16. Through-hole Socket Mount System (InMate) Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies InMates are an innovative solution for through-hole socket requirements. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full, half or quarter-brick sized module. The sockets are factory loaded into the carrier, which holds them rigidly in place throughout the assembly and soldering process. The carriers are later removed, leaving the sockets accurately positioned. Designed for use with pin-compatible Maxi, Mini, and Micro Family converters, InMates are available for a wide range of PCB sizes and mounting styles. PCB thicknesses can range from 0.055"(1,39 mm) to 0.1375"(3,49 mm). Sockets also allow for mounting modules either inboard, with a cutout in the PCB for the module, to minimize the height above the board, or onboard. InMates are compatible with the ModuMate or RoHS pin style. InMates are available in standard recyclable JEDEC style trays for use with automated pick-and-place equipment and are compatible with most standard wave or hand solder operations. The sockets are soldered into the board as part of the PCB assembly process. The module can then be plugged into place at anytime later. NOTE: Please refer to Section 13 of the design guide for the InMate soldering procedure. Insert Solder Remove Carrier Insert Module Figure 16–1 — InMate carrier / socket assembly and soldering process Maxi, Mini, Micro Design Guide Page 76 of 88 Rev 4.9 Apps. Eng. 800 927.9474 vicorpower.com 800 735.6200 16. Through-hole Socket Mount System (InMate) Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies InMate: Through-hole Sockets 1. 2. 3. Board Thickness Full Brick (Maxi) 4. Half Brick (Mini) 5. Quarter Brick (Micro) Norm. (Min. / Max.) Mounting Style Input Output 5 Sets Input Output 5 Sets Input Output 5 Sets Pin Style 0.062" Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F (1,4 mm /1,8 mm) Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 N or G 0.093" (0.084"/ 0.104") 2,4 mm Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 N or G Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 N or G (0.055"/ 0.071") 1,5 mm (2,1 mm /2,6 mm) 0.125" (0.1125"/0.1375") 3,1 mm (2,8 mm /3,5 mm) Table 16–1 — Guide to InMate selection 1. Select Board Thickness. Nominal 0.062"(1,5 mm), 0.093"(2,4 mm) or 0.125"(3,1 mm). 2. Select Mounting Style. Inboard requires a PCB cutout for the “belly” of the module. See dotted lines in PCB drawing links on Page 80 for cut out area. 3. Identify Module Type. Full brick (Maxi), half brick (Mini) or quarter brick (Micro). Maxi, Mini, Micro Design Guide Page 77 of 88 4. Select the Ordering Part Number. Order packages of five input / output sets or in higher quantities order input and output InMates separately. For individual input or output InMates, minimum orders of 35 for Maxi or Mini and 40 for Micro apply. 5. Verify Correct Pin Style for the Module. For predefined parts, “S” or “F”= short ModuMate and “N” or “G”= long ModuMate See Table 16–4 for standoff recommendations. Rev 4.9 Apps. Eng. 800 927.9474 vicorpower.com 800 735.6200 16. Through-hole Socket Mount System (InMate) Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies Parameter Specification Value Reference F = short Au plated S = short Au plated Short RoHS pins Short ModuMate pins G = long Au plated N = long Au plated Long RoHS pins Long ModuMate pins Compatibility Module pin styles Mechanical Contact normal force 100 grams EOL min. Number of mating cycles 5 GR-1217-CORE, R5-23 Exception to GR-1217-CORE which specifies 25 mating cycle max.(Note4) Module engagement force 32 lbs per connector max. GR-1217-CORE, R5-31,32 Module disengagement force 32 lbs per connector max. GR-1217-CORE, R5-31,32 50 A Maxi(Note1) / 50 A Mini / 25 A Micro (Based on 248°F (120°C) max socket temp. & 86°F (30°C) max temperature rise of contact) Gold plating standards, and accepted industry standards such as IICIT, EIA, Bellcore guidelines 400 µΩ max. GR-1217-CORE, 6.2.1 300 µΩ max. GR-1217-CORE, 6.2.1 200 µΩ max. GR-1217-CORE, 6.2.1 248°F (120°C) max. Max continuous use temperature for gold plating 86°F (30°C) max. EIA-364-70A(Note2) GR-1217-CORE(Note3) Electrical Current rating for output pin sockets Low level contact resistance 0.080" (2,03 mm) dia socket (LLCR) Low level contact resistance 0.150" (3,81 mm) dia socket (LLCR) Low level contact resistance 0.180" (4,57 mm) dia sockets (LLCR) Thermal Max socket temperature Temperature rise Environmental Shock and vibration InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on PCB construction and mounting details. For critical, or unusual, shock and vibration environments, the performance of the system should be independently verified. Table 16–2 — InMate specifications and materials Materials Ratings Headers Material: RytonTM R–7 PPS, 65% glass fiber and mineral filled compound Flammability Thermal stability (short term) Thermal stability (long term) Solder Cap Material Plating Sockets Material Poly-Phenylene Sulfide UL94 V-0/5VA 500°F (260°C) 392°F (200°C) 305 stainless steel Clear passivate to repel solder Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010" thick Woods nickel strike followed by 50 µ in. min. low stress sulfamate-based electrolytic nickel, followed by 20 µ in min hard gold followed by 10 µ in. min. soft gold Plating Table 16–3 — Material properties of InMate components (Note1) For 80 A operation with Maxi, contact Applications Engineering. (Note3) (Note2) GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware. A module of NEBSFR, FR-2063 ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association) (Note4) The module and socket must be replaced after 5 mating cycles. (1)For 80 A operation with Maxi, contact Applications Engineering. Maxi, Mini, Micro Design Guide Page 78 of 88 Rev 4.9 Apps. Eng. 800 927.9474 vicorpower.com 800 735.6200 16. Through-hole Socket Mount System (InMate) Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies Standoff Kits for InMate Mounted Modules* Board Thickness Slotted Baseplate Nom. (Min. / Max.) Mounting Style 0.062" (0.055"/ 0.071") 1,5 mm (1,4 mm /1,8 mm) Inboard 0.093" (0.084"/ 0.104") 2,4 mm (2,1 mm /2,6 mm) 0.125" (0.113"/ 0.138") 3,1 mm (2,8 mm /3,5 mm) Onboard Inboard Onboard Through-Hole Baseplate Threaded Baseplate Through-Hole Heat Sink Threaded Heat Sink Through-Hole Heat Sink Threaded Heat Sink Through-Hole Heat Sink Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148 Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124 Kit -18158 Kit -18159 Kit -18153 Kit -18155 Kit -18153 Bag -19134 Bag -19135 Bag -19129 Bag -19131 Bag -19129 Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148 Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124 Kit -18156 Kit -18157 Kit -18150 Kit -18152 Kit -18150 Bag -19132 Bag -19133 Bag -19126 Bag -19128 Bag -19126 Kit - 24054 Kit -18157 Kit -24056 Kit - 18152 Kit-24056 Bag -19132 Bag -19133 Bag -19126 Bag - 19128 Bag-19126 Onboard Table 16–4 — InMate standoff recommendations * Kits include six (6) standoffs and screws. Mini and Micro modules require a minimum of four (4) standoffs. Bags of one hundred (100) do not include screws; #4-40 thread hardware required. References InMate PCB layout drawing for Maxi Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18400&ct=PDF InMate PCB layout drawing for Mini Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18399&ct=PDF InMate PCB layout drawing for Micro Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18398&ct=PDF InMate and Socket outline drawing for Inboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18483-XX&ct=PDF InMate and Socket outline drawing for Inboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18482-XX&ct=PDF InMate and Socket outline drawing for Inboard Micro Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18481-XX&ct=PDF InMate and Socket outline drawing for Onboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18480-XX&ct=PDF InMate and Socket outline drawing for Onboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20030-XX&ct=PDF InMate and Socket outline drawing for Onboard Micro Modules http://vdac2.vicr.com/cadUtil/display_cad.asp?pn=20029-XX&ct=PDF Module Exchange Tool Used in facilitating the proper extraction of modules from InMate or SurfMate sockets. Removal without using the Exchange Tool may cause damage to the sockets. Description Maxi Exchange Tool Mini Exchange Tool Micro Exchange Tool Page 79 of 88 22827 Part Number 22827 22828 22829 Maxi, Mini, Micro Design Guide 22829 22828 Rev 4.9 Apps. Eng. 800 927.9474 vicorpower.com 800 735.6200