ZL60003 RCLED 650 nm, Plastic Optical Fiber Communications - 125 to 250 Mbps Data Sheet June 2004 Ordering Information ZL60003/TBD TO-46 Package -20°C to +70°C CASE CATHODE ANODE Features • Optimized wavelength for Plastic optical fiber • High Bandwidth • No threshold • Surface emitting • High coupling efficiency • Hermetically sealed Bottom View Figure 1 - Pin Description Description Applications • Fast Ethernet • IEEE1394b • 155 Mbps ATM • Home networking • Industrial applications This unique Resonant Cavity Surface-Emitting LED (RCLED) is designed for optical communications over Plastic Optical Fiber (POF) in applications such as Fast Ethernet, IEEE1394b (S100, S200) and 155 Mbps ATM. Optimised high-speed performance can be achieved by use of a suitable electrical preemphasis within the drive circuitry. ZL60003 is also well suited for applications where visible light is required, such as in sensing and positioning. 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003-4, Zarlink Semiconductor Inc. All Rights Reserved. ZL60003 Data Sheet Optical and Electronic characteristics (25°C Case temperature) Parameter Fiber-Coupled Power Symbol Min. Pfiber 1.2 Typ. Max. Unit Test Condition mW IF = 30 mA (Note1) Po 2.0 mW IF = 30 mA Beam Divergence (FWHM) 2Θ1/2 25 deg IF = 30 mA Rise and Fall Time tR ,tF Peak Wavelength λp Spectral Width (FWHM) Forward Voltage Optical Power 3.5 ns IF = 30 mA (Note1,2) 660 nm IF = 30 mA (Note1) ∆λ 20 nm IF = 30 mA (Note1) VF 2.3 V 640 650 IF = 30 mA Note 1: Fiber: POF 980/1000 µm Step Index, NA=0.48. For high speed communication, a low NA POF or a graded index POF are recommended. Note 2: Unfiltered 20%-80% measurement. Note significant improvements can be achieved by use of pre-emphasis in the drive circuitry. Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature Top -20 to +70°C Electrical Power Dissipation Ptot 130 mW IF 40 mA IFRM 85 mA Reverse Voltage VR 5V Soldering Temperature (2 mm from the case for 10 sec.) Tsld 260°C Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz Thermal Characteristics Parameter Symbol Min. Thermal Resistance - Infinite Heat Sink Rthjc 200 °C/W Thermal Resistance - No Heat Sink Rthja 500 °C/W Temp. Coefficient - Wavelength dλ/dTj 0.08 nm/°C Optical Power - Fiber Coupled dPf/dTj -0.7 %/°C 2 Zarlink Semiconductor Inc. Typ. Max. Unit BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. 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