DB101 thru DB107 Pb Free Plating Product ® Pb DB101 thru DB107 1.0 AMP.DIP GLASS PASSIVATED BRIDGE RECTIFIERS DB-1 Features Unit : inch (mm) • Glass passivated chip junction .335(8.51) .316(8.05) • Ideal for printed circuit board .089(2.5) .086(2.2) Mechanical Data .350(8.9) .300(7.6) .315(8.00) .285(7.24) • High surge overload rating of 50 A peak .255(6.5) .245(6.2) • Low forward voltage drop • Case: Molded plastic, DB .045(1.14) .035(0.89) • Epoxy: UL 94V-0 rate flame retardant .022(0.56) .018(0.46) .185(4.69) .150(3.81) • Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed • Mounting position: Any .075(1.90) .055(1.39) .205(5.2) .195(5.0) Absolute Maximum Ratings and Characteristics Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Symbols DB101 DB102 DB103 DB104 DB105 DB106 DB107 Units Parameter Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at TA = 40 OC I(AV) 1 A Peak Forward Surge Current 8.3 ms Single Half-sine-wave Superimposed on Rated Load (JEDEC Method) IFSM 50 A VF 1.1 V IR 5 500 µA pF Maximum Forward Voltage at 1 A Maximum Reverse Current at Rated DC Blocking Voltage at TA = 25 C at TA = 125 OC Typical Junction Capacitance 1) CJ 25 Typical Thermal Resistance 2) RθJA 40 O C/W Typical Thermal Resistance 2) RθJL 15 O C/W TJ ,TS -55 to +150 Operating and Storage Temperature Range 1) 2) O O C Measured at 1 MHz and applied reverse voltage of 4 V Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B with 0.5 X 0.5" (13 X 13 mm) copper pads. Page 1/2 © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/ DB101 thru DB107 ® Page 2/2 © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/