DATA SHEET CURRENT SENSOR - LOW TCR PF series 5%, 2%, 1%, 0.5% sizes 0603/0805/1206/2010/2512/4527 Product specification – March 26, 2012 V.0 Supersedes Date of Mar. 06, 2003 RoHS compliant & Halogen free Product specification Chip Resistor Surface Mount SERIES PF 2 12 0603/0805/1206/2010/2512/4527 SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER This specification describes PF series current sensor - low TCR with lead-free terminations made by metal foil with ceramic substrate. Global part numbers are identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and resistance value. GLOBAL PART NUMBER PF XXXX X X X XX XXXX Z (1) APPLICATIONS Consumer goods Computer Telecom Industrial / Datacom / Power supply Automotive Alternative Energy FEATURES Halogen-free Epoxy RoHS - - compliant Products with lead-free terminations meet RoHS requirements Pb-glass contained in electrodes, resistor element and glass are exempted by RoHS (2) (3) (4) (5) (6) (7) (1) SIZE 0603 / 0805 / 1206 / 2010 / 2512 / 4527 (2) TOLERANCE D = ±0.5% F = ±1% G = ±2% J = ±5% (3) PACKAGING TYPE R = Paper taping reel K = Embossed taping reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE E = ±50 ppm/°C M = ±75 ppm/°C (5) TAPING REEL 07 / 7W / 7T / 47 / 57= 7 inch dia. Reel and specific rated power. Detailed power rating are shown in the Table 2. (6) RESISTANCE VALUE Reduce 1 mΩ to 910 mΩ There are 3~5 digits indicated the resistance value. Letter R is decimal point. High Detailed coding rules of resistance are shown in the table of “Resistance rule of global part number”. environmentally hazardous wastes component and equipment reliability None forbidden-materials used in products/production resistances applied to current sensing (7) DEFAULT CODE Letter Z is the system default code for ordering only. (Note) Low Low inductance 0.5nH ~ 5nH Resistance rule of global part number Resistance code rule Example 0R001 = 1 mΩ 0RXXX (1 to 910 mΩ) 0R1 = 100 mΩ 0R91 = 910 mΩ ORDERING EXAMPLE The ordering code of a PF2512 1W chip resistor, value 0.005 X with ±1% tolerance, supplied in 7inch tape reel is: PF2512FKM070R005Z. NOTE 1. All our RSMD products are RoHS compliant. "LFP" of the internal 2D reel label mentions "Lead-Free Process" www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 3 12 0603/0805/1206/2010/2512/4527 MARKING PF0603 2 digits ynsc112 Fig. 1 Value = 10 mΩ PF0805 3 digits ynsc113 Fig. 2 Value = 10 mΩ PF1206 / PF2010 / PF2512 / PF4527 4 digits The “R” is used as a decimal point; the other 3 digits are significant ynsc114 Fig. 3 Value = 33 mΩ CONSTRUCTION The resistors are constructed using outstanding TCR level material, which makes Yageo PF resistors excellent for current sensing application in battery charger circuit & DC-DC converter. The composition of the resistive material is adjusted to give the approximate required resistance and is covered with a protective coating. Marking is printed on the top side of the resistor. Finally, the three external terminations (Cu / Ni / matte Tin) are added, as shown in Fig. 4. Outlines For dimensions, please refer to Table 1 L W marking layer H end termination I1 protective coat ceramic substrate resistive layer YNSC115 Fig. 4 Chip resistor outlines www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 0603/0805/1206/2010/2512/4527 4 12 DIMENSION Table 1 For outlines, please refer to Fig. 4 TYPE RESISTANCE RANGE PF0603 PF0805 PF1206 PF2010 PF2512 PF4527 L (mm) W (mm) H (mm) I1 (mm) 5 mΩ ≦ R < 100 mΩ 1.60 ±0.20 0.80 ±0.20 0.60 ±0.15 0.30 ±0.15 4 mΩ 2.00±0.20 1.25±0.20 0.60 ±0.15 0.70±0.15 5 mΩ 2.00±0.20 1.25±0.20 0.60±0.15 0.63±0.15 6 mΩ ≦ R ≦ 7 mΩ 2.00±0.20 1.25±0.20 0.60±0.15 0.55±0.15 8 mΩ ≦ R < 100 mΩ 2.00±0.20 1.25±0.20 0.60±0.15 0.40±0.15 3 mΩ 3.20±0.20 1.60±0.20 0.60±0.15 1.30±0.20 4 mΩ 3.20±0.20 1.60±0.20 0.60±0.15 1.20±0.20 5 mΩ ≦ R ≦ 8 mΩ 3.20±0.20 1.60±0.20 0.60±0.15 1.15±0.20 9 mΩ ≦ R < 100 mΩ 3.20±0.20 1.60±0.20 0.60±0.15 0.58±0.20 5 mΩ ≦ R ≦ 9 mΩ 5.00±0.20 2.50±0.20 0.60±0.15 1.50±0.20 10 mΩ ≦ R < 100 mΩ 5.00±0.20 2.50±0.20 0.60±0.15 0.60±0.20 1 mΩ 6.30±0.20 3.10±0.20 0.60±0.15 2.93±0.20 2 mΩ 6.30±0.20 3.10±0.20 0.60±0.15 2.70±0.20 3m Ω 6.30±0.20 3.10±0.20 0.60±0.15 2.50±0.20 4m Ω 6.30±0.20 3.10±0.20 0.60±0.15 2.15±0.20 5 mΩ 6.30±0.20 3.10±0.20 0.60±0.15 1.95±0.20 6 mΩ ≦ R ≦ 8 mΩ 6.30±0.20 3.10±0.20 0.60±0.15 1.90±0.20 9 mΩ ≦ R < 100 mΩ 6.30±0.20 3.10±0.20 0.60±0.15 0.95±0.20 5 mΩ 11.50±0.20 7.00±0.20 0.60±0.15 2.90±0.20 6 mΩ ≦ R <1 Ω 11.50±0.20 7.00±0.20 0.60±0.15 2.60±0.20 Note: 1. For relevant physical dimensions, please refer to construction outlines. 2. Please contact with sales offices, distributors and representatives in your region before ordering. www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount SERIES PF 5 12 0603/0805/1206/2010/2512/4527 ELECTRICAL CHARACTERISTICS Table 2 POWER RATING (1) SERIES SIZE PF TOLERANCE RESISTANCE RANGE 07 7W 7T 47 57 0603 1/10W 1/5W 1/3W 2/5W 1/2W 5 mΩ ≦ R < 100 mΩ 0805 1/8W 1/4W 1/3W 1/2W --- 4 mΩ ≦ R < 100 mΩ 1206 1/4W 1/2W --- --- --- 2010 2512 1W 2W --- --- --- 1W 2W --- --- --- --- --- 3W --- --- ±0.5% ±1% ±2% ±5% TEMPERATURE COEFFICIENT OF RESISTANCE 3 mΩ ≦ R < 100 mΩ ±50 ppm/°C 5 mΩ ≦ R < 100 mΩ ±75 ppm/°C 1 mΩ ≦ R < 100 mΩ 1 mΩ ≦ R ≦ 50 mΩ 4527 5 mΩ ≦ R < 1Ω 2W 3W 5W ----Note: 1. Global part number (code 10 - 11) 2. Please contact with sales offices, distributors and representatives in your region before ordering. FUNCTIONAL DESCRIPTION OPERATING TEMPERATURE RANGE Range: –55°C to +155°C POWER RATING Standard rated power at 70°C: PF0603 = 1/10W PF0805 = 1/8W PF1206 = 1/4W PF2010 = 1/2W PF2512 = 1W PF4527 = 2W For detail power value, please refer to Table 2. MRA632 Pmax (%Prated) 100 50 0 −55 0 50 70 100 155 Tamb (°C) Fig. 5 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb ) RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = √(P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (X) www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount SERIES PF 6 12 0603/0805/1206/2010/2512/4527 PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity REEL DIMENSION PF0603 PF0805 PF1206 PF2010 PF2512 PF4527 Paper taping reel (R) 7" (178 mm) 5,000 5,000 --- --- --- --- Embossed taping reel (K) 7" (178 mm) --- --- 4,000 4,000 4,000 2,000 PACKING STYLE PAPER TAPE P0 D0 T P2 E F cover tape W B0 A0 P1 MBG251 Fig. 6 Paper Tape Table 4 Dimensions of paper tape for relevant chip resistors size SIZE Unit: mm SYMBOL A0 B0 W E F P0 P1 P2 ØD0 T PF0603 1.20±0.15 1.90±0.15 8.00±0.30 1.75±0.10 3.50±0.10 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 0.55±0.15 PF0805 1.60±0.15 2.30±0.15 8.00±0.30 1.75±0.10 3.50±0.10 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 0.85±0.15 www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount SERIES PF 7 12 0603/0805/1206/2010/2512/4527 EMBOSSED TAPE P0 D0 P2 E F cover tape W B0 MBG516_b A0 D1 P1 T direction of unreeling Fig. 7 Embossed Tape Table 5 Dimensions of embossed tape for relevant chip resistors size SIZE SYMBOL A0 Unit: mm B0 PF1206 1.82±0.15 3.53±0.15 W E F P0 P1 P2 ØD0 ØD1 T 8.00±0.30 1.75±0.10 3.50±0.10 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 1.50±0.10 0.85±0.15 PF2010 3.00±0.15 5.60±0.15 12.10±0.30 1.75±0.10 5.50±0.10 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 1.50±0.10 0.80±0.15 PF2512 3.40±0.15 6.70±0.15 12.10±0.30 1.75±0.10 5.50±0.10 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 1.50±0.10 0.80±0.15 PF4527 7.50±0.15 12.0±0.15 24.00±0.30 1.75±0.10 11.50±0.10 4.00±0.10 8.00±0.10 2.00±0.10 1.50±0.10 1.50±0.10 0.90±0.15 www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount SERIES PF 8 12 0603/0805/1206/2010/2512/4527 REEL SPECIFICATION W2 D C N A HBK039_a Fig. 8 Reel W1 Table 6 Dimensions of reel specification for relevant chip resistors size SIZE QUANTITY PER REEL REEL SIZE SYMBOL 8 mm TAPE WIDE 12 mm TAPE WIDE A Unit: mm N C D W1 W2 MAX. PF0603 5000 7" (Ø178 mm) -- 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 8.4 +1/-0 12.4 PF0805 5000 7" (Ø178 mm) -- 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 8.4 +1/-0 12.4 PF1206 4000 7" (Ø178 mm) -- 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 8.4 +1/-0 12.4 PF2010 4000 -- 7" (Ø178 mm) 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 12.3 +1/-0 18.4 PF2512 4000 -- 7" (Ø178 mm) 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 12.3 +1/-0 18.4 PF4527 2000 -- 7" (Ø178 mm) 180.0+0/-3 60.0+1/-0 13.0±0.2 21.0±0.8 24.0 +1/-0 26.5 LEADER/TRAILER TAPE SPECIFICATION leader end empty compartments with cover tape (min. 200 mm) trailer end Fig.9 Leader/Trailer Tape trailer (max. 260 mm) cover tape only leader ≥ 350 mm CCB325 www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 9 12 0603/0805/1206/2010/2512/4527 FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles, please refer to data sheet “Chip resistors mounting”. D C B A preferred direction during wave soldering FOOTPRINT solder land / solder paste pattern SCR022 Fig. 10 Single resistor chips recommended dimensions of footprints Table 7 Footprint dimensions SIZE RESISTANCE RANGE PF0603 PF0805 PF1206 PF2010 PF2512 PF4527 Unit: mm A B C D 5 mΩ ≦ R < 100 mΩ 2.10 0.60 0.75 0.92 4 mΩ 2.70 0.40 2.30 1.44 5 mΩ 5.00 0.50 2.25 1.44 6 mΩ ≦ R ≦ 7 mΩ 4.80 0.60 2.10 1.44 8 mΩ ≦ R < 100 mΩ 5.00 0.80 2.10 1.44 3 mΩ 6.20 0.40 2.90 1.84 4 mΩ 6.20 0.50 2.85 1.84 5 mΩ ≦ R ≦ 8 mΩ 6.20 0.60 2.80 1.84 9 mΩ ≦ R < 100 mΩ 6.20 1.20 2.50 1.84 5 mΩ ≦ R ≦ 9 mΩ 8.00 1.40 3.30 2.88 10 mΩ ≦ R < 100 mΩ 8.00 2.70 2.65 2.88 1 mΩ 9.30 0.40 4.45 3.57 2 mΩ 9.30 0.60 4.35 3.57 3 mΩ ≦ R ≦ 4 mΩ 9.30 0.90 4.20 3.57 5 mΩ ≦ R ≦ 8 mΩ 9.30 1.60 3.85 3.57 9 mΩ ≦ R < 100 mΩ 9.30 3.10 3.10 3.57 5 mΩ 14.50 4.00 5.25 8.05 6 mΩ ≦ R <1 Ω 14.50 4.40 5.05 8.05 www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 10 12 0603/0805/1206/2010/2512/4527 TESTS AND REQUIREMENTS Table 8 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Life/ Operational Life/ Endurance MIL-STD-202G-method 108A 1,000 hours at 70±5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ±(1%+0.0005 Ω) High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202G-method 108A ±(1%+0.0005 Ω) IEC 60115-1 4.25.3 1,000 hours at maximum operating temperature depending on specification, unpowered JIS C 5202-7.11 No direct impingement of forced air to the parts Moisture Resistance MIL-STD-202G-method 106F IEC 60115-1 4.24.2 IEC 60115-1 4.25.1 JIS C 5202-7.10 Tolerances: 155±3 °C Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered ±(0.5%+0.0005 Ω) Parts mounted on test-boards, without condensation on parts Measurement at 24±2 hours after test conclusion Thermal Shock MIL-STD-202G-method 107G -55/+155 °C ±(0.5%+0.0005 Ω) Note: Number of cycles required is 300. Devices unmounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air Short Time Overload MIL-R-55342D-para 4.7.5 Board Flex/ Bending IEC60115-1 4.33 IEC60115-1 4.13 5 times of rated power for 5 seconds at room temperature ±(0.5%+0.0005 Ω) Device mounted on PCB test board as described, only 1 board bending required ±(1%+0.05 Ω) No visible damage No visible damage Bending for 0603/0805: 3 mm 1206/2512/4527: 2 mm Holding time: minimum 60 seconds www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 11 12 0603/0805/1206/2010/2512/4527 TEST TEST METHOD PROCEDURE Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required Well tinned (≥95% covered) Magnification 50X No visible damage IEC 60068-2-58 REQUIREMENTS SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245±3 °C Dipping time: 3±0.5 seconds - Leaching - Resistance to Soldering Heat IPC/JEDECJ-STD-002B test D No visible damage IEC 60068-2-58 Leadfree solder, 260 °C, 30 seconds immersion time MIL-STD-202G-method 210F Condition B, no pre-heat of samples ±(0.5%+0.0005 Ω) IEC 60068-2-58 Leadfree solder, 260 °C, 10 seconds immersion time No visible damage Procedure 2 for SMD: devices fluxed and cleaned with isopropanol www.yageo.com Mar. 26, 2012 V.0 Product specification Chip Resistor Surface Mount PF SERIES 0603/0805/1206/2010/2512/4527 12 12 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 0 Mar. 26, 2012 - - New datasheet for current sensor - low TCR PF series sizes of 0603/0805/1206/2010/2512/4527, 0.5%, 1%, 2% and 5% with lead-free terminations “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any product change will be announced by PCN.” www.yageo.com Mar. 26, 2012 V.0