WT-U169BP-PW

WT-U169BP-PW
Special Color - White
Product Specification
Specification
Iv
Material
Quantity
1800 mcd above
O
@20mA/ Ta= 25 C
Tolerance: + 10%
Correlated Color
Refer to page 7~8
Temperature
O
@20mA/ Ta= 25 C
Vf
2.9-3.7V (0.1V/bin)
O
@20mA Ta= 25 C
Tolerance: + 0.05V
Ir
< 100 µA @ VR = 5 V
Resin
Yellow
silicon resin
Color Rendering Pure White: ≧70(Tolerance± 3)
Index (CRI)
@20mA/ Ta=25℃
Carrier tape
According to EIA 481-1A specs
Conductive black tape
Reel
According to EIA 481-1A specs
Conductive black
Label
WT standard
Paper
Packing bag
220x240mm
Aluminum laminated bag/ no-zipper One reel one bag
Carton
WT standard
Paper
2000pcs per reel
Non-specified
Others:
Every mid-box will be loaded 5 reels. These 5 reels can be different in lot, Iv, lambda, or Vf. Every reel will have
an independent label to identify its specification and the mid-box there will have a corresponding label post on it.
ATTENTION: Electricstatic Discharge (ESD) protection
The symbol shown on the page herein to introduce ‘Electro-Optical
Characteristics’. ESD protection for GaP and AlGaAs based chips is still necessary
even though they are safe in low static-electric discharge. Parts built with AlInGaP,
GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD protection has to
considered and taken in the initial design stage.
If manual work/process is needed, please ensure the device is well protected from ESD
during all the process.
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Label Spec.:
▓Customer P/N: To Be Defined
▓ WEITRON P/N
W T - U 1 6 9 BP
Series Name
:T-U169: 3.5x2.7x1.8mm
Emitting Color
BP:
Pure White @20mA
▓ Lot No.
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▓ Bin Code.
▓ Iv Bin:
Color
Pure
White
Bin Code
Spec. Range
Z51
1800-1900mcd
Z52
1900-2010mcd
Z61
2010-2125mcd
Z62
2125-2250mcd
Z71
2250-2385mcd
Z72
2385-2530mcd
Z81
2530-2685mcd
Luminous Intensity Measurement Allowance is ±10%
▓ Vf Bin:
Color
Bin Code
Spec. Range
H2
2.9-3.0V
H3
3.0-3.1V
H4
3.1-3.2V
Pure
J1
3.2-3.3V
White
J2
3.3-3.4V
J3
3.4-3.5V
J4
3.5-3.6V
K1
3.6-3.7V
Forward Voltage Measurement Allowance is ±0.05V
▓ Correlated Color Temperature Rank:
Color
Bin Code
Pure White
Correlated Color Temperature (K)
Min.
Typ.
Max.
G1
4,750
5,000
5,250
G0
4,750
5,000
5,250
F1
5,250
5,500
5,750
F0
5,250
5,500
5,750
E1
5,750
6,000
6,250
E0
5,750
6,000
6,250
D1
6,250
6,500
6,750
D0
6,250
6,500
6,750
C1
6,750
7,100
7,500
7,100
7,500
C0
6,750
Correlated Color Temperature Rank + 250K
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▓ Color Temperature Corrdinates
Rank C0
Rank C1
X
0.306
0.301
0.31
0.314
X
0.301
0.295
0.306
0.31
Y
0.292
0.311
0.322
0.301
Y
0.311
0.334
0.347
0.322
Rank D0
Rank D1
X
0.3135
0.31
0.317
0.32
X
0.31
0.306
0.314
0.317
Y
0.301
0.322
0.329
0.307
Y
0.322
0.347
0.353
0.329
Rank E0
Rank E1
X
0.32
0.317
0.326
0.327
X
0.317
0.314
0.325
0.326
Y
0.307
0.329
0.337
0.313
Y
0.329
0.353
0.362
0.337
Rank F0
Rank F1
X
0.327
0.326
0.339
0.337
X
0.326
0.325
0.341
0.339
Y
0.313
0.337
0.347
0.321
Y
0.337
0.362
0.373
0.347
Rank G0
Rank G1
X
0.337
0.339
0.353
0.349
X
0.339
0.341
0.357
0.353
Y
0.321
0.347
0.355
0.330
Y
0.347
0.373
0.381
0.355
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Product Specification
Electro-Optical Characteristics
(IF @ 20mA, Ta 25 oC)
Product No.
Lighting Color
Material
:T-U169BP
White
InGaN
VF(V)
*
Color
IV (mcd)
min
max
Correlated Color Temperature(K)
min
Typ
2.9
3.7
Typ 5000/5500/6000/6500/7000 K
1800
2200
Package Outline Dimension
Unit: mm Tolerance: +/-0.1
Outline Dimension:
Unit: mm
Soldering terminals may shift in x, y direction.
Absolute Maximum Ratings
(Ta 25 oC)
Series
:T-U169BP
Pd (mW)
IF (mA)
IFP (mA)
Ir (µA) @ VR = 5 V
TOP (oC)
TST (oC)
111
30
100**
<1µA
-30~+80
-40~+85
IFP** Condition for IFP is pulse of 1/10 duty and 0.1msec width.
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Characteristics of WT-U169BP
Directive Characteristics
Directive Characteristics
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Packaging Tape, Reel, and Packing Model
Tape Dimension
Part No.
Dim. A
Dim. B
Dim. C
Q’ty/Reel
WT-U169
3.73±0.10
2.95±0.10
2.12±0.10
2K
Unit: mm
Reel Dimension
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Packing
5 boxes per carton is available depending on shipment quantity.
Dry Pack
All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times
during transportation or storage. Every reel is packaged in a moisture protected anti-static bag.
Each bag is properly sealed prior to shipment.
Upon request, a humidity indicator will be included in the moisture protected anti-static bag
prior to shipment.
The packaging sequence is as follows:
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Cautions of Pick and Place
It should be avoided to load stress on the resin during high temperature.
Avoid rubbing or scraping the resin by any object.
Electric-static may cause damage to the component. Please confirm that the equipment
grounding well. Using an ionizer fan is recommended.
PRECAUTIONS
1.
2.
3.
Avoid exposure to moisture at all times during transportation or storage.
Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products.
It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid
4.
5.
6.
applying a reverse voltage beyond the specified limit.
Avoid operation beyond the limits as specified by the absolute maximum ratings.
Avoid direct contact with the surface through which the LED emits light.
If possible, assemble the unit in a clean room or dust-free environment.
Soldering pattern
The dimensions of the recommended soldering pattern may not meet every user. Please confirm and
study first before designing the soldering pattern in order to obtain the best performance of soldering.
Recommended soldering pattern is listed below.
Unit: mm
Soldering terminal may shift in x, y direction.
Cautions of Pick and Place
It should be avoided to load stress on the resin during high temperature.
Avoid rubbing or scraping the resin by any object.
Electric-static may cause damage to the component. Please confirm that the equipment
grounding well. Using an ionizer fan is recommended.
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Reflow Soldering
Recommend soldering paste specifications:
1. Operating temp.: Above 220 OC ,60 sec.
2. Peak temp.:260 OCMax.,10sec Max.
3. Never attempt next process until the component is cooled down to room temperature
after reflow.
4. The recommended reflow soldering profile (measured on the surface of the LED terminal)
is as following:
Lead-free Solder Profile
Reworking



Rework should be completed within 5 seconds under 260 OC.
The iron tip must not come in contact with the copper foil.
Twin-head type is preferred.
Cleaning
Following are cleaning procedures after soldering:


An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.
Temperature x Time should be 50oC x 30sec. or <30oC x 3min


Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter
Curing: 100 OC max, <3min
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