DATA SHEET WIRELESS COMPONENTS Ceramic Chip Antenna ANT5010LL04R2400A 2.4 – 2.5GHZ Product Specification –April 22, 2013 V.0 5010 Series Product specification WIRELESS COMPONENTS 2 2 Ceramic Chip Antenna FEATURES Compact size Omni-directional radiation Tape & reel automatic mounting Reflow process compatible RoHS compliant ORDERING INFORMATION APPLICATIONS 2.4 GHz WiFi device Bluetooth gadget Zigbee device ISM band equipment (1) PRODUCT All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 5010 L L04 R 2400A (1) (2) (3) (4) (5) (6) ANT = Antenna (2) SIZE 5010 = 5.0 × 1.0 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L04 (5) PACKING TYPE R = Tape and Reel (6) WORKING FREQUENCY 2400 = 2.4GHz PHYCOMP CTC CAN4311751042453K 12NC 431175104245 www.yageo.com Apr. 22, 2013 V0 Product specification WIRELESS COMPONENTS 3 3 Ceramic Chip Antenna SPECIFICATION Table 1 VALUE DESCRIPTION Working Frequency 2.45 GHz Bandwidth 210 MHz ( Typ. ) Return Loss 6.5 dB min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 2.28 dBi (Typ.) Impedance 50 Ω – 40 ~105 °C Operating Temperature Maximum Power 1W Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board DIMENSIONS Table 2 Machinical Dimension DIMENSION L (mm) 5.10 ± 0.10 W (mm) 1.00 ± 0.10 T (mm) 1.00 ± 0.10 A (mm) 0.85 ± 0.15 OUTLINES Top View Side View L T W Bottom View A S1 FUNCTION S1 Feeding or Soldering Point S2 Soldering or Feeding Point S2 YNH0092 Table 3 Termination configuration TERMINAL NAME A Fig. 1 Antenna outlines www.yageo.com Apr. 22, 2013 V0 Product specification WIRELESS COMPONENTS 4 4 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD 40 20 17.5 35 Unit : mm Fig. 2 Outlook and dimension of evaluation board Top Layer Bottom Layer / GND Unit : mm 5.0 1.4 1.3 Matching Circuit 1.5 6.1 11.0 Fig. 3 Details of soldering Pad YNH0093 www.yageo.com Apr. 22, 2013 V0 Product specification WIRELESS COMPONENTS 5 5 Ceramic Chip Antenna ELECTRICAL PERFORMANCES Return loss (dB) 30 YNH0094 18 6 −6 3 1 −18 2 −30 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 f (GHz) Marker data 1. 2.35GHz, -6.5dB 2. 2.45GHz, -27.45dB 3. 2.56GHz, -6.5dB Fig. 4 Return loss Gain (dBi) 5.00 − Z axle 0.00 − X Z −5.00 − − 10.00 − Y − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − Evaluation board and XYZ direction − 35.00 − YNH0095 Frequency= 2.45 GHz Max gain = 2.28 dBi, at (90, 210) MEG (mean effective gain)= -0.96 dBi Directivity (dB) = 3.24 Efficiency = -0.82 dB, 82.80 % Fig. 5 Radiation pattern www.yageo.com Apr. 22, 2013 V0 Product specification WIRELESS COMPONENTS 6 6 Ceramic Chip Antenna REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 0 - Apr. 22, 2013 DESCRIPTION - New datasheet for Ceramic Chip Antenna, 2.4 – 2.5 GHz application, 5010 Series www.yageo.com Apr. 22, 2013 V0