Low-inductance MLCCs for high-speed digital systems attenuation (dB) 0 -20 X7R 1206/22nF -40 X7R 0612/22nF X7R 1206/100nF -60 www.yageo.com -80 104 X7R 0612/100nF 105 106 107 108 frequency (Hz) 109 The latter quality, in particular, can be seen from the wellknown relation between the voltage induced in an inductor L and the rate of change of current, i.e.V = L (di/dt). In highspeed circuits, where di/dt can be quite large, the large voltage spikes generated in the power supply can lead to system abnormalities such as shut down or even complete failure. The magnitude of the voltage spikes can be minimized only by reducing ESL. SUMMARY Yageo's Phycomp branded low-inductance MLCCs are ideal for decoupling in high-speed digital systems.With terminations on the longer sides, the capacitors exhibit significantly lower parasitic inductance than their conventional counterparts, making them particularly effective at suppressing noise and ripple on highfrequency circuits. The capacitors are also characterized by high series resonant frequency, providing the bonus of exceptionally broad bandwidth. Phycomp’s low-inductance chip capacitors offer the answer The answer can be found with Phycomp’s new range of low-inductance MLCCs in class II X7R dielectric. With terminations on the longer sides, the capacitors exhibit significantly lower parasitic inductance than their conventional counterparts. This is clear from Fig.1 which compares the parasitic inductances of standard 1206, 0603 and 0805 MLCCs with those of Phycomp’s new 0612 and 0508 low-inductance MLCC series. It is important to note that this reduction is exclusively a function of the coupling between the terminations and is not related to the dielectric material or capacitance value. MSD345 1.0 inductance (nH) With clock frequencies of modern processors nowadays often exceeding 2 GHz, together with increasing processor currents, low equivalent series inductance (ESL) capacitors are now an essential requirement for decoupling and bypass circuits. Not only are low-inductance capacitors capable of operating over broader bandwidths than conventional versions, they are also more effective at suppressing HF noise and reducing ripple voltage on DC lines. 0.8 1206 0.6 0805 0.4 0603 0.2 0508 0612 0 10 102 103 104 frequency (MHz) Fig.1 ESL measurements of X7R 100 nF MLCCs Excellent high-frequency performance Figure 2 shows the transmission characteristics of a bypass circuit and highlights the crucial importance of low parasitic inductance in bypass capacitors.The lower ESL of the 0612 capacitor results in higher resonant frequency than that in the equivalent 1206 capacitor, enabling the 0612 capacitor to operate over a significantly broader bandwidth. Lower ESL, moreover, results in lower impedance, which implies superior HF noise-suppression characteristics. MSD346 0 attenuation (dB) Low-inductance MLCCs for high-speed digital systems - 20 X7R 1206/22 nF - 40 X7R 0612/22 nF X7R 1206/100 nF - 60 - 80 104 Fig.2 Yageo's Phycomp branded low-inductance MLCC series X7R 0612/100 nF 105 106 107 108 frequency (Hz) 109 Comparison of transmission characteristics of standard MLCCs and Yageo's Phycomp branded low-inductance MLCCs Excellent high-frequency performance Figure 2 shows the transmission characteristics of a bypass circuit and highlights the crucial importance of low parasitic inductance in bypass capacitors.The lower ESL of the 0612 capacitor results in higher resonant frequency than that in the equivalent 1206 capacitor, 2 3 Benefits of Phycomp new low-inductance MLCCs L2 L4 L3 • Low ESL gives exceptionally broad bandwidths for HF decoupling and bypassing applications • Superior suppression of noise and ripple compared with conventional capacitors Typical applications Soldering conditions Substrate handling precautions Surface-mount components are tested for solderability at a temperature of 235 ºC for 2 seconds. A typical example of a soldering process that provides reliable joints without any damage is given in Fig.5. • Ensure that the PC board is not flexed excessively after the product and other components have been soldered If necessary, use a support pin to prevent excessive flexing on the PC board • Mount the products as far as possible from the break line of the PC board and from any line of large holes on the board • Do not break the PC board by hand. We recommend the use of a machine or jig to break the board T (˚C) W 10 s 300 250 The outstanding properties of Yageo's Phycomp branded low-inductance MLCCs make them ideal for decoupling/bypassing functions in a broad range of modern equipment including: • Notebook PCs • Desktop PCs • Hand-held computers • Mobile phones • Digital consumer equipment (e.g. DVD players, LCD monitors and camcorders) Capacitance range Capacitance tolerance Rated voltage Ur (DC) Test voltage (DC) for 1 minute Tan δ Insulation resistance after 1 min. at Ur (DC) ESL Temperature coefficient Ageing per decade Operating temperature range Terminations 0508 0612 10 nF to 100 nF, 10 nF to 100 nF 25 V 100 nF to 220 nF, 16 V ±10% 25 V/16 V ±10% 50 V 2.5 x Ur 2.5 x Ur 2.5%, 25V 3.5%, 16V 2.5% RC > 1000 s RC > 1000 s 215 ˚C 200 10 s 40 s 180 ˚C T 150 L 130 ˚C another component 100 MSD347 0508 0612 W 1.25 ±0.20 1.60 ±0.20 Typical values (solid line) Process limits (dotted line) 2.00 ±0.20 3.20 ±0.20 T 0.85 ±0.10 0.85 ±0.10 L2, L3 L4 (min) 0.13 to 0.38 0.46 0.13 to 0.50 0.46 0 0 Fig.5 50 100 150 200 t (s) 250 15% 1% (typ.) low inductance MLCC support pins Handling precautions Fig.3 Phycomp’s low-inductance MLCCs with terminations on the longer sides (dimensions in mm) Component soldering Reflow soldering • Print solder paste to a thickness of 150 to 200 µm • Use rosin-based flux, do not use activated flux (containing, for example, more than 0.2% by weight of chlorine) • Use solder consisting of Sn/Pb in the proportions 63/37 or 60/40 or Sn/Pb/Ag in the proportion 62/36/2 Soldering precautions • Note that this product will be easily damaged by rapid heating, rapid cooling or local heating • Do not subject the product to thermal shock by the use of soldering temperatures greater than 100 ºC.We recommend the use of preheating and annealing (gradual cooling) stages during the soldering cycle • Wave soldering of this product is not recommended since this can lead to the formation of solder bridging due to the narrow pitch of the product Solder gun precautions 500 pH (max.) D 15% 1% (typ.) -55 ºC to +125 ºC -55 ºC to +125 ºC B Ni/Sn PC board Soldering conditions (infrared soldering) Solder footprint 600 pH (max.) vacuum nozzle 2 K/s 50 L MSD348 260 ˚C ª 245 ˚C A B C D Ni/Sn 0508 0.50 2.00 1.00 2.50 0612 0.80 3.20 1.00 2.80 Note the following precautions when using a solder gun for replacement: • The tip temperature must not exceed 280 ºC for 3 s. To ensure this, use a solder gun with a power of less than 30 W • The solder gun tip must not come into direct contact with the product Fig.6 MSD350A Precautions when handling substrate Storage conditions Note the following precautions when storing the product: • Avoid high-temperature, high-humidity and dusty environments and atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these can degrade terminal solderability • Keep the storage temperature less than 40 ºC, relative humidity less than 70% and, if possible, do not keep in storage longer than 6 months • Avoid direct heat and sunshine to prevent the packaging tape from melting and sticking to the product More information For more information and data contact your local Yageo sales representative (contact details on the back cover) or visit our web site on http://www.yageo.com. Specifications and mechanical details C Fig.4 4 A MSD349 Solder footprint (dimensions in mm) 5 6 7 YAGEO - A GLOBAL COMPANY ASIA China, Dongguan Tel. +86 769 791 0053 Fax. +86 769 772 0295 China, Suzhou Tel. +86 512 825 5568 Fax. +86 512 825 5386 Korea, Seoul Tel. +82 2 515 0783 Fax. +82 2 3444 3979 Malaysia, Prai Penang Tel: +60 4 397 3317 Fax: +60 4 397 3272 Malaysia, Puchong Tel: +60 3 5882 2864 Fax: +60 3 5882 8700 Hong Kong Tel. +852 2793 3130 Fax. +852 2763 6501 Japan, Tokyo Tel. +81 3 5833 3331 Fax. +81 3 5833 3116 Singapore Tel. +65 6244 7800 Fax. +65 6244 4943 Taiwan, Taipei Tel. +886 2 2917 7555 Fax. +886 2 2917 0148 EUROPE Benelux, Roermond Tel. +31 475 385 357 Fax. +31 475 385 589 Finland, Espoo Tel. +358 9 2707 5851 Fax. +358 9 2707 5852 Hungary, Budapest Tel. +36 30 3777 441 Fax. +36 94 517 701 Italy, Milan Tel. +39 02 2411 3055 Fax. +39 02 2411 3051 France, Paris Tel. +33 1 55 51 84 00 Fax. +33 1 55 51 84 24 Germany, Hamburg Tel. +49 4121 870-0 Fax. +49 4121 870-297 UK, Leatherhead Tel. +44 1372 364500 Fax. +44 1372 364567 Spain, Barcelona Tel. +34 93 317 2503 Fax. +34 93 302 3387 Sweden, Stockholm Tel. +46 8514 933 55 Fax. +46 8514 933 51 Russia, Moscow Tel. +7 095 778 5731 Tel. +7 501 430 9627 Fax. +7 095 567 0266 NORTH AMERICA U.S.A., Addison TX Tel. +1 214 561 2020 Fax. +1 214 561 2019 For more detailed and always up-to-date contact details of sales offices and distributors please go to our web site at: www.yageo.com © YAGEO Corporation All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands Document order number: 9398 084 32011 Date of release: October 2002 www.yageo.com