Flow2 packages copyright Vincotech Handling Instruction for flow 2 packages It is valid for all type of flow2 modules: 12/13 mm & 17 mm housing, solder & Press fit pins Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 1 of 25 Flow2 packages copyright Vincotech Table of Contents 1 General instructions ............................................................................................................................................. 4 2 Specification for PCBs ........................................................................................................................................... 4 2.1 Specification for modules with Press-fit pins .......................................................................................................... 4 2.2 Specification for modules with solder pins ............................................................................................................. 5 2.3 Specification for modules with Press-fit pins that are going to be soldered........................................................... 5 2.4 PCB cutouts for insulating ribs, screwing holes ....................................................................................................... 6 2.4.1 For 17 mm type module (Press-fit and solder pins) ....................................................................................... 6 2.4.2 For 12/13 mm type module (Press-fit and solder pins) ................................................................................. 6 2.4.2.1 OPTION 1: Mounted on module with distance of 13 mm .................................................................... 6 2.4.2.2 OPTION 2: Mounted on module with distance of 12 mm .................................................................... 7 2.5 Recommended PCB-thicknesses and mounting heights for module types ............................................................. 8 2.5.1 For 17 mm type module ................................................................................................................................ 8 2.5.1.1 Option 1: Without spacers ................................................................................................................... 8 2.5.1.2 Option 2: With spacers ......................................................................................................................... 8 2.5.2 For 12/13 mm type module ........................................................................................................................... 9 2.5.2.1 Mounting with distance of 13 mm ....................................................................................................... 9 2.5.2.2 Mounting with distance of 12 mm ..................................................................................................... 10 3 Specification for base plate ................................................................................................................................ 11 4 Specification for heat sinks ................................................................................................................................. 13 5 Specification for thermal interface materials ..................................................................................................... 13 5.1 OPTION 1: thermal paste ....................................................................................................................................... 13 5.2 OPTION 2: Pre applied thermal interface material ............................................................................................... 13 6 Specification for fastening screws to the heat sink ............................................................................................. 13 7 Press in process (Press-fit pin modules only) ...................................................................................................... 14 7.1 Press in tool ........................................................................................................................................................... 14 7.1.1 Supporting tool ............................................................................................................................................ 15 7.1.2 Press in top tool in case of module without thermal interface material. .................................................... 16 7.1.3 Press-in top tool in case of module with thermal interface material .......................................................... 17 7.2 Press in process parameters.................................................................................................................................. 18 7.2.1 The basic requirement for the press in process: ......................................................................................... 18 7.3 Process control parameters .................................................................................................................................. 18 8 Press-out process for modules with Press-fit pins .............................................................................................. 20 8.1 Press-out tool ........................................................................................................................................................ 20 8.2 Press-out process characteristics .......................................................................................................................... 22 8.2.1 Press-out process parameters ..................................................................................................................... 23 8.3 Disassembling by hand .......................................................................................................................................... 23 9 Recommendation for soldering .......................................................................................................................... 24 9.1 Wave soldering of modules with solder pins ........................................................................................................ 24 9.2 Hand soldering parameters ................................................................................................................................... 25 10 ESD protection.................................................................................................................................................... 25 11 Environmental conditions................................................................................................................................... 25 12 Disclaimer .......................................................................................................................................................... 25 Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 2 of 25 Flow2 packages copyright Vincotech Table of Figures Figure 1: Module with PCB and heat sink ............................................................................................................ 4 Figure 2: Solder pin diameter ............................................................................................................................... 5 Figure 3: PCB’s Cutout for 17 mm type modules ................................................................................................. 6 Figure 4: PCB’s cutout for 12/13 mm type module when the PCB distance is 13 mm ........................................ 6 Figure 5: PCB’s cutout for 12/13 mm type module when the PCB distance is 12 mm ........................................ 7 Figure 6: Scratch dimensions ............................................................................................................................. 11 Figure 7: Polished base plate ............................................................................................................................. 12 Figure 8: Discoloration of base plate .................................................................................................................. 12 Figure 9: Fingerprint on the base plate ............................................................................................................... 12 Figure 10: Recommended tooling for the press in process ................................................................................ 14 Figure 11: Recommended hole and cutout dimensions for bottom part of press-in tool .................................... 15 Figure 12: Press in tool Top part ........................................................................................................................ 16 Figure 13: Press in tool Top part with recommended face for thermal grease covered base plate ................... 17 Figure 14: Press-in depth in PCB ....................................................................................................................... 18 Figure 15: Typical press-in diagram of a module with 20 pins ........................................................................... 19 Figure 16: Exploded view of the Press-out tool .................................................................................................. 20 Figure 17: Working position of the press-out tool ............................................................................................... 21 Figure 18: Recommended dimensions of the upper tool .................................................................................... 21 Figure 19: Recommended dimensions of the lower tool .................................................................................... 22 Figure 20: Force-path curve of the press-out process ....................................................................................... 23 Figure 21: Cutting edge ...................................................................................................................................... 23 Figure 22: Platedthrough hole, good soldering .................................................................................................. 24 Figure 23: Typical profile for wave soldering ...................................................................................................... 24 Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 3 of 25 Flow2 packages copyright Vincotech 1 General instructions The flow2 type modules have to be mounted to a PCB. The electrical connections between module and PCB can be made by soldering or by Press-fit technology. The module has to be fixed to a heat sink. It is required to fix the PCB to the heat sink by threaded spacer or by the module itself with its towers (see details in Section 2.5). PCB Module Module backside Heatsink Figure 1: Module with PCB and heat sink During assembly the pins are not to be drawn or pushed more than ±0.2 mm or loaded with a force bigger than 35 N (except during pressing-in of Press-fit pins). The special design of the Press-fit pins prevents higher than 0.1 mm deformation of pins during pressing-in process. The tension of the pin must not exceed ±5 N at a maximum substrate temperature of 100 C. 2 Specification for PCBs Printed board material meets the requirements of IEC 61249-2-7. The maximum number of conductive layers is not limited. 2.1 Specification for modules with Press-fit pins The module can be screwed to the PCB after the press in with 4 screws of type BN82428 (D=2.5 mm and L=6 mm). Mounting torque: 0.4 Nm Printed board thickness must not be less than 1.6 mm (thinner PCB has to be tested on request). PCB should be covered with solder mask on both sides. Plated Through-Hole specification for Press-fit pin: o Hole dimension prior to plating: 1.6 +/-0.025 mm o Thickness of the PTH wall > 25 μm Cu o Plated hole final dimension: 1.45 +0.09/-0.06 mm o Minimum Cu width of the annular ring > 0.1 mm o Position tolerance 0.05 mm Plating material: o Sn > 0.5 μm Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 4 of 25 Flow2 packages copyright Vincotech The PCB can be disassembled and reused 2 more times. o Au 0.05 - 0.2 μm over 2.5 – 5 μm Ni The PCB can be used only once! (Other plating has to be tested on request.) Minimum distance between the edge of the PCB and the centre of the pin hole: 4 mm Minimum distance between the centre of the pin hole and the component on the PCB: 4 mm 2.2 Specification for modules with solder pins The module must be screwed to the PCB with 4 screws (type BN82428, D=2.5 mm and L=6 mm) before soldering the pins into the PCB. Mounting torque: 0.4 Nm. After screwing all pins must be soldered into the PCB. The hole diameters on the PCB has to be designed according to the soldering pin diameter which is 1±0.05 mm. For further dimensions or 3D model please contact your local sales manager. Figure 2: Solder pin diameter 2.3 Specification for modules with Press-fit pins that are going to be soldered In case the Press-fit pin is soldered instead of pressing in the recommended PCB hole diameter is 1.85 ± 0.1mm. It has to be taken into consideration that the annular ring has to be designed according to the standards for through hole components if soldering of Press-fit modules is expected. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 5 of 25 Flow2 packages copyright Vincotech 2.4 PCB cutouts for insulating ribs, screwing holes 2.4.1 For 17 mm type module (Press-fit and solder pins) Figure 3: PCB’s Cutout for 17 mm type modules 2.4.2 For 12/13 mm type module (Press-fit and solder pins) 2.4.2.1 OPTION 1: Mounted on module with distance of 13 mm Figure 4: PCB’s cutout for 12/13 mm type module when the PCB distance is 13 mm Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 6 of 25 Flow2 packages copyright Vincotech 2.4.2.2 OPTION 2: Mounted on module with distance of 12 mm washer DIN125A M2.5 should be used together with screw BN82428 Figure 5: PCB’s cutout for 12/13 mm type module when the PCB distance is 12 mm Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 7 of 25 Flow2 packages copyright Vincotech 2.5 Recommended PCB-thicknesses and mounting heights for module types The distance between the top surface of the heat sink and the bottom plane of the PCB is defined by the module size: 17 mm or 12/13 mm. For fixing the PCB spacers can be used (press-fit pin modules only). The number and the position of the fixing points depend on the design of the circuit, location of different masses like capacitors or inductors and the environment of the system. General recommendation can not be given. The recommended heights of these spacers are given on the following sections. 2.5.1 For 17 mm type module 2.5.1.1 Option 1: Without spacers for Press-fit and solder pin modules PCB thickness (minimum thickness applies to press-fit pin modules only) Mounting height with the module as spacer 2.5.1.2 Option 2: With spacers for Press-fit pin modules only PCB thickness Mounting height with spacer in case of using recommended press-in tool (see Section 7.1) Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 8 of 25 Flow2 packages copyright Vincotech 2.5.2 For 12/13 mm type module 2.5.2.1 Mounting with distance of 13 mm 2.5.2.1.1 Option 1 :Without spacers for Press-fit and solder pin modules PCB thickness (minimum thickness applies to press-fit pin modules only) Mounting height with the module as spacer 2.5.2.1.2 Option 2: With spacers for Press-fit pin modules only PCB thickness Mounting height with spacer in case of using recommended press-in tool (see Section 7.1) Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 9 of 25 Flow2 packages copyright Vincotech 2.5.2.2 Mounting with distance of 12 mm 2.5.2.2.1 Option 1: Without spacers for Press-fit and solder pin modules PCB thickness (minimum thickness applies to press-fit pin modules only) Mounting height with the module as spacer Option 2: With spacers for Press-fit pin modules only PCB thickness Mounting height with spacer in case of using recommended press-in tool (see Section 7.1) Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 10 of 25 Flow2 packages copyright Vincotech 3 Specification for base plate In the case of the dimensions of the imperfections remains below the following values it has no effect to the thermal properties: If copper became visible we are talking about scratch. Depth and width of the scratch can’t exceed 200 and 800μm. Length of the scratch doesn’t matter but the total area of scratches can’t exceed 5% of the total base plate surface (Figure 6). Polishing allowed on the whole nickel plated surface if copper doesn’t become visible (Figure 7). Discolouration, fingerprints are only surface imperfections without any effect to the module function (Figure 8, Figure 9). Figure 6: Scratch dimensions Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 11 of 25 Flow2 packages copyright Vincotech Figure 7: Polished base plate Figure 8: Discoloration of base plate Figure 9: Fingerprint on the base plate Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 12 of 25 Flow2 packages copyright Vincotech 4 Specification for heat sinks Whole heat sink surface under the module must be plane (see “flatness” def.), clean and free of particles. The flatness must be < 0.05 mm. The surface roughness should be less than: Rz 0.01 mm. 5 Specification for thermal interface materials 5.1 OPTION 1: thermal paste Apply a homogeneous layer of thermal conductive paste over the whole backside of the module with a thickness of min. 0.04 mm and max. 0.09 mm. Thicker thermal paste will raise the value of the Rth. 5.2 OPTION 2: Pre applied thermal interface material The modules may have already been pre-printed with thermal interface material. In case of modules with Press-fit pins: Either use a unique press-in tool that fits to the honeycomb pattern of paste, see Figure 13. Or mount the module first to the heat sink and then press into the PCB. 6 Specification for fastening screws to the heat sink screws M5 (recommended screw type DIN 7984) flat washer D=max. 10 mm ISO 7092 (DIN 433) spring washer D=max. 10 mm DIN127 or DIN 128 mounting torque: 4 Nm < Ma < 6 Nm Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 13 of 25 Flow2 packages copyright Vincotech 7 Press in process (Press-fit pin modules only) 7.1 Press in tool Figure 10: Recommended tooling for the press in process The module can be pressed into the PCB from the top (as Figure 10 shows) or the PCB can be pressed onto the module (the module is below the PCB). It is suggested to press the module into the PCB from the top. In this document this direction is discussed. Pressing multiple modules into one PCB can be done one by one (subsequently) or all at once. Pressing multiple modules at once requires a press-in tool according to the above detailed single tool. The tool has to ensure the correct leveling of the modules and PCB to avoid mechanical stress. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 14 of 25 Flow2 packages copyright Vincotech 7.1.1 Supporting tool The supporting tool supports the PCB during the press-in process. Size and position of the holes and cut-outs depends on the components on the PCB. Figure 11 shows the recommended hole and cut-out dimensions for the Press-fit pins. The recommended diameter of the holes / cut-outs for the pins in the supporting tool is 1.7 mm – 4 mm (depends on the positioning accuracy). The minimal supporting place around the pin is 2 mm. If the pins are close to each other then it is possible to make a lengthwise cut-out for more pins as well. It is necessary to position the PCB and the module as well. The depth of the cut-outs for the pins is 6 mm. The module can be positioned with pins from the bottom tool through the fixing holes of the modules. Material of the supporting tool: POM (Polyoxymethylene) ESD proof or any metal alloy. Thickness of the supporting tool has to be at least 20 mm. Figure 11: Recommended hole and cutout dimensions for bottom part of press-in tool Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 15 of 25 Flow2 packages copyright Vincotech 7.1.2 Press in top tool in case of module without thermal interface material. The material of the press-in tool: Tempered aluminum alloy grade 7075-T6 with yield strength of 430 MPa and hardness of 160 HB or Tool steel grade 21 MnCr 5 with yield strength of 660 MPa and hardness of 330 HB or better. The dimension marked with ‘X’ on the drawing (Figure 12) is depends on module height: mounting X tolerance height +0.05 17.2 mm 17.1 mm +0 13.2 mm 13.1 mm 12.2 mm 12.1 mm +0.05 +0 +0.05 +0 Figure 12: Press in tool Top part Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 16 of 25 Flow2 packages copyright Vincotech 7.1.3 Press-in top tool in case of module with thermal interface material A unique press-in top tool is needed (see Figure 13) not to damage dramatically the phase change material during the press-in process. Small damages (max: Ø0.6 mm) are allowed. Tool steel grade 21 MnCr 5 with yield strength of 660 MPa and hardness of 330 HB or better. The dimension marked with ‘X’ on the drawing (Figure 12) is depends on module height: mounting X tolerance height +0.05 17.2 mm 17.1 mm +0 13.2 mm 13.1 mm 12.2 mm 12.1 mm +0.05 +0 +0.05 +0 For more information (3D model) please contact your local sales manager. Figure 13: Press in tool Top part with recommended face for thermal grease covered base plate Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 17 of 25 Flow2 packages copyright Vincotech 7.2 Press in process parameters Press in force: 90-150 N/pin Press in speed: 5-10 mm/s The total press in force depends on the number of the pins and the diameter of the holes on the PCB. 7.2.1 The basic requirement for the press in process: The Press-fit pin-head needs to overlap the PCB in such a way, that it has to assure at least a distance of 0.5 mm from its centre to the top or bottom surface of the PCB (see Figure 14). This condition is automatically fulfilled with the use of the recommended press-in tool. Figure 14: Press-in depth in PCB 7.3 Process control parameters In case the press machine is equipped with the possibility to record the force-stroke values during the process, the following quality relevant values should be taken into consideration. Figure 15 shows a normal press-in diagram. Three different sections can be seen on the diagram: First raising section (blue): The heads of the Press-fit pins slide into the holes and deform to fit in the holes. This section ends with a local maximum. Second section (green): The center of the pin heads are inside the holes. The pins slide in the holes to reach the final position. This section ends with a local minimum. Second raising section (red): The sliding of the pins is stopped. The press-in tool starts to bend the PCB. The pressing-in has to be stopped at the beginning of the second raising section to avoid damage of the PCB. The press-in force or the motion stroke of the tool has to be controlled to stop at beginning of the second raising section. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 18 of 25 Flow2 packages copyright Vincotech Possible process control parameter settings are as follows: The local maximum value (end of blue section) of the force-stroke diagram has to be: o higher than 90 N x number of the pins, o smaller than 150 N x number of the pins. These limits are marked on the diagram. If the press-in force does not fit in the interval defined above, it can indicate faulty plating, or improper diameter of the holes. Filtering out the bad pin positioning see black part of the curve before blue. In this section the force should not reach the 100 N. If it occurs it may refer to possible dispositioning of one or more pins that makes visual inspection necessary. Figure 15: Typical press-in diagram of a module with 20 pins Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 19 of 25 Flow2 packages copyright Vincotech 8 Press-out process for modules with Press-fit pins Please note: In the case an out-pressed module should be used again, it is necessary to solder the module to the PCB because of the remaining deformation of the pins. This is because the Press-fit zone will keep a remaining deformation after the press-out process. An additional press-in will lead into too low holding forces between the Press-fit pin and the PCB hole. It has to be taken into consideration that the annular ring has to be designed according to the standards for through hole components if soldering of Press-fit modules is expected. Soldering of certain modules with Press-fit pins is possible by wave soldering process. The wave soldering cannot be performed on all type of Press-fit modules. 8.1 Press-out tool The specific tool to disassemble the modules from the PCBs has two parts similarly to the press-in tool. The lower part serves as a backing of the PCB. It has a backing nest and supporting pins. It is important that the backing is closest possible to the side of the modules. The supporting pins are in line with the fixing pins from the upper part. In case the PCB bears parts in the line of the backing, it is possible to make a cut-out on the nest. The upper part consists of two pressure plates that are connected by springs. The pins on the lower plate serve to fix the PCB. With the aid of these parts, the bending of the PCB can be prevented during pressing. The ram fastened to the upper plate is designed according to the positions of the parts on the PCB and of the layout of the pins. In case of the use of thicker PCB (>2.5 mm) it is not possible to press out the module with a flat plate due to the overhang of the pins. In that case pressing sticks positioned according to the pin layout are necessary. Recommended spring force: 30 N/mm Recommended number of springs: 6 pcs Figure 16: Exploded view of the Press-out tool Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 20 of 25 Flow2 packages copyright Vincotech Figure 17: Working position of the press-out tool Figure 18: Recommended dimensions of the upper tool Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 21 of 25 Flow2 packages copyright Vincotech Figure 19: Recommended dimensions of the lower tool 8.2 Press-out process characteristics After inserting the modules into the nest, the downwards moving press fixes the PCB with the lower plate through the springs. The pins are pressed through by the onwards moving pressing ram. Figure 20 shows a typical force-distance curve of the press-out process. It is typical for this curve that a characteristic peak appears which indicates the breaking of the cold welded connection. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 22 of 25 Flow2 packages copyright Vincotech Figure 20: Force-path curve of the press-out process 8.2.1 Press-out process parameters Press-out force: Higher than 40 N/pin Press-out speed: 2 – 5 mm/s 8.3 Disassembling by hand If the Press-fit pin-head is overlapped by the PCB in such a way that the spring-end is out of the PCB, the disassembling is possible with pliers by hand. The cutting should be done in such a way that the cutting edge is under level ‘A’ indicated in Figure 21, where the two parts of the pin head get united. After clipping away all of the pin-heads, it is possible to remove the module from the PCB. Figure 21: Cutting edge Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 23 of 25 Flow2 packages copyright Vincotech 9 Recommendation for soldering Figure 22: Platedthrough hole, good soldering Plated through holes should exhibit a vertical solder fill of 100%, with a fully formed fillet on the solder side and evidence of 100% wetting on the component side lead, barrel and pad. 9.1 Wave soldering of modules with solder pins Figure 23: Typical profile for wave soldering Soldering of certain modules with Press-fit pins is also possible by wave soldering process. The wave soldering can not be performed on all type of Press-fit modules. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 24 of 25 Flow2 packages copyright Vincotech 9.2 Hand soldering parameters Max. solder iron temperature: 350 °C Max. contact time with component lead: 10 s Number of heat cycles: 3 10 ESD protection Modules are sensitive to electrostatic discharge, because such a discharge can damage or destroy the sensitive chips. All modules are ESD protected in the shipment box by conductive plastic trays. During the handling and assembly of the modules it is recommended to wear a conductive grounded wristlet and ensure conductive grounded working place. 11 Environmental conditions The modules can be subjected to environmental conditions characterized by the following classes: Storage: Transportation: 1K2 / 1B1 / 1C1 / 1S2 / 1M2 2K2 / 2B1 / 2C1 / 2S1 / 2M2 The classes are defined in the IEC 60721-3-1 and IEC 60721-3-2. The modules have 2 year shelf life with the given storage conditions. 12 Disclaimer The information within this document does not substitute customer’s own tests, because the circumstances of the application cannot be controlled by Vincotech. The content of this document is according to today’s standards and knowledge and written up with necessary care. Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014 29.10.2013 Date Őri A Bauer Gy Zs.Gyimóthy T. Gyetvai Des. / Mod. Appr. Flow2-P-*-HI Page 25 of 25