANCE,(pF) 200 150 100 50 0 0 VR, REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE,(°C) Page 3 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW Pinning information Type number 6 BAV70DW BAV99DW BAW56DW Type number Symbol Marking code 5 Marking code Symbol 4 KJA BAV99BRW 6 5 4 KGJ 1 2 3 1 2 3 6 5 4 6 5 4 KJG BAV756DW KCA 1 2 3 1 2 3 6 5 4 6 5 4 1 2 3 KJC BAW567DW 1 2 KAC 3 Suggested solder pad layout SOT-363 0.025(0.65) 0.025(0.65) 0.051(1.3) 0.075(1.9) 0.098(2.5) 0.024(0.60) 0.0165(0.42) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-363 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.36 2.40 1.20 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW Reel packing PACKAGE REEL SIZE SOT-363 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 30,000 183*183*123 178 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 9.50 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7 Formosa MS SMD Switching Diode Array BAV70DW/BAV99DW/BAW56DW BAV99BRW/BAV756DW/BAW567DW High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge Peak Forward Current at t=1us MIL-STD-750D METHOD-4066-2 at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. Humidity at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 11. High Temperature Storage Life http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-221921 2008/02/10 2012/03/27 B 7