24 V and 300 V DC-DC Converter Modules Module Construction & Component Derating This document provides a detailed view of the construction for Maxi, Mini and Micro DC-DC converters as well as the component design derating guidelines. Module Size/Power Chart Maxi Mini Micro Output Voltage 24 Vin max. Output Power 300 Vin max. Output Power 24 Vin max. Output Power 300 Vin max. Output Power 24 Vin max. Output Power 300 Vin max. Output Power 2V N/A 160 W N/A 100 W N/A 50 W 3.3 V 264 W 264 W 150 W 150 W 75 W 75 W 5V 400 W 400 W 200 W 200 W 100 W 100 W 12 V 400 W 500 W 200 W 250 W 100 W 150 W 15 V 400 W 500 W 200 W 250 W 100 W 150 W 24 V 400 W 500 W 200 W 250 W 100 W 150 W 28 V 400 W 500 W 200 W 250 W 100 W 150 W 36 V 400 W 500 W 200 W 250 W 100 W 150 W 48 V 400 W 500 W 200 W 250 W 100 W 150 W Consult factory for other input / output / power modules. Part Numbering V 24 A 12 M 400 Input Voltage Package A = Maxi B = Mini C = Micro Output Voltage Product Grade E = –10 to +100°C C = –20 to +100°C T = – 40 to +100°C H = –40 to +100°C M = –55 to +100°C Output Power Maxi converter example: Mini converter example: B L Pin Style Blank = Short solder L = Long solder *S = Short ModuMate *N = Long ModuMate Baseplate Blank = Slotted 2 = Threaded 3 = Thru hole Micro converter example: V24A12M400BL V300B28H250BL2 V24C5M100BL3 24 Vin, Maxi, 12 VOUT @ 400 W, long solder pins, slotted baseplate 300 Vin, Mini, 28 VOUT @ 250 W, long solder pins, threaded baseplate 24 Vin, Micro, 5 VOUT @ 100 W, long solder pins, thru-hole baseplate *Compatible with the InMate and SurfMate socketing systems. Qualification Testing Acceleration To determine the ability of parts to withstand constant acceleration, as an indicator of the mechanical strength limits. Standard: MIL-STD-810F, Method 513.5, Procedure II • Environment: Acceleration step from 2 – 7 g, 6 direction Altitude To observe low air pressure effects on either operational or non-operational design parameters. Standard: MIL-STD-810F, Method 500.4, Procedure I & II • Environment: 40,000 ft. and 70,000 ft. operational Explosive Atmosphere To determine the ability of equipment to operate in the presence of an explosive atmosphere. Standard: MIL-STD-810F, Method 511.4, Procedure I, operational • Environment: Fuel-air explosive atmospheres HALT Demonstrates product design margin and robustness. Standard: Vicor internal reference EIAJESD22-A110-B • Environment: Operational limits verified / destruct limits determined High Temperature Operational Life An operational test used to detect thermally activated failure mechanisms. Standard: Vicor internal reference EIAJESD22-A110-B Environment: Nominal line, 75% Load, temperature within 5°C max operational Humidity A humidity test simulates the moisture-laden air found in tropical regions. Standard: MIL-STD-810F, Method 507.4 • Environment: 240 hours, 95% RH Mechanical Shock To determine the ability to withstand mechanical shocks from suddenly applied forces or an abrupt change in motion produced by handling, transportation or field operation. Standard: MIL-STD-810F, Method 516.5, Procedure I • Environment: Functional shock, 40 g Standard: MIL-S-901D, lightweight hammer shock • Environment: 3 impacts/axis, 1, 3, 5 ft. Standard: MIL-STD-202F, Method 213B • Environment: 60 g, 9 ms half sine; 75 g, 11 ms saw tooth shock. Random Mechanical Vibration To evaluate the construction, materials and mounting of the device for ruggedness. Standard: MIL-STD-810F, Method 514.5, Procedure I, Category 14 • Environment: Sine and random vibration for helicopter AH-6J main rotor with overall level of 5.6 g for 4 hours per axis Standard: MIL-STD-810F, Method 514.5C, general minimum integrity • Environment: 7.7 g for 1 hour per axis. Resistance to Solvents To verify that component markings will not become illegible and that electrical and mechanical integrity will not be disturbed when exposed to solvents. Standard: MIL-STD-202G, Method 215K • Environment: Ambient temperature, ambient humidity Temperature Humidity Bias An operational test that evaluates the reliability of the device package in humid environments. Standard: JESD22-A101-B • Environment: 85°C, 85% RH, high line input voltage Thermal Shock To determine the resistance of the part to sudden changes in temperature. Standard: MIL-STD-202G, Method 107G, Condition B1 and MIL-HDBK-344A • Environment: -65°C to 125°C, 1,000 cycles Temperature Cycle Conducted to determine the ability of devices to withstand mechanical stresses induced by alternating high and low temperature extremes. Standard: JESD22-A104-B • Environment: -40°C to 125°C, 1,000 cycles Characterization Process Electro Static Discharge Classifies the device according to its susceptibility to damage or degradation by exposure to electrostatic discharge. Standard: MIL-STD-883C, Method 3015 • Environment: Ambient temperature, ambient humidity Fungus To determine if a material(s) will support the growth of specific fungi. Standard: MIL-STD-810F, Method 508.5 • Environment: Severe climate conditions Salt Fog To determine the resistance of the equipment to the effects of a salt atmosphere, primarily corrosion. Standard: MIL-STD-810F, Method 509.4 • Environment: Salt fog harsh environment Solderability To evaluate the solderability of terminations that are normally joined by a soldering operation. Standard: MIL-STD-202G, Method 208H • Environment: Continuous solder coating for a minimum of 95% surface area Terminal Strength Determines the resistance to external force on the terminals. Standard: MIL-STD-202G, Method 211A, Test Condition A • Environment: Ambient temperature, ambient humidity AMCOM Testing Developed in partnership with the U.S. Army Aviation and Missile Command to demonstrate the ability to withstand sequential harsh environments, which simulate storage, field use and a 10 year service life in a ground mobile environment. Standard: US Army Aviation and Missile Command • Environment: High temp / high humidity, temp cycle, power cycle MAXI 4 2 5 6 8 9 10 7 12 11 1 2.2" 55,9 mm 4.6" 116,8 mm 3 0.5" 12,7 mm 1 MINI MICRO 2 4 2 4 6 5 8 5 6 9 10 9 8 7 7 12 10 11 12 11 1 1 1.45" 36,8 mm 2.28" 57,9 mm 2.28" 57,9 mm 3 3 1 1 Component The photos to the left illustrate typical Maxi, Mini and Micro DC-DC converters and the captions below provide information as to materials and operating parameters. Temperatures and voltages shown are for nominal input voltages under full load conditions at 100°C baseplate; maximum device ratings are shown in parenthesis. 1 Baseplate Provides mounting, mechanical rigidity and heat spreading. 2 Mosfet MLP Main switch and common drain for low conducted and radiated noise 3 Insert Molded Terminal Block and Shield Functions as an EMI shield to reduce conducted and radiated noise, supplies electrical isolation for the pins and provides mechanical protection for the module. 24 V Inpu 24 VOUT Maxi V24A24M400BL 5 VOUT Mini V24B5H200BL Aluminum 6063T-5 Aluminum 6063T-5 Quantity: 6 121°C (150°C) 37 V (60 V) θj = 10°C/W Quantity: 3 126°C (150°C) 35 V (60 V) θj = 10°C/W DuPont Zenite/ Clad Aluminum DuPont Zenite/ Clad Aluminum Quantity: 4 (forward) + 8 (shunt) Forward: 117°C (150°C) 87 V (200 V) Shunt: 105°C (150°C) 87 V (200 V) θj = 10°C/W Quantity: 4 (forward) + 4 (shunt) Forward: 121°C (150°C) 21 V (45 V) Shunt:115°C (150°C) 21 V (45 V) θj = 10°C/W 4 Rectifier MLP A dual diode rectifier 5 Main Transformer Provides voltage transformation and primary to secondary isolation. 110°C (180°C) core 116°C (180°C) core 6 Input Capacitor Reduces reflected ripple and conducted noise in conjunction with the input inductor. Quantity: 42 24 V (50 V) Quantity: 14 24 V (50 V) 7 Input Inductor Reduces reflected ripple and conducted noise in conjunction with the input capacitors. Quantity: 4 101°C (180°C) core Quantity: 1 104°C (180°C) core 8 Output Inductor Reduces output ripple in conjunction with the output capacitors. Quantity: 4 102°C (180°C) core Quantity: 2 117°C (180°C) core 9 Output Capacitor Reduces output ripple in conjunction with the output inductor. Quantity: 43 24 V (50 V) Quantity: 4 5 V (10 V) 10 Resonant Capacitor Quasi-resonant tank for zero-current- switching converter Quantity: 20 87 V (250 V) Quantity: 10 21 V (50 V) 11 Brain (primary) Contains primary control device (ASIC). 102°C (135°C) 108°C (135°C) Contains secondary control device (ASIC). 102°C (135°C) 108°C (135°C) 12 Brain (secondary) Encapsulant Two component silicone elastomer MTBF MIL-HDBK-217F: G.B. @ 25°C Baseplate MTBF in 1000 hours PRISM PRISM ties together several tools into a comprehensive system reliability prediction methodology that accounts for the myriad of factors that can influence reliability. Thermal conductivity: 3.2 W/m-k Temperature rating guide: 200°C 2210 4205 0.091808 0.056142 t 300 V Input 15 VOUT Micro V24C15M100BL 24 VOUT Maxi V300A24H500BL 5 VOUT Mini V300B5M200BL 15 VOUT Micro V300C15H150BL Aluminum 6063T-5 Aluminum 6063T-5 Aluminum 6063T-5 Aluminum 6063T-5 Quantity: 2 111°C (150°C) 33 V (60 V) θj = 10°C/W Quantity: 6 119°C (150°C) 484 V (550 V) θj = 10°C/W Quantity: 3 120°C (150°C) 404 V (650 V) θj = 10°C/W Quantity: 2 129°C (150°C) 406 V (650 V) θj = 10°C/W DuPont Zenite/ Clad Aluminum DuPont Zenite/ Clad Aluminum DuPont Zenite/ Clad Aluminum DuPont Zenite/ Clad Aluminum Quantity: 2 (forward) + 2 (shunt) Forward: 104°C (150°C) 57 V (100 V) Shunt: 104°C (150°C) 57 V (100 V) θj = 10°C/W Quantity: 8 (forward) + 8 (shunt) Forward: 106°C (150°C) 135 V (200 V) Shunt: 110°C (150°C) 135 V (200 V) θj = 10°C/W Quantity: 4 (forward) + 4 (shunt) Forward: 116°C (150°C) 24 V (30 V) Shunt: 115°C (150°C) 24 V (30 V) θj = 10°C/W Quantity: 2 (forward) + 2 (shunt) Forward: 112°C (150°C) 71 V (100 V) Shunt: 112°C (150°C) 71 V (100 V) θj = 10°C/W 107°C (180°C) core 119°C (180°C) core 119°C (180°C) core 127°C (180°C) core Quantity: 8 24 V (50 V) Quantity: 18 300 V (600 V) Quantity: 6 300 V (600 V) Quantity: 3 300 V (600 V) Quantity: 1 101°C (180°C) core Quantity: 4 103°C (180°C) core Quantity: 2 107°C (180°C) core Quantity: 1 113°C (180°C) core Quantity: 1 103°C (180°C) core Quantity: 4 110°C (180°C) core Quantity: 2 125°C (180°C) core Quantity: 1 112°C (180°C) core Quantity: 2 15 V (25 V) Quantity: 43 24 V (50 V) Quantity: 4 5 V (10 V) Quantity: 2 15 V (25 V) Quantity: 7 57 V (100 V) Quantity: 20 135 V (250 V) Quantity: 15 24 V (50 V) Quantity: 12 71 V (100 V) 102°C (135°C) 109°C (135°C) 118°C (135°C) 114°C (135°C) 102°C (135°C) 109°C (135°C) 118°C (135°C) 114°C (135°C) Thermal conductivity: 3.2 W/m-k Temperature rating guide: 200°C 4646 2690 5324 6104 0.043105 0.094210 0.047520 0.067441 Maximum device ratings in parenthesis. 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