High-voltage MLCCs for power applications T1 D5 D2 R6 C3 R5 TR2 R1 18 pF (3 kV) C1 2600 Vrms TR1 C2 R4 R3 R2 www.yageo.com 14 13 12 11 10 9 CN2 D1 High-voltage MLCCs for power applications Switched-mode power supplies, DC-to-DC converters and DC-to-AC inverters are nowadays widely used in all kinds of consumer equipment. Moreover, demand for such compact, highly-efficient power-conversion systems is expected to grow even further with the continual migration toward ever smaller equipment with ever lower weight, cost and power usage, plus lower EMI levels to satisfy modern EMC requirements. This in turn will place increasing demands on components, especially capacitors which must combine a high degree of miniaturization with the ability to reliably handle the relatively-high voltages often occurring in power supplies. Here,Yageo's range of highvoltage Multilayer Ceramic Capacitors (MLCCs) offer the ideal solution. Yageo's high-voltage chip capacitors offer the answer SUMMARY Yageo's Phycomp branded high-voltage MLCCrange has been developed specifically for power systems such as SMPS, DC-DC converters and DC-AC inverters. Manufactured using the most modern mass-production techniques, the range is available in rated voltages of 200 V, 500 V, 1 kV, 2 kV, 3 kV and 4 kV, making the new products ideally suited to a wide range of power applications. High reliability, large capacitance, small size and excellent high-frequency characteristics are essential requirements for capacitors operating in high-voltage systems. Yageo's high-voltage MLCC range has been developed specifically to meet these requirements. Manufactured using the most modern mass-production techniques, the range is available in rated voltages of 200 V, 500 V, 1 kV, 2 kV, 3 kV and 4 kV and offers the important benefit of low cost.This makes the range ideally suited to a wide range of applications in, for example, by-pass, coupling, and resonant functions such as snubbers in high-frequency power converters, resonators in SMPS, and high-voltage coupling/DC blocking in inverters.The new range, moreover, exhibits low ESR at high frequencies. Offering an attractive alternative to film capacitors Used in power circuits,Yageo's Phycomp branded highvoltage MLCC range offers an attractive alternative to leaded film capacitors. Compared with film capacitors, high-voltage MLCCs offer not only greater resistance to mechanical stress and resistance to static electricity and surge current, they also offer excellent high-frequency performance, lower ESR and stability against temperature variations. Benefits of Yageo's new high-voltage MLCCs • Available in a wide range of capacitances • Small size • High reliability • Excellent high-frequency characteristics • Low ESR at high-frequencies Specifications and mechanical details Table 1 NP0 dielectric Rated voltage Ur (DC) 200 V 500 V 1000 V 2000 V 3000 V 4000 V Capacitance tolerance Termination 2 0805 1206 1210 1808 1812 10 pF~560 pF - 10 pF~1.5 nF 10 pF ~1 nF 120 pF~390 pF 22 pF~100 pF - 1.8 nF ~ 3.3 nF 47 pF~1.8 nF - 3.3 pF~120 pF 10 pF~22 pF 3.9 nF~5.6 nF 2.2 nF~3.3 nF 100 pF~1.5 nF 10 pF~220 pF 10 pF~47 pF ±5% Ni/Sn 3 Table 2 X7R dielectric Rated voltage Ur (DC) 200 V 500 V 1000 V 2000 V Capacitance tolerance Termination contribution. The relevant parameter here is the thermal transfer coefficient or heat resistance Rth. In a steady-state situation: 0805 1206 1210 1808 1812 220 pF~6,8 nF - 680 pF~33 nF 470 pF~3.3 nF 470 pF~3.3 nF - 22 nF~47 nF 3.3 nF~6.8 nF - 470 pF~3.3 nF 470 pF~2.2 nF 47 nF ~100 nF 10 nF ~15 nF 1 nF~10 nF 1 nF~4.7 nF ±10%, ±20% Ni/Sn 2 P = I RMS ESR = ∆T The maximum allowed temperature rise depends on the application. It is often set to 10 °C or it may also be calculated from the expression: maximum rated temperature – application temperature, i.e. 125 ºC – Tappl. in which IRMS is the RMS value of the current, ESR is the equivalent series resistance of the capacitor at a given frequency and ∆T is the maximum allowed temperature rise upon AC load. The ESR value depends on the capacitor type and on the frequency f. Typical values may be found in the various detailed specifications of the capacitors. Conversion from current to voltage can be done using the approximation VRMS = 2π.f.IRMS. Rth Values of Rth are given in the table below: size 0805 Rth (K/W) 172 W T L4 L2 1206 153 1210 137 1808 130 At thermal non-equilibrium, i.e. for short-term electrical loading, the above-mentioned criteria may be relaxed and a capacitor may be loaded to higher values. In this case the DC and AC breakdown values of the capacitor may be the limiting factors. These latter values are published in the Application Note "DC, AC and pulse load of multilayer ceramic capacitors" available from our web site. 1812 118 L3 Typical application MSD40 L1 Modem/LAN card or hub Size 0805 1206 1210 1808 1812 2220 L1 2.0 3.2 3.2 4.5 4.5 5.7 ± ± ± ± ± ± 0.10 0.15 0.15 0.20 0.20 0.20 W 1.25 ± 1.6 ± 2.5 ± 2.0 ± 3.2 ± 5.0 ± 0.10 0.15 0.15 0.20 0.20 0.20 T max 1.3 1.3 1.8 1.3 1.3 1.3 L2/L3 min. max 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 L4 min 0.55 1.40 1.40 2.20 2.20 2.90 VCC R7 U1A RIN TXA1 Yageo’s high-voltage MLCCs for power circuits Fig.1 High-voltage MLCCs in operation Be sure to use a capacitor only within its rated operating voltage range.When DC-rated capacitors are to be used in AC or ripple-voltage circuits, it is also important to maintain the maximum amplitude value of the applied voltage within the rated voltage range. For relatively low frequencies, that is below about 10 kHz, the use of the capacitor is limited by its dielectric strength. In this case the sum of the DC voltage and the AC voltage must not exceed the DC rated voltage specification of the capacitor. For example, a 500 V rated NP0 capacitor that is used at 100 V DC may have 4 R8 R9 TXA2 Mechanical dimensions (in mm) of Yageo's Phycomp branded high-voltage MLCCs C10 IC1 C9 V C12 C8 R10 C7 CLK BSY AGND C13 DATA C11 R12 R11 C5 1nF (1 kV) C6 R5 ~OH an additional AC load at frequencies below about 10 kHz with a maximum amplitude of 400 V, giving an RMS voltage of 283 V. R6 RING TIP ~OH RI_IN1 VREF V Able to suppress high-frequency power surges and perform coupling/DC-blocking functions in high-voltage circuits, Yageo’s high-voltage MLCCs protect ICs and transistors against transient voltages (even in telecommunications equipment) and against electrostatic discharge. V C14 C15 C16 VCC DAA/CELL R4 R3 R1 R2 DB15 C18 DGND At higher frequencies, i.e. above about 10 kHz, the use of the capacitor is limited by the power dissipation and the heat flow to the surroundings. A multilayer ceramic capacitor at continuous AC load will dissipate power and hence will rise in temperature. The temperature rise can be calculated for a steady-state situation in which the dissipated power equals the heat loss to the surroundings. The heat loss to the surrounding is built up of two parts. One part is the heat loss via the outer surface of the MLCC by convection and radiation.The second part is the heat loss via the solder bonds to the PC board and thence to the air. The latter is the dominant MSD407 R16 R13 U1B R14 V R15 C17 DAA/CELL Fig.2 Application of high-voltage MLCCs in a modem/LAN card or hub 5 300 Modem/LAN card or hub 235 °C to 260 °C 250 200 CN1 R10 R11 TR4 R7 TR2 18 pF (3 kV) C1 2600 Vrms TR1 C4 R12 TR5 R13 R8 C3 R5 D2 R9 D4 R6 D5 D3 C5 R14 ª200 K/s 150 C6 100 °C to 130 °C CN2 R4 C8 50 Typical values (solid line) Process limits (dotted line) forced cooling 100 2 K/s 0 D1 0 Fig.6 C2 R15 R16 ≈5 K/s first wave ≈2 K/s TR3 L1 second wave R1 T1 F1 MSD410 10 s T (°C) 50 100 150 200 Solder footprint R3 R2 occupied area D G 16 R17 15 14 13 12 11 10 9 6 7 8 IC1 R18 TR6 1 2 3 4 5 solder-land/ solder-paste pattern R 22 C9 R 21 Size code 0805 1206 1210 1808 1812 Application in inverter circuit 3 kV/NP0/15 pF Electronic ballast Footprint dimensions A 2.8 4.0 4.0 5.4 5.4 B 0.9 2.0 2.0 3.3 3.3 C 0.95 1.0 1.0 1.05 1.05 D 1.4 1.8 2.7 2.3 3.5 E 0.45 1.4 1.4 2.7 2.7 F 3.2 4.4 4.4 5.8 5.8 G 2.1 2.5 3.4 2.9 4.1 substrate only Wave soldering buffer capacitor half bridge capacitors 100 to 470 nF 100/200 V X7R Size code MSD422 10 s 300 Fig.4 X7R MLCCs in an electronic ballast circuit for fluorescent lighting T (˚C) 215 ˚C 200 Component soldering Surface-mount components are tested for solderability at a temperature of 235 °C for 2 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Figs 5 and 6. 10 s 150 2 K/s Typical values (solid line) Process limits (dotted line) 50 0 Fig.5 Placement accuracy ±0.15 ±0.25 Soldering footprint (dimensions in mm) Handling precautions 100 100 1x (0.3 x 1.3) 3x 1206 4.8 2.3 1.25 1.7 1.25 5.9 3.2 (0.25 x 1.7) 3x 1210 5.3 2.3 1.5 2.6 1.25 6.3 4.2 (0.25 x 2.6) Fig.7 130 ˚C 50 Dummy* tracks 40 s 180 ˚C 0 6 MSD409 260 ˚C ≈245 ˚C 250 Footprint dimensions A B C D E F G 0805 3.2 1.4 0.9 1.3 0.36 4.1 2.5 lamp capacitor 100 pF to 15 nF 200/500 V NPO 150 200 Recommended infrared soldering profile t (s) 250 vacuum nozzle MSD408 ProcesPlacesing ment remarks accuracy IR or hot-plate soldering ±0.25 ceramic micro inductor fusistor another component tracks or dummy tracks (wave soldering only) Reflow soldering MSD406 Substrate handling precautions –Ensure that the PC board is not flexed excessively after the product and other components have been soldered. If necessary,use a support pin to prevent excessive flexing of the PC board –Mount the products as far as possible from the break line of the PC board and from any line of large holes on the board –Do not break the PC board by hand.We recommend the use of a machine or jig to break the board solder-resist pattern E B A F C R19 Fig.3 250 Recommended double-wave soldering profile R20 C7 t (s) Solder gun precautions Note the following precautions when using a solder gun for replacement: –The tip temperature must not exceed 280 °C for 3s. To ensure this, use a solder gun with a power of less than 30 W –The solder gun tip must not come into direct contact with the product Soldering precautions –Note that this product will be easily damaged by rapid heating, rapid cooling or local heating –Do not subject the product to thermal shock by the use of soldering temperatures greater than 100 °C. We recommend the use of preheating and annealing (gradual cooling) stages during the soldering cycle PC board H.V. MLCC support pins Fig.8 MSD411A Precautions when handling substrate Storage conditions Note the following precautions when storing the product: –Avoid high-temperature, high-humidity and dusty environments and atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these can degrade terminal solderability –Keep the storage temperature less than 40 ºC, relative humidity less than 70% and, if possible, do not keep in storage longer than 6 months –Avoid direct heat and sunshine to prevent the packaging tape from melting and sticking to the product. Application precaution The high voltages across the terminations in applications of 1 kV and more may necessitate the addition of a surface coating to prevent external arcing.This is particularly likely in humid conditions. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands Document order number: 9398 084 33011 Date of release: October 2002 www.yageo.com