DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Product Specification – November 12, 2012 V.17 General data Product specification Surface-Mount Ceramic Multilayer Capacitors 2 2 General data PACKING TAPE AND REEL SPECIFICATIONS Packing conforms fully with “IEC 60286-3”, “EIA 481-1” and “JIS C0806” industrial standards. Table 1 Properties of carrier tape - polycarbonate 8.1/12 MM TAPE WIDTH, 0.2 MM TOLERANCE Multilayer Chip Capacitors (MLCCs) are supplied on tape on reel or in bulk case. For MLCCs with a product thickness of <1 mm, paper/PE tape is preferred. MLCCs with a product thickness of ≥ 1 mm, are supplied in embossed blister tape. Thickness 130 to 360µm Tensile strength at break For the combination carrier/cover tape no electrostatic behaviour is observed (relative humidity ≥ 30%). The products do not stick to the cover tape. The technical and thermal properties of polycarbonate tapes are excellent, so there is no change in dimensions as a function of time. The peel off force is very stable as a function of time and temperature, and it is defined as 0.1 to 0.7 N at a peel-off speed of 300 mm/minute. > 60 MPa Elongation at break 100 to 150% Surface resistance < 1012 Ω/sq. Table 2 Properties of cover tape - polyester (antistatic) 5.5/9.5 MM TAPE WIDTH, 0.1 MM TOLERANCE Thickness 62 µm Breaking force > 20 N / ≥ 17.6 N Elongation at break 105 ±60% < 1011 Ω/sq. Surface resistance BULK-CASE SPECIFICATION In accordance with “IEC 60286-6”. Reduced shutter coupled portion - Storage - Transport - Machine handling - Packing Customized slider handbook, 4 columns costs labelling (bar codes) Available component size please see table 3 MGB377 Fig. 1 Bulk-case outline OUTLINES Table 3 Packing quantities for component size; see note 1 and Fig.1 For dimension see Table 3 L1 (mm) W (mm) T (mm) QUANTITY PER BULK CASE 0402 1.0 0.5 0.5 50,000 0603 1.6 0.8 0.8 15,000 0805 2.0 1.25 0.6 10,000 0805 2.0 1.25 0.85 8,000 0805 2.0 1.25 1.25 5,000 SIZE CODE W T L2 L4 L1 L3 MBB211 Fig. 2 Surface mounted multilayer ceramic capacitor dimension NOTE 1. Refer to the selection charts in product data for specific values www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 3 3 General data PAPER/PE TAPE SPECIFICATION P0 D0 T P2 E F cover tape W B0 MBG251 A0 P1 Fig. 3 Paper/PE tape Table 4 Dimensions of paper/PE tape for relevant chip size; see Fig.3 SIZE SYMBOL Unit: mm (1) CODE A0 0201 0.37 ±0.03 0.69 ±0.05 8.0 ±0.20 1.75 ±0.05 3.50 ±0.05 4.0 ±0.1 0402 0.60 ±0.05 1.10 ±0.05 8.0 ±0.20 1.70 ±0.05 3.50 ±0.05 4.0 ±0.05 2.0 ±0.05 2.0 ±0.05 1.50 +0.1/-0 0.60 ±0.05 0603 0.95 ±0.05 1.78 ±0.05 8.0 ±0.20 1.70 ±0.05 3.50 ±0.05 4.0 ±0.05 4.0 ±0.05 2.0 ±0.05 1.50 +0.1/-0 0.95 ±0.05 0805 1.50 ±0.05 2.26 ±0.05 8.0 ±0.20 1.70 ±0.05 3.50 ±0.05 4.0 ±0.05 4.0 ±0.05 2.0 ±0.05 1.50 +0.1/-0 0.95 / 0.75 1206 1.90 ±0.10 3.50 ±0.10 8.0 ±0.20 1.70 ±0.05 3.5 ±0.05 1.50 +0.1/-0 0.95 / 0.75 B0 W E F P0 P1 P2 2.0 ±0.05 2.0 ±0.05 4.0 ±0.05 4.0 ±0.10 2.0 ±0.05 ØD0 T 1.55 ±0.03 0.42 ±0.05 4 × 0402 1.50 ±0.05 2.26 ±0.05 8.0 ±0.20 1.70 ±0.05 3.50 ±0.05 4.0 ±0.05 4.0 ±0.05 2.0 ±0.05 1.50 +0.1/-0 0.95 / 0.75 4 × 0603 1.90 ±0.10 3.50 ±0.10 8.0 ±0.20 1.70 ±0.05 3.5 ±0.05 4.0 ±0.05 4.0 ±0.10 2.0 ±0.05 1.50 +0.1/-0 0.95 / 0.75 0508 1.50 ±0.05 2.26 ±0.05 8.0 ±0.20 1.70 ±0.05 3.50 ±0.05 4.0 ±0.05 4.0 ±0.05 2.0 ±0.05 1.50 +0.1/-0 0.95 / 0.75 0612 1.90 ±0.10 3.50 ±0.10 8.0 ±0.20 1.70 ±0.05 3.5 ±0.05 1.50 +0.1/-0 0.95 / 0.75 4.0 ±0.05 4.0 ±0.10 2.0 ±0.05 NOTE 1. P0 pitch tolerance over any 10 pitches is 0.2 mm 2. 4 x 0402 stands for 0508 array 3. 4 x 0603 stands for 0612 array www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 4 4 General data BLISTER TAPE SPECIFICATION For dimension see Table 4 P0 D0 K0 P2 E F cover tape W B0 A0 T2 SCM015 D1 P1 direction of unreeling K0: so chosen that the orientation of the component cannot change For W = 8 mm: T2 = 3.5 mm max. For W = 12 mm: T2 = 6.5 mm max. Fig. 4 Blister tape Table 5 Dimensions of blister tape for relevant chip size; see Fig.4 SYMBOL SIZE B0 CODE A0 Unit: mm K0 W Min. Max. Min. Max. Min. Max. E F ØD0 ØD1 P0 (2) P1 P2 Min. 0805 1.29 1.57 2.08 2.39 1.27 1.55 8.1 ±0.20 1.70 ±0.1 3.5 ±0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ±0.10 4.0 ±0.10 2.0 ±0.05 1206 1.65 2.01 3.30 3.63 1.22 2.03 8.1 ±0.20 1.70 ±0.1 3.5 ±0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ±0.10 4.0 ±0.10 2.0 ±0.05 1210 2.55 3.02 3.28 3.76 0.78 2.75 8.1 ±0.20 1.70 ±0.1 3.5 ±0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ±0.10 4.0 ±0.10 2.0 ±0.05 1808 2.10 2.45 4.80 5.45 1.30 2.45 12.1 ±0.20 1.70 ±0.1 5.5 ±0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ±0.10 8.0 ±0.10 2.0 ±0.05 1812 3.24 3.75 4.60 5.20 0.80 2.40 12.1 ±0.20 1.70 ±0.1 5.5 ±0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ±0.10 8.0 ±0.10 2.0 ±0.05 2220 5.12 5.32 5.84 6.04 1.28 1.48 12.0 ±0.20 1.70 ±0.1 5.5 ±0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ±0.10 8.0 ±0.10 2.0 ±0.05 NOTE 1. Typical capacitor displacement in pocket 2. P0 pitch tolerance over any 10 pitches is ±0.2 mm www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 5 5 General data REEL SPECIFICATION W2 C N A HBK039 W1 Fig. 5 Reel Table 6 Reel dimensions; see Fig.5 SYMBOL TAPE WIDTH A N C W1 8 (Ø178 mm/7") 178 ±1.0 60 ±1.0 13 +0.50/-0.20 9.0 ±0.2 14.4 8 (Ø330 mm/13") 330 ±1.0 100 ±1.0 13 +0.50/-0.20 9.0 ±0.2 14.4 12 (Ø178 mm/7") 178 ±1.0 60 ±1.0 13 +0.50/-0.20 13.4 ±1.5 18.4 Unit: mm W2max. P ROPERTIES OF REEL Material: polystyrene Surface resistance: <10 10 X/sq. www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 6 6 General data THICKNESS CLASSES AND PACKING QUANTITY Table 7 SIZE CODE Ø180 MM / 7 INCH Ø330 MM / 13 INCH THICKNESS CLASSIFICATION TAPE WIDTH QUANTITY PER REEL Paper/PE Blister Paper/PE Blister QUANTITY PER BULK CASE 0201 0.3 ±0.03 mm 8 mm 15,000 --- 50,000 --- --- 0402 0.5 ±0.05 mm 8 mm 10,000 --- 50,000 --- 50,000 0603 0.8 ±0.1 mm 8 mm 4,000 --- 15,000 --- 15,000 0.6 ±0.1 mm 8 mm 4,000 --- 20,000 --- 10,000 0805 0.85 ±0.1 mm 8 mm 4,000 --- 15,000 --- 8,000 1.25 ±0.2 mm 8 mm --- 3,000 --- 10,000 5,000 0.6 ±0.1 mm 8 mm 4,000 --- 20,000 --- --- 0.85 ±0.1 mm 8 mm 4,000 --- 15,000 --- --- 1.00 / 1.15 ±0.1 mm 8 mm --- 3,000 --- 10,000 --- 1.25 ±0.2 mm 8 mm --- 3,000 --- 10,000 --- 1.6 ±0.15 mm 8 mm --- 2,500 --- 10,000 --- 1.6 ±0.2 mm 8 mm --- 2,000 --- 8,000 --- 0.6 / 0.7 ±0.1 mm 8 mm --- 4,000 --- 15,000 --- 0.85 ±0.1 mm 8 mm --- 4,000 --- 10,000 --- 1.15 ±0.1 mm 8 mm --- 3,000 --- 10,000 --- 1.15 ±0.15 mm 8 mm --- 3,000 --- 10,000 --- 1.25 ±0.2 mm 8 mm --- 3,000 --- --- --- 1.5 ±0.1 mm 8 mm --- 2,000 --- --- --- 1.6 / 1.9 ±0.2 mm 8 mm --- 2,000 --- --- --- 2.0 ±0.2 mm 8 mm --- 2,000 1,000 --- --- --- 2.5 ±0.2 mm 8 mm --- 1,000 500 --- --- --- 1.15 ±0.15 mm 12 mm --- 3,000 --- --- --- 1.25 ±0.2 mm 12 mm --- 3,000 --- --- --- 1.35 ±0.15 mm 12 mm --- 2,000 --- --- --- 1.5 ±0.1 mm 12 mm --- 2,000 --- --- --- 1.6 ±0.2 mm 12 mm --- 2,000 --- --- --- 2.0 ±0.2 mm 12 mm --- 2,000 --- --- --- 0.6 / 0.85 ±0.1 mm 12 mm --- 2,000 --- --- --- 1.15 ±0.1 mm 12 mm --- 1,000 --- --- --- 1.25 ±0.2 mm 12 mm --- 1,000 --- --- --- 1.5 ±0.1 mm 12 mm --- 1,000 --- --- --- 1.6 ±0.2 mm 12 mm --- 1,000 --- --- --- 2.0 ±0.2 mm 12 mm --- 1,000 --- --- --- 2.5 ±0.2 mm 12 mm --- 500 --- --- --- 1206 1210 1808 1812 www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 7 7 General data LEADER/TRAILER TAPE SPECIFICATION leader end cover tape only empty compartments with cover tape trailer end trailer (max. 260 mm) leader 180 mm 400 mm MEA529-b Fig. 6 Leader/trailer tape Table 8 Leader/trailer tape data DESCRIPTION VALUE Minimum length of empty compartments at leader end ≥ 400 mm of which a minimum 260 mm of empty compartments are covered with cover tape and ≥ 180 mm cover tape only Minimum length of empty compartments at trailer end ≥ 180 mm www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 8 8 General data LABELLING Label examples are shown in Fig. 7 (1 ) (2 ) (3 ) (4 ) QTY 4000 LINE MARKING EXPLANATION 0327 0049 (6) (5 ) 37 808 (1T) B/N (30P) CTC 8921310001 C 0603 JR NP0 9BN 220 1 Quantity 2 Bar code of batch no (1D) 3 Unique batch number 4 Bar code of CTC (2D) 5 Taping week code 6 Series code of reel YNM0010 Fig. 7 Packing label www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 9 9 General data MOUNTING SOLDERING CONDITIONS For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering or conductive adhesive in accordance with IEC 61760-1 (Standard method for the specification of surface mounting components). For advised soldering profiles see Figs 8, 9, 10. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (>100 °C). Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given in Tables 8, 9 and 10 for reflow and wave soldering. More detailed information is available on request. 300 YNM0015 T 10 s max. (°C) 250 240 °C 230 °C 215 °C 200 180 °C 160 °C 150 °C 150 ca. 60 s > 180 °C 130 °C Ramp down rate < 6 °C/s Preheating 100 Typical Ramp up rate < 3 °C/s 50 100 50 0 0 150 200 250 t (s) Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). Fig. 8 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for SnPb solders www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 10 General data 300 10 YNM0016 10 s max. T (°C) 260 °C 255 °C 245 °C 250 220 °C 200 180 °C Preheating ca. 45~90 s > 220 °C 150 °C 150 Typical Ramp down rate < 6 °C/s 100 Ramp up rate < 3 °C/s 50 0 0 50 100 150 200 250 300 350 t (s) 400 Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). Fig. 9 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for lead-free SnAgCu solders 300 T 10 s max., max. contact time 5 s per wave (°C) 235 °C to 260 °C (SnPb) 250 °C to 260 °C (SnAgCu) 250 cooling first wave 200 Preheating ca. 2 °C/s ΔT < 150 °C ca. 3.5 °C/s typical 150 ca. 5 °C/s 130 °C 120 °C 100 °C 100 YNM0017 second wave Typical 50 0 0 50 100 150 200 t (s) 250 Solid line: Typical process Dotted lines: Process limits Fig. 10 Double wave soldering for SnPb and lead-free SnAgCu solder - Temperature/time profile (terminal temperature) www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 11 11 General data FOOTPRINT DIMENSIONS D G E C B A F preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area tracks "E" available area for tracks underneath the chip MBG628 Fig. 11 Discrete capacitors recommended dimensions of footprint Table 9 Reflow soldering; for footprint dimensions see Fig.11 SIZE Unit: mm FOOTPRINT DIMENSIONS CODE A B C D E F G 0201 0.8 ±0.20 0.25 ±0.05 0.28 ±0.07 0.3 ±0.10 --- --- --- 0402 1.5 ±0.15 0.5 ±0.15 0.5 ±0.15 0.5 ±0.15 0.10 ±0.15 1.75 ±0.15 0.95 ±0.15 0603 2.3 ±0.15 0.7 ±0.15 0.8 ±0.15 0.9 ±0.15 0.26 ±0.15 2.7 ±0.15 1.5 ±0.15 0603 2.3 ±0.25 0.5 ±0.25 0.9 ±0.25 0.9 ±0.25 0.0 ±0.25 2.7 ±0.25 1.5 ±0.25 0805 2.8 ±0.25 0.9 ±0.25 0.95 ±0.25 1.4 ±0.25 0.45 ±0.25 3.2 ±0.25 2.1 ±0.25 1206 4.0 ±0.25 2.0 ±0.25 1.0 ±0.25 1.8 ±0.25 1.4 ±0.25 4.4 ±0.25 2.5 ±0.25 1210 4.0 ±0.25 2.0 ±0.25 1.0 ±0.25 2.7 ±0.25 1.4 ±0.25 4.4 ±0.25 3.4 ±0.25 1808 5.4 ±0.25 3.3 ±0.25 1.05 ±0.25 2.3 ±0.25 2.7 ±0.25 5.8 ±0.25 2.9 ±0.25 1812 5.4 ±0.25 3.3 ±0.25 1.05 ±0.25 3.5 ±0.25 2.7 ±0.25 5.8 ±0.25 4.1 ±0.25 2220 6.6 ±0.25 4.5 ±0.25 1.05 ±0.25 5.3 ±0.25 3.9 ±0.25 7.0 ±0.25 5.9 ±0.25 Processing remarks IR or hot plate soldering Ceramic substrate only Table 10 Wave soldering (no dummy tracks allowed for ≥ 500 V); for footprint dimensions see Fig.11 SIZE Unit: mm FOOTPRINT DIMENSIONS CODE A B C D E F G 0603 2.4 ±0.10 1.0 ±0.10 0.7 ±0.10 0.8 ±0.10 0.2 ±0.10 3.0 ±0.10 1.9 ±0.10 1 x (0.2 x 0.8) 0603 2.7 ±0.25 0.9 ±0.25 0.9 ±0.25 0.8 ±0.25 0.0 ±0.25 3.2 ±0.25 2.1 ±0.25 1 x (0.3 x 0.8) 0805 3.2 ±0.15 1.4 ±0.15 0.9 ±0.15 1.3 ±0.15 0.36 ±0.15 4.1 ±0.15 2.5 ±0.15 1 x (0.3 x 1.3) 0805 3.4 ±0.25 1.3 ±0.25 1.05 ±0.25 1.3 ±0.25 0.2 ±0.25 4.3 ±0.25 2.7 ±0.25 1 x (0.2 x 1.3) 1206 4.8 ±0.25 2.3 ±0.25 1.25 ±0.25 1.7 ±0.25 1.25 ±0.25 5.9 ±0.25 3.2 ±0.25 3 x (0.25 x 1.7) Number & dimensions to dummy tracks www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors E 12 12 General data D B A C CCB405 solder land Fig. 12 Recommended footprint dimensions for C-Array Table 11 C-Array footprint dimensions; see Fig.12 FOOTPRINT DIMENSIONS Unit: mm SIZE CODE A B C D E 0405 (2 x 0402) 1.4 ±0.15 0.4 ±0.05 0.6 ±0.05 0.64 0.35 ±0.05 0508 (4 x 0402) 1.65 ±0.15 0.55 ±0.05 0.55 ±0.05 0.5 0.25 ±0.05 0612 (4 x 0603) 2.54 ±0.15 0.89 ±0.10 0.76 ±0.10 0.80 ±0.10 0.45 ±0.10 www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors 13 13 General data TESTS AND REQUIREMENTS Table 12 Test procedures and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC 6038421/22 4.3 The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage Visual inspection and dimension check 4.4 Any applicable method using × 10 magnification In accordance with specification Capacitance 4.5.1 Class 1: f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 Vrms at 20 °C Within specified tolerance f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C Class 2: f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 Vrms at 20 °C f = 120 Hz for C >10 µF, measuring at voltage 0.5 Vrms at 20 °C Dissipation factor (D.F.) 4.5.2 Class 1: f = 1 MHz for C ≤ 1 nF , measuring at voltage 1 Vrms at 20 °C In accordance with specification f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C Class 2: f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 Vrms at 20 °C f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C Insulation resistance 4.5.3 At Ur (DC) for 1 minute In accordance with specification Temperature coefficient 4.6 Class 1: Between minimum and maximum temperature NP0: -55 °C to +125 °C Normal Temperature: 20 °C <General purpose series> Class 2: Between minimum and maximum temperature X5R: -55 °C to +85 °C X7R: -55 °C to +125 °C Y5V: -30 °C to +85 °C Normal Temperature: 20 °C <General purpose series> Class 2: X5R/X7R: ±15% Y5V: 22% to -82% A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate Force size ≥ 0603: 5N size = 0402: 2.5N size = 0201: 1N Temperature characteristic Adhesion 4.7 C/C: Class 1: NP0: ±30 ppm/°C <High Capacitance series> Class 2: X5R/X7R: ±15% Y5V: 22% to - 82% www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST TEST METHOD Bond strength of plating on end face IEC 6038421/22 4.8 14 General data PROCEDURE REQUIREMENTS Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damage Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm <General purpose series> 14 ∆C/C Class 1: NP0: within ±1% or 0.5 pF, whichever is greater Class2: X5R/X7R/Y5V: ±10% <High Capacitance series> ∆C/C Class2: X5R/X7R/Y5V: ±10% Resistance to soldering heat 4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours at room temperature Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ±5 °C Dipping time: 10 ±0.5 seconds Recovery time: 24 ±2 hours Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned <General purpose series> ∆C/C Class 1: NP0: within ±0.5% or 0.5 pF, whichever is greater Class2: X5R/X7R: ±10% Y5V: ±20% <High Capacitance series> ∆C/C Class2: X5R/X7R: ±10% Y5V: ±20% D.F. within initial specified value Rins within initial specified value Solderability 4.10 Preheated the temperature of 80 °C to 140 °C and maintained for 30 seconds to 60 seconds. The solder should cover over 95% of the critical area of each termination Test conditions for lead containing solder alloy Temperature: 235 ±5 °C Dipping time: 2 ±0.2 seconds Depth of immersion: 10 mm Alloy Composition: 60/40 Sn/Pb Number of immersions: 1 Test conditions for leadfree containing solder alloy Temperature: 245 ±5 °C Dipping time: 3 ±0.3 seconds Depth of immersion: 10 mm Alloy Composition: SAC305 Number of immersions: 1 www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST METHOD PROCEDURE REQUIREMENTS Rapid change of temperature IEC 6038421/22 Preconditioning; 150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours at room temperature No visual damage 4.11 15 General data TEST 15 <General purpose series> ∆C/C 5 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature Recovery time 24 ±2 hours Class 1: NP0: within ±1% or 1 pF, whichever is greater Class2: X5R/X7R: ±15% Y5V: ±20% <High Capacitance series> ∆C/C Class2: X5R/X7R: ±15% Y5V: ±20% D.F. meet initial specified value Rins meet initial specified value Damp heat with Ur load 4.13 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ±1 hour at room temp 2. Initial measure: Spec: refer initial spec C, D, IR 3. Damp heat test: 500 ±12 hours at 40 ±2 °C; 90 to 95% R.H. 1.0 Ur applied 4. Recovery: Class 1: 6 to 24 hours Class 2: 24 ±2 hours 5. Final measure: C, D, IR P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be precondition according to “IEC 60384 4.1” and then the requirement shall be met. No visual damage after recovery <General purpose series> ∆C/C Class 1: NP0: within ±2% or 1 pF, whichever is greater Class2: X5R/X7R: ±15%; Y5V: ±30% D.F. Class 1: NP0: ≤ 2 x specified value Class2: X5R/X7R: ≤ 16V: ≤ 7% ≥ 25V: ≤ 5% Y5V: ≤ 15% Rins Class 1: NP0: ≥ 2,500 MΩ or Rins x Cr ≥ 25s whichever is less Class2: X5R/X7R/Y5V: ≥ 500 MΩ or Rins x Cr ≥ 25s whichever is less <High Capacitance series> ∆C/C Class2: X5R/X7R: ±20%; Y5V: ±30% D.F. Class2: 2 x initial value max Rins Class2: 500 MΩ or Rins x Cr ≥ 25s, whichever is less www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST TEST METHOD Endurance IEC 6038421/22 General data PROCEDURE 4.14 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ±1 hour at room temp 2. Initial measure: Spec: refer initial spec C, D, IR 3. Endurance test: Temperature: NP0/X7R: 125 °C X5R/Y5V: 85 °C Specified stress voltage applied for 1,000 hours: Applied 2.0 x Ur for general product Applied 1.5 x Ur for high cap. product High voltage series follows with below stress condition: Applied 1.3 x Ur for 500V series Applied 1.2 x Ur for 1KV, 2KV, 3KV series 16 REQUIREMENTS No visual damage <General purpose series> ∆C/C Class1: NP0: within ±2% or 1 pF, whichever is greater Class2: X5R/X7R: ±15%; Y5V: ±30% D.F. Class1: NP0: ≤ 2 x specified value Class2: X5R/X7R: ≤ 16V: ≤ 7% ≥ 25V: ≤ 5% 4. Recovery time: 24 ±2 hours Y5V: ≤ 15% 5. Final measure: C, D, IR Rins P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be precondition according to “IEC 60384 4.1” and then the requirement shall be met. 16 Class1: NP0: ≥ 4,000 MΩ or Rins x Cr ≥ 40s whichever is less Class2: X5R/X7R/Y5V: ≥ 1,000 MΩ or Rins x Cr ≥ 50s whichever is less <High Capacitance series> ∆C/C Class 2: X5R/X7R: ±20%; Y5V: ±30% D.F. Class 2: 2 x initial value max Rins Class 2: 1,000 MΩ or Rins x Cr ≥ 50s, whichever is less Voltage proof IEC 60384-1 4.6 Specified stress voltage applied for 1 minute No breakdown or flashover Ur ≤ 100 V: series applied 2.5 Ur 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100) 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100) Ur > 500 V: 1.3 Ur I: 7.5 mA www.yageo.com Nov. 12, 2012 V.17 Product specification Surface-Mount Ceramic Multilayer Capacitors General data 17 17 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 17 Nov. 12, 2012 - - Thickness classes and Packing quantity updated Version 16 Oct 05, 2012 - - Thickness classes and Packing quantity updated Version 15 Mar 09, 2011 - - Packing quantity added Version 14 Feb 18, 2011 - - 0201 PE tape specifications added Version 13 Sep 15, 2010 - - Dimensions of blister tape updated Version 12 Sep 18, 2009 - - PE tape specifications updated Version 11 Sep 07, 2009 - - PE tape specifications added Version 10 Jun 12, 2009 - - Paper tape specifications updated Version 9 Apr 03, 2009 - - Change to dual brand datasheet - Label definition updated - Reflow soldering for Sn/Pb chart updated - Reflow soldering for lead free (Pb-free) chart added - Double wave soldering chart updated - Tests and requirements updated Version 8 Apr 11, 2006 - - Taping quality improved Version 7 Jul 10, 2003 - - Company logo updated - Taping specification updated - Label definition updated Version 6 May 30, 2001 - - Converted to Phycomp brand www.yageo.com Nov. 12, 2012 V.17