ROHM BD6941FM

1/3
STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Driver for Fan Motor
TYPE
BD6961F
FEATURES
PWM speed control
Soft switching function
〇ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Symbol
Limit
Unit
Vcc
15
V
Pd
780*
mW
Operating temperature
Topr
-40~+105
℃
Storage temperature
Tstg
-55~+150
℃
Output voltage
Vomax
15
V
Output current
Iomax
1000**
mA
VFG
15
V
Power dissipation
FG signal output voltage
IFG
FG signal output current
Tjmax
Junction temperature
*
Reduce by 6.24mW/℃ over Ta=25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to exceed Pd.
10
mA
150
℃
Unit
V
V
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
3.5~14
Hall input voltage range
VH
0~Vcc/3
*This product is not designed for production against radioactive rays.
REV. B
2/3
〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=12V)
Symbol
Parameter
Min.
Limit
Typ.
Max.
Unit
Conditions
Circuit current 1
Icc1
1
3
5
mA
PWM=GND
Circuit current 2
Icc2
2
5
8
mA
PWM=OPEN
VHOFS
-
-
±6
mV
VHYS
±5
±10
±15
mV
VPWMH
2.5
-
Vcc+0.3V
V
PWM input L level
VPWML
-0.3
-
0.8
PWM input current
IPWMH
11
22
33
V
μA
PWM=5.0V
IPWML
-42
-28
-14
μA
PWM=GND
Input frequency
FPWM
0.02
-
50
kHz
Output voltage
VO
-
0.4
0.6
V
Input-output Gain
GIO
45
48
51
dB
VFGL
-
-
0.4
FG leak current
Lock detection ON time
IFGL
-
-
20
V
μA
TON
0.35
0.50
0.65
s
Lock detection OFF time
TOFF
3.5
5.0
6.5
s
Input offset voltage
FG hysteresis voltage
PWM input H level
FG low voltage
Io=300mA
Upper and Lower total
IFG=5mA
VFG=15V
〇PACKAGE OUTLINES
D6961
Lot No.
SOP8 (Unit:mm)
〇BLOCK DIAGRAM
〇TERMINAL NAME
OUT2
1
2
8
150kΩ
500Ω
Vcc
1
2
3
4
5
6
7
8
+
OUT1
OSC
7
Lock
Protection
2.8V
Control
90kΩ
H+
3
PIN No.
GND
TSD
10kΩ
PWM
6
+
500Ω
H-
4
FG
150kΩ
+
-
5
REV. B
Terminal
name
OUT2
Vcc
H+
HFG
PWM
OUT1
GND
3/3
〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit
protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the
motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage
including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and
property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a
hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes
an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect
the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an
environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it
is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the
capacitor between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do
not use in a manner where parasitic element is actuated.
REV. B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A