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DATA SHEET
THICK FILM CHIP RESISTORS
Product Specification – Mar 25, 2008 V.7
Introduction
Product specification
Chip Resistor Surface Mount
Thick film technology
INTRODUCTION
Data in data sheets is presented - whenever possible
-according to a 'format', in which the following
chapters are stated:
This unique number is an easily-readable
code. Global part number is preferred.
 15 digits code (PHYCOMP CTC): Phycomp
branded products
TITLE

CTC:
SCOPE
14~18 digits code (Global part number):
Yageo/Phycomp branded products
12NC:
APPLICATION
FEATURES
ORDERING
2
16
INTRODUCTION
INFORMATION
MARKING
In general,the tolerance,packing and
resistance code are integral parts of this number.
 Phycomp branded product
Further informations will be mentioned in the
relevant data sheet.
CONSTRUCTION
DIMENSIONS
ELECTRICAL
PACKING
CHARACTERISTICS
STYLE AND PACKAGING QUANTITY
FUNCTIONAL
TESTS
DESCRIPTION
AND REQUIREMENTS
The chapters listed above are explained in this
section “Introduction Thick Film Chip Resistors”, with
detailed information in the relevant data sheet.
Chapters “Mounting”, “Packing”, and “Marking” are
detailed in separate sections.
DESCRIPTION
All thick film types of chip resistors have a
rectangular ceramic body. The resistive element is a
metal glaze film. The chips have been trimmed to the
required ohmic resistance by cutting one or more
grooves in the resistive layer. This process is
completely computer controlled and yields a high
reliability. The terminations are attached using either
a silver dipping method or by applying nickel
terminations, which are covered with a protective
epoxy coat, finally the two external terminations
(matte tin on Ni-barrier) are added.
The resistive layer is coated with a colored
protective layer. This protective layer provides
electrical, mechanical and/or environmental
protection - also against soldering flux and cleaning
solvents, in accordance with “MIL-STD-202G”, method
215 and “IEC 60115-4.29”. Yageo thick film chip
resistor is flameproof and can meet “UL94V-0”.
ORDERING INFORMATION - 12NC & GLOBAL
CLEAR TEXT CODE
FUNCTIONAL DESCRIPTION
The functional description includes: nominal
resistance range and tolerance, limiting voltage,
temperature coefficient, absolute maximum
dissipation, climatic category and stability.
The limiting voltage (DC or RMS) is the maximum
voltage that may be continuously applied to the
resistor element, see “IEC publications 60115-8”.
The laws of heat conduction, convection and
radiation determine the temperature rise in a
resistor owing to power dissipation. The maximum
body temperature usually occurs in the middle of the
resistor and is called the hot-spot temperature.
In the normal operating temperature range of chip
resistors the temperature rise at the hot-spot, .T, is
proportional to the power dissipated: ∆T = A × P.
The proportionally constant ‘A’ gives the
temperature rise per Watt of dissipated power and
can be interpreted as a thermal resistance in K/W.
This thermal resistance is dependent on the heat
conductivity of the materials used (including the
PCB), the way of mounting and the dimensions of the
resistor. The sum of the temperature rise and the
ambient temperature is:
T m = T amb + ∆T
where:
T m = hot-spot temperature
T amb = ambient temperature
∆T = temperature rise at hot-spot.
The stability of a chip resistor during endurance tests
is mainly determined by the hot-spot temperature
and the resistive materials used.
Resistors are ordered in two ways. Both ways give
logistic and packing information.
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Mar 25, 2008 V.7
3
Product specification
Chip Resistor Surface Mount
Thick film technology
SUMMARIZING
16
INTRODUCTION
is the reciprocal of the heat resistance and is the
characteristic for the resistor and its environment.
Description
Relationship
Dimensions, conductance of materials and
mounting determine
heat resistance
Heat resistance × dissipation gives
temperature rise
Temperature rise + ambient temperature give
hot-spot
temperature
THE TEMPERATURE COEFFICIENT
The temperature coefficient of resistance is a ratio
which indicates the rate of increase (decrease) of
resistance per degree (°C) increase (decrease) of
temperature within a specified range, and is
expressed in parts per million per °C (ppm/°C).
PERFORMANCE
EXAMPLE
When specifying the performance of a resistor, the
dissipation is given as a function of the hot-spot
temperature, with the ambient temperature as a
parameter.
If the temperature coefficient of a resistor of
R nom = 1 k X between –55 °C and +155 °C is ±200
ppm/°C, its resistance will be:
at 25 °C:
1,000 X (nominal = rated value)
From ∆T = A × P and T m = T amb  ∆T it follows
that:
P
at +155 °C:
1,000 X ±(130 × 200 ppm/°C) × 1,000 X
= 1,026 X or 974 X
Tm  Tamb
A
at –55 °C:
1,000 X ±(80 × 200 ppm/°C) × 1,000 X
= 1,016 X or 984 X
If P is plotted against Tm for a constant value of A,
parallel straight lines are obtained for different
values of the ambient temperature. The slope of
these lines,
If the temperature coefficient is specified as ≤200
ppm/°C the resistance will be within the shaded area
as shown in Fig. 1.
dP
I

dTm A
handbook, full pagewidth
26 Ω
2.6%
1.6%
R nom
1.6%
55
0
T ( oC)
25
155
16 Ω
2.6%
MGA208
Fig. 1 Temperature coefficient.
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Product specification
Chip Resistor Surface Mount
Thick film technology
NOISE
Most resistors generate noise due to the passage of
current through the resistor. This noise is dependent
on the amount of current, the resistive material and
the physical construction of the resistor. The
physical construction is partly influenced by the laser
trimming process, which cuts a groove in the
resistive material. Typical current noise levels are
shown in Fig. 2.
4
16
INTRODUCTION
Size 1206
noise
level
μV
V
SCR028
36
32
28
FREQUENCY BEHAVIOUR
Resistors in general are designed to function
according to ohmic laws. This is basically true of
rectangular chip resistors for frequencies up to 100
kHz. At higher frequencies, the capacitance of the
terminations and the inductance of the resistive path
length begin to have an effect.
Basically, chip resistors can be represented by an
ideal resistor switched in series with a coil and both
switched parallel to a capacitor. The values of the
capacitance and inductance are mainly determined by
the dimensions of the terminations and the
conductive path length. The trimming pattern has a
negligible influence on the inductance, as the path
length is not influenced. Also, its influence on the
capacitance is negligible as the total capacitance is
largely determined by the terminations.
The environment surrounding chips (e.g. landing
paths, nearby tracks and the material of the printedcircuit board) has a large influence on the behaviour
of the chip on the printed-circuit board.
24
20
16
12
8
4
0
1
10
100
1k
10 k
100 k
1M 10 M
R (Ω)
Fig. 2 Typical noise levels as a function of rated resistance
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Product specification
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Thick film technology
5
16
INTRODUCTION
Size 0402
SCR027
2.0
Z
R
1.6
Rn = 1 Ω
Rn = 10 Ω
1.2
R n = 100 Ω
0.8
Rn = 100 kΩ
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 1 kΩ
0.4
0
10 6
10 7
10 8
10 9
f (Hz)
1010
Fig. 4 Impedance as a function of frequency for a chip resistor
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Product specification
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Thick film technology
6
16
INTRODUCTION
Size 0603
MLB716
2.0
handbook, full pagewidth
Z
R
1.6
Rn = 1 Ω
Rn = 10 Ω
1.2
Rn = 100 Ω
0.8
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 100 kΩ
Rn = 1 kΩ
0.4
0
10 6
10 7
10 8
10 9
1010
f (Hz)
Fig. 5 Impedance as a function of frequency for a chip resistor
Size 0603
MLB717
100
handbook, full pagewidth
ϕ
(deg)
60
Rn = 1 Ω
Rn = 10 Ω
20
Rn = 100 Ω
20
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 100 kΩ
Rn = 1 kΩ
60
100
10 6
10 7
10 8
10 9
f (Hz)
1010
Fig. 6 Phase shift as a function of frequency for a chip resistor
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Product specification
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Thick film technology
7
16
INTRODUCTION
Size 0805
MLB718
2.0
handbook, full pagewidth
Z
R
1.6
Rn = 1 Ω
Rn = 100 Ω
Rn = 10 Ω
1.2
0.8
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 100 kΩ
Rn = 1 kΩ
0.4
0
10 6
10 7
10 8
10 9
1010
f (Hz)
Fig. 7 Impedance as a function of frequency for a chip resistor
Size 0805
MLB719
100
handbook, full pagewidth
ϕ
(deg)
60
Rn = 1 Ω
Rn = 10 Ω
20
Rn = 100 Ω
20
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 100 kΩ
Rn = 1 kΩ
60
100
10 6
10 7
10 8
10 9
f (Hz)
1010
Fig. 8 Phase shift as a function of frequency for a chip resistor
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Product specification
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Thick film technology
8
16
INTRODUCTION
Size 1206
MLB720
2.0
handbook, full pagewidth
Z
R
1.6
Rn = 1 Ω
Rn = 100 Ω
Rn = 10 Ω
1.2
0.8
Rn = 1 MΩ
Rn = 100 kΩ
Rn = 10 kΩ
Rn = 1 kΩ
0.4
0
10 6
10 7
10 8
10 9
1010
f (Hz)
Fig. 9 Impedance as a function of frequency for a chip resistor
Size 1206
MLB721
100
handbook, full pagewidth
ϕ
(deg)
60
Rn = 1 Ω
Rn = 10 Ω
20
Rn = 100 Ω
20
Rn = 1 MΩ
Rn = 10 kΩ
Rn = 100 kΩ
Rn = 1 kΩ
60
100
10 6
10 7
10 8
10 9
f (Hz)
1010
Fig. 10 Phase shift as a function of frequency for a chip resistor
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Product specification
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Thick film technology
9
16
INTRODUCTION
PULSE-LOAD BEHAVIOUR
The load, due to a single pulse at
which chip resistors fail by going
open circuit, is determined by
shape and time. A standard way
to establish pulse load limits is
shown in Table 1.
With this test, it can be
determined at which applied
voltage the resistive value
changes about 0.5% of its nominal
value under the above mentioned
pulse conditions. Fig. 11 shows
test results for the size 1206 chip
resistors. If applied regularly the
load is destructive, therefore the
load must not be applied
regularly during the load life of
the resistors. However, the
magnitude of a pulse at which
failure occurs is of little practical
value.
Table 1 Pulse load limits
PARAMETER
VALUE
Exponential time constant 50 to 700 µs
Repetition time
12 to 25 s
Amount of pulses
5 to 10
that may be applied in a regular
way can be determined in a
similar manner.
The maximum ‘single-pulse’ load
Size 1206
10
MBD641
4
Vmax
(V)
1.2/50 μs
10
3
10/700 μs
10
2
10
10
10 2
10 3
10 4
10 5
10 6
R n (Ω)
10 7
Fig. 11 Maximum permissible peak pulse voltage ( Vˆmax ) without failing to ‘open circuit’ in accordance with DIN IEC 60040 (CO) 533
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Product specification
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10
16
INTRODUCTION
Size 1206
MBC188
10 3
handbook, full pagewidth
Pmax
(W)
10 2
single pulse
10
t p / t i = 1000
1
repetitive pulse
10 1
10 6
10 5
10 4
10 3
10 2
10 1
1
t i (s)
Fig. 12 Pulse on a regular basis; maximum permissible peak pulse power ( Pˆmax ) as a function of pulse duration for R  10 kΩ, single pulse
and repetitive pulse tp/ti = 1,000
Size 1206
MBD586
600
Vmax
(V)
400
200
0
10 6
10 5
10 4
10 3
10 2
10 1
t i (s)
1
Fig. 13 Pulse on a regular basis; maximum permissible peak pulse voltage ( Vˆmax ) as a function of pulse duration (ti).
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Product specification
Chip Resistor Surface Mount
Thick film technology
DEFINITIONS OF PULSES
DETERMINATION OF PULSE-LOAD
S INGLE PULSE
The graphs in Figs 12 and 13 may be used to
determine the maximum pulse-load for a resistor.
The resistor is considered to be operating under
single pulse conditions if, during its life, it is loaded
with a limited number (approximately 1,500) of
pulses over long time intervals (greater than one
hour).
For

REPETITIVE PULSE
The resistor is operating under repetitive pulse
conditions if it is loaded by a continuous train of
pulses of similar power.
The dashed line in Fig. 12 shows the observed
maximum load for the Size 1206 chip resistors under
single-pulse loading.
More usually, the resistor must withstand a
continuous train of pulses of repetition time ‘t p ’
during which only a small resistance change is
acceptable. This resistance change (∆R/R) is equal to
the change permissible under continuous load
conditions. The continuous pulse train and small
permissible resistance change reduces the maximum
handling capability.

Vˆi must be lower than the value of Vˆmax given
in Fig. 13 for the applicable value of t i .

repetitive exponential pulses:
As for rectangular pulses, except that t i = 0.5  .
For

repetitive rectangular pulses:
Vˆi2
must be lower than the value of Pˆmax given
R
by the solid lines of Fig. 12 for the applicable
value of t i and duty cycle t p /t i .
For

11
16
INTRODUCTION
single rectangular pulses:
Vˆi2
must be lower than the Pˆmax given by the
R
dashed line of Fig. 12 for the applicable value of
ti.
Vˆi must be lower than the value of Vˆmax given
in Fig. 13 for the applicable value of t i .
The continuous pulse train maximum handling
capacity of chip resistors has been determined
experimentally.
Measurements have shown that the handling capacity
varies with the resistive value applied.
However, maximum peak pulse voltages as indicated
in Fig. 13, should not be exceeded.
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Product specification
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Thick film technology
12
16
INTRODUCTION
DEFINITION OF SYMBOLS (SEE FIGURES 11, 12, 13, 14 AND 15)
EXAMPLES
Symbol Description
Determine the stability of a typical resistor for
operation under the following pulse-load conditions.
Pˆ
Pˆ
applied peak pulse power
Vˆi
applied peak pulse voltage (Fig. 14)
Vˆmax
maximum permissible peak pulse voltage (Figs. 11, 13
and 15)
Rnom
nominal resistance value
ti
pulse duration (rectangular pulses)
tP
pulse repetition time

Tamb
time constant (exponential pulses)
max
maximum permissible peak pulse power (Fig.12)
ambient temperature
Tm (max.) maximum hot-spot temperature of the resistor
MGA206
V
tp
C ONTINUOUS PLUS TRAIN
A 100 X  resistor is required to operate under the
following conditions:
V i = 10 V; t i = 10 –5 s; t p = 10 –2 s
Therefore:
t p 10 2
10 2
Pˆ 
 1W and

 1,000
100
t i 10 5
tp
 1,000 , Fig. 12 gives
For t i = 10 –5 s and
ti
Pˆ
= 2 W and Fig. 13 gives Vˆ
= 400 V
max
max
As the operating conditions Pˆ = 1 W and Vˆi = 10 V
are lower than these limiting values, this resistor
may be safely used.
S INGLE PLUSE
ti
A 10 k X  resistor is required to operate under the
following conditions:
^
Vi
Vˆi = 250 V; t i = 10 –5 s
t
Therefore:
250 2
Pˆmax 
 6.25 W
10,000
Fig. 14 Rectangular pulses
V
YNSC059
^
The dashed curve of Fig. 12 shows that at t i = 10 –5 s,
the permissible Pˆmax = 10 W and Fig. 13 shows a
permissible Vˆmax of 400 V, so this resistor may be
used.
Vmax
^
0.37 Vmax
t
τ
tp
Fig. 15 Exponential pulses
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Product specification
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Thick film technology
13
16
INTRODUCTION
MECHANICAL DATA
MASS PER 100 UNITS
Table 2 Single resistor chips type
PRODUCT SIZE CODE
Table 3 Resistor arrays, network and RF attenuators
MASS (g)
PRODUCT SIZE CODE
TYPE
ATV321
0.100
0201
0.016
0404
0402
MASS (g)
0.058
2 x 0201 (4P2R)
YC102
0.052
0603
0.192
2 × 0402 (4P2R)
YC122
0.100
0805
0.450
2 x 0402 (4P2R)
TC122
0.112
1206
0.862
4 × 0402 (8P4R)
YC124
0.281
1210
1.471
4 x 0402 (8P4R)
TC124
0.311
1218
2.703
2 x 0603 (4P2R)
YC162
0.376
2010
2.273
4 × 0603 (8P4R)
YC/TC164
1.031
2512
3.704
1220 (8P4R)
YC324
2.703
0616 (16P8R)
YC248
0.885
0612 (10P8R)
YC158
0.855
1225 (10P8R)
YC358
3.333
FAILURE IN TIME (FIT)
CALCULATION METHOD:
According to Yageo calculation, assuming components life time is following exponential distribution and using
60% confidence interval (60% C.I.) in Homogeneous Poisson Process; therefore the FIT is calculated by number
of tested Failure in Endurance Test (rated power at 70°C for 1,000 hours, “IEC 60115-1 4.25.1”) as following:
FIT ( ) 
60% C.I. number of estimated failure
10 9
Accumulated test time
Table 4 FIT of single resistor chips
TYPE
Table 5 FIT of resistor arrays and network
FIT in
1999-2007
ACCUMULATION
TEST in 1999-2007 (hours)
FIT in
1999-2007
ACCUMULATION
TEST in 1999-2007 (hours)
RC0201
146
6,280,000
YC122
RC0402
65
590
1,560,000
14,150,000
TC164
548
1,560,000
RC0603
63
14,650,000
YC124
390
1,560,000
RC0805
63
14,720,000
YC158
390
1,560,000
TYPE
RC1206
69
13,380,000
YC164
339
1,710,000
RC1210
78
11,750,000
YC248
390
1,560,000
RC2010
65
14,190,000
YC324
390
1,560,000
RC2512
81
11,310,000
YC358
390
1,560,000
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Mar 25, 2008 V.7
Product specification
Chip Resistor Surface Mount
Thick film technology
14
16
INTRODUCTION
TESTS AND PROCEDURES
To guarantee zero defect production standard, Statistical Process Control is an essential part of our production
processes. Furthermore, our production process is operating in accordance with “ISO 9000”.
Essentially all tests on resistors are carried out in accordance with the schedule of “IEC publication 60115-1” in
the specified climatic category and in accordance with “IEC publication 60068”, “MIL-STD”, “JIS C 5202”, and “EIA/IS”,
etc. In some instances deviations from the IEC recommendations are made.
Tests and their requirements are described in detail in the data sheets.
Size 1206
Size 1206
MGA210
300
TC halfpage
handbook,
6
(10
spec. level
/K) 200
R
(%)
0.4
0
0
100
0.4
spec. level
200
1
10
100
1k
10 k
0.8
100 k
1.2
10 M
1M
R (Ω)
Fig. 16 Typical temperature coefficients between the lower
and upper category temperatures
Size 1206
spec. level
1
10
100
1k
10 k
100 k
10 M
1M
R (Ω)
Fig. 17 Typical percentage change in resistance after soldering
for 10 seconds at 270 °C, completely immersed
Size 1206
MGA213
12
MGA216
handbook,
Δ Rhalfpage
handbook, halfpage
noise
level
μV
V
spec. level
0.8
100
300
MGA214
1.2
handbook,
Δ R halfpage
R
(%)
2
spec. level
1
8
spec. level
0
4
1
spec. level
2
0
100
1k
10 k
100 k
1M
R (Ω)
Fig. 18 Typical noise level as a function of rated resistance
measured using Quantech - equipment
1
10
100
1k
10 k
100 k
1M
10 M
R (Ω)
Fig. 19 Typical percentage change in resistance after 56 days
at 40 °C and 90 to 95% relative humidity loaded with
Pnom
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Product specification
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Thick film technology
INTRODUCTION
15
16
Size 1206
MGA218
1.2
handbook,
Δ R halfpage
R
(%)
spec. level
0.8
0.4
0
0.4
0.8
1.2
spec. level
1
10
100
1k
10 k
100 k
10 M
1M
R (Ω)
Fig. 20 Typical percentage change in resistance after 1,000
hours loaded with Pnom at 70 °C ambient temperature
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Product specification
Chip Resistor Surface Mount
Thick film technology
INTRODUCTION
16
16
REVISION HISTORY
REVISION DATE
Version 7
CHANGE NOTIFICATION
Mar 25, 2008 -
DESCRIPTION
- Headline changes to Introduction Thick Film Chip Resistor
- Add international standard and failures in time
Version 6
Dec 15, 2004 -
- Converted to Yageo / Phycomp brand
- Separated “Marking” into an individual data sheet
- Mechanical data extended from sizes 0201 to 2512, resistor arrays/network
and attenuators as well
- Impedance chart for size 0402 added
-
- Size extended to 0201
Version 5
Jul 23, 2004
Version 4
Aug 19, 2004 -
- Updated company logo
Version 3
May 30, 2001 -
- Converted to Phycomp brand
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Mar 25, 2008 V.7