DATA SHEET WIRELESS COMPONENTS Ceramic Chip Antenna ANT5320LL17R1524A 2.4GHZ AND GPS Product Specification –March 29, 2013 V.0 5320 Series Product specification WIRELESS COMPONENTS 2 2 Ceramic Chip Antenna FEATURES z Compact size z Omni-directional radiation z Tape & reel automatic mounting z Reflow process compatible z RoHS compliant ORDERING INFORMATION - APPLICATIONS z Compact size z Tablet z Navigation device z Telematics box z Fleet management z 2.4 GHz WiFi device z Bluetooth gadget z Zigbee device z ISM band equipment (1) PRODUCT All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 5320 L L17 R 1524A (1) (2) (3) (4) (5) (6) ANT = Antenna (2) SIZE 5320 = 5.3 × 2.0 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L17 (5) PACKING TYPE R = Tape and Reel (6) WORKING FREQUENCY 1524 = 1.575 / 2.4GHz PHYCOMP CTC CAN4311753171522K 12NC 431175317152 www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 3 3 Ceramic Chip Antenna SPECIFICATION Table 1 VALUE DESCRIPTION Working Frequency 1.575G / 2.45G Hz Bandwidth 50M/ 110M Hz (Typ.) Return Loss 10 dB min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 1.67 / 2.05 dBi (Typ.) Impedance 50 Ω – 40 ~ 105 °C Operating Temperature Maximum Power 1W Termination Ag (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board DIMENSIONS Table 2 Machinical Dimension DIMENSION L (mm) 5.25 ±0.10 W (mm) 2.03 ±0.10 T (mm) 1.16 ±0.10 A (mm) 0.58 ±0.10 B (mm) 0.52 ±0.10 C (mm) 0.52 ±0.10 D (mm) 1.96 ±0.10 OUTLINES Top View Bottom View S1 BT Feeding Point S2 BT GND S3 GPS GND S4 GPS Feeding Point B B C A S4 S3 S2 S1 Table 3 Termination configuration FUNCTION T W A TERMINAL NAME Side View L D C YNH0076 Fig. 1 Antenna outlines www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 4 4 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD 90 40 Unit : mm Fig. 2 Outlook and dimension of evaluation board Top Layer Bottom Layer / GND Unit : mm 0.3 8.5 0.32 2.2 Matching Circuit Matching Circuit 2.58 0.5 1.5 0.8 3.7 1.76 3.08 0.72 10 Fig. 3 Details of soldering Pad YNH0077 www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 5 5 Ceramic Chip Antenna ELECTRICAL PERFORMANCES 50 50 Return loss (dB) Isolation (dB) 30 30 10 10 −10 −10 13 4 6 5 −30 3 1 4 6 2 −30 5 2 −50 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f (GHz) Marker data 1. 2. 3. 4. 5. 6. 1.550GHz , -10dB 1.575GHz , -33dB 1.600GHz , -10dB 2.39 GHz , -10dB 2.45GHz , -21.3dB 2.50GHz , -10dB Fig. 4 Return loss −50 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f (GHz) Marker data 1. 2. 3. 4. 5. 6. 1.560GHz , -17.8dB 1.575GHz , -17.3dB 1.600GHz , -17.8dB 2.39 GHz , -25.2dB 2.45GHz , -25.5dB 2.50GHz , -26.2dB YNH0078 Fig. 5 Isolation www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 6 6 Ceramic Chip Antenna Gain (dBi) 5.00 − Z axle 0.00 − − 5.00 − − 10.00 − − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − − 35.00 − Frequency = 1.57GHz Max gain = 1.67 dBi, at (30,180) MEG (mean effective gain)= -1.03 dBi Directivity (dB) = 3.80 Efficiency = -2.13dB, 61.30 % X Z Y Gain (dBi) 5.00 − Z axle 0.00 − − 5.00 − Evaluation board and XYZ direction − 10.00 − − 15.00 − − 20.00 − − 25.00 − X axle Y axle − 30.00 − − 35.00 − Frequency = 2.45GHz Max gain = 2.05 dBi, at (60,180) MEG (mean effective gain)= -1.31 dBi Directivity (dB) = 3.54 Efficiency = -1.49dB, 70.95 % YNH0075 Fig. 6 Radiation pattern www.yageo.com Mar. 29, 2013 V0 Product specification WIRELESS COMPONENTS 7 7 Ceramic Chip Antenna REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 0 - Mar. 29, 2013 DESCRIPTION - New data sheet for Ceramic Chip Antenna, 2.4GHZ AND GPS application, 5320 series www.yageo.com Mar. 29, 2013 V0