WT-193NB5

WT-193NB5
Top Mount Chip LED (0603)
Product Specifications
Specification
Iv
Material
Quantity
11.25-45 mcd
O
@mA/ Ta= 25 ;Tolerance: + 10%
465-480nm
λD
O
@5mA/ Ta= 25 C;Tolerance: + 0.5nm
Vf
2.55-3.15V
O
@5mA/ Ta= 25 C ;Tolerance: + 0.05V
Ir
< 100 µA @ VR = 5 V
Resin
Milky White
Epoxy resin
Carrier tape
EIA 481-1A specs
Conductive black tape
Reel
EIA 481-1A specs
Conductive black
Label
WT standard
Paper
Packing bag
220x240mm
Aluminum laminated bag/ no-zipper
One reel per bag
Carton
WT standard
Paper
Non-specified
4000pcs per reel
Others:
Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin
combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product
label as well.
ATTENTION: Electrostatic Discharge (ESD) protection
The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based
chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts
built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must
be taken during design and assembly.
If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
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WT-193NB5
Label Specifications
▓Customer P/N: To Be Defined
▓ WEITRON P/N:
W T - 1 9 3
Series Name
WT-193
1.6(L)x0.8(W)x0.4(H) mm
NB5
Emitting Color
NB: Blue @ 5mA
▓ Lot No.:
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▓ Luminous Intensity (Iv) Bin:
Color
Bin Code
Spec. Range
L
11.25-18.0 mcd
M
18.0-28.5 mcd
N
28.5-45.0 mcd
Blue
▓ Dominant Wavelength (λD) Bin:
Color
Bin Code
Spec. Range
B
465-470 nm
C
470-475 nm
D
475-480 nm
Blue
▓ Forward Voltage (Vf) Bin:
Color
Blue
Bin Code
Spec. Range
G2T
2.55-2.65 V
G3T
2.65-2.75 V
G4T
2.75-2.85 V
H1T
2.85-2.95 V
H2T
2.95-3.05V
H3T
3.05-3.15 V
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Product Features
Electro-Optical Characteristics
o
(IF @ 5mA, Ta 25 C)
Code for parts
WT-193NB5
VF(V)
Lighting Color
Blue
InGaN
*
I V(mcd)
λ(nm)
typ
max
λD
λP
△λ
Typical
2.95
3.15
470
468
40
28
Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering
Unit: mm Tolerance: +/-0.1
Outline Dim.
Soldering Pattern
Soldering terminals may shift in the x, y direction.
Absolute Maximum Ratings
o
(Ta 25 C)
o
o
Series
Pd (mW)
IF (mA)
IFP (mA)
VR (V)
IR (uA)
TOP ( C)
TST ( C)
193NB5
70
20
80
5
<100@ VR = 5
-30~+80
-40~+85
** Condition for IFP is pulse of 1/10 duty and 0.1msec width
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Characteristics of WT-193NB5
Directive Characteristics
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Packaging
Tape Dimension
Part No.
WT-193
Dim. A
Dim. B
Dim. C
1.80±0.10 0.95±0.10 0.60±0.10
Q’ty/Reel
4K
Unit: mm
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Reel Dimension
Packing
5 boxes per carton is available depending on shipment quantity.
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Dry Pack
All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times
during transportation or storage. Every reel is packaged in a moisture protected anti-static bag.
Each bag is properly sealed prior to shipment.
Upon request, a humidity indicator will be included in the moisture protected anti-static bag
prior to shipment.
The packaging sequence is as follows:
PRECAUTIONS
1.
2.
Avoid exposure to moisture at all times during transportation or storage.
Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products.
3.
4.
5.
It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid
applying a reverse voltage beyond the specified limit.
Avoid operation beyond the limits as specified by the absolute maximum ratings.
Avoid direct contact with the surface through which the LED emits light.
6.
If possible, assemble the unit in a clean room or dust-free environment.
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Reflow Soldering
Recommend soldering paste specifications:
1.
2.
3.
Operating temp.: Above 220 OC ,60 sec.
Peak temp.:260 OCMax.,10sec Max.
Never attempt next process until the component is cooled down to room temperature after
reflow.
4.
The recommended reflow soldering profile (measured on the surface of the LED terminal)
is as following:
Lead-free Solder Profile
Reworking



Rework should be completed within 5 seconds under 260 OC.
The iron tip must not come in contact with the copper foil.
Twin-head type is preferred.
Cleaning
Following are cleaning procedures after soldering:

An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.



Temperature x Time should be 50oC x 30sec. or <30oC x 3min
Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter
Curing: 100 OC max, <3min
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