Si5321-EVB - Silicon Labs

Si5321-EVB
E V A L U A T I O N B O A R D F O R T H E S i 53 2 1 S O NE T / S D H P R E C I S I O N
CLOCK MULTIPLIER IC
Description
Features
The Si5321-EVB is the customer evaluation board for
the Si5321 SONET/SDH Precision Port Card Clock IC.
This board is supplied to customers for evaluation of the
Si5321 device. The board provides access to signals
associated with normal operation of the device and
signals that are reserved for factory testing purposes.
Single supply at either 3.3 or 2.5 V (jumper
configurable)
Differential I/Os ac coupled on board
Differential inputs terminated on board
Control input signals are switch configurable
Status outputs brought out to headers for easy
access.
Function Block Diagram
3.3 V or 2.5 V
Supply
Pow er
Supply
Input
Control
Input
Jumper
Header
Status
Output
Signal
Header
Control
Inputs
Status
Outputs
3.3 V/2.5 V
Supply
Selection
+
CLKIN
CLKIN
Factory
Test
Input
Header
Rev. 0.4 6/02
Factory
Test
Output
Header
Factory
Test
Serial
Input
50 Ω
–
50 Ω
CLKOUT
CLKOUT
Si5321
–
+
t
e
x
t
Factory
Test
Serial
Output
t
e
x
t
Factory
Test
Analog
Output
Copyright © 2002 by Silicon Laboratories
Si5321-EVB-04
Si 5321- EV B
Functional Overview
The Si5321-EVB is the customer evaluation board for
the Si5321 SONET/SDH Precision Port Card Clock IC.
It is supplied to customers for evaluation of the Si5321
device. The board provides access to signals
associated with normal operation of the device and
signals that are reserved for factory testing purposes.
Power Supply Selection and Connections
The Si5321-EVB board is switch selectable for
operation using either a single 3.3 V or a single 2.5 V
supply.
For operation using a 3.3 V supply, configure the board
as follows:
1. Remove power supply connections from the VDD and
GND terminals of the board’s power connector, J3.
2. Remove the connection between VDD33 and VDD25 by
removing the jumper on header JPI.
3. Set VSEL33 high by sliding the switch on the VSEL33
(JP6) to the side marked “1”.
4. Connect the power supply ground lead and 3.3 V supply
lead to the GND and VDD terminals of the board’s power
connector, J3.
For operation using a 2.5 V supply, configure the board
as follows:
1. Remove power supply connections from the VDD and
GND terminals of the board’s power connector, J3.
2. Set VSEL33 low by sliding the switch on the VSEL33 (JP6)
to the side marked “0”.
3. Connect VDD33 and VDD25 by installing a jumper
between one of the 3.3 V pins and one of the 2.5 V pins on
header JPI.
4. Connect the power supply ground lead and 2.5 V supply
lead to the GND and VDD terminals of the board’s power
connector, J3.
Power Consumption
Typical supply current draw for the Si5321-EVB is
110 mA.
Si5321 Control Inputs
The control inputs to the Si5321 are each routed from
the center pin of a SPDT switch, JP5, to the Si5321
device. Additionally, the switches at JP5 are connected
to GND on one side of the switch and to VDD33 on the
other side. This arrangement allows easy configuration
of each input to either a high or low state. To further
reduce the coupling of noise into the device through
these control inputs, the signals are routed on internal
layers between ground planes.
2
RSTN/CAL Settings for Normal Operation
and Self-Calibration
The RSTN/CAL signal is an LVTTL input to the Si5321
and has an on-chip pulldown mechanism. This pin must
be set high for normal operation of the Si5321 device.
Setting RSTN/CAL low forces the Si5321 into the reset
state. A low-to-high transition of RSTN/CAL enables the
part and initiates a self-calibration sequence.
The Si5321 device initiates self-calibration at powerup if
the RSTN/CAL signal is held high. A self-calibration of
the device also can be manually initiated by
momentarily pushing the RSTN/CAL switch, SWI and
then releasing.
Manually initiate self-calibration after changing the state
of either the BWSEL[1:0] control inputs or the FEC[1:0]
inputs.
Whether manually initiated or automatically initiated at
powerup, the self-calibration process requires a valid
input clock. If the self-calibration is initiated without a
valid clock present, the device waits for a valid clock
before completing the self-calibration. The Si5321 clock
output is set to the lower end of the operating frequency
range while the device waits for a valid clock. After the
clock input is validated, the calibration process runs to
completion, the device locks to the clock input, and the
clock output shifts to its target frequency. Subsequent
losses of the input clock signal do not require recalibration. If the clock input is lost after self-calibration,
the device enters Digital Hold mode. When the input
clock returns, the device re-locks to the input clock
without performing a self-calibration.
Status Signals
The status outputs from the Si5321 device are each
routed to one pin of a two-row header. The signals are
arranged so that each signal has a ground pin adjacent
to the signal pin for reference. The row of signal pins is
marked with an “S”, and the row of ground pins is
marked with a “G”.
Visible indicators are added to the LOS and CAL_ACTV
signals. The LEDs glow when the signal is active and
the LED enable switch is set to ON. The LOS LED is
illuminated when the device does not recognize a valid
clock input. The CAL_ACTV LED is illuminated when
the device is calibrating to an input clock.
Differential Clock Input Signals
The differential Clock inputs to the Si5321-EVB board
are ac coupled and terminated on the board at a
location near the SMA input connectors. The
termination components are located on the top side of
the board. The termination circuit consists of two 50 Ω
Rev. 0.4
Si5321-EVB
and a 0.1 µF capacitor, such that the positive and
negative inputs of the differential pair each see a 50 Ω
termination to “ac ground,” and the line-to-line
termination impedance is 100 Ω.
There are two considerations for selecting this
combination of compensation resistor and capacitor.
First, is the stability of the regulator. The second is noise
filtering.
For single-ended operation, supply a signal to one of
the differential inputs (usually the positive input). The
other input should be shorted to ground using an SMA
shorting plug. The on-board termination circuit provides
a 50 Ω termination to ac-ground for each leg of the
differential pair.
The acceptable range for the time constant at this node
is 15 µs to 50 µs. The capacitor used on the board is a
33 µF capacitor with an ESR of .8 Ω. This yields a time
constant of 26.4 µs. The designer could decide to use a
330 µF capacitor with an ESR of .15 Ω. This yields a
time constant of 49.5 µs. Each of these cases provide a
compensation circuit that makes the output of the
regulator stable.
Differential Clock Output Signals
The differential clock outputs from the Si5321 device
are routed to the perimeter of the circuit board using
50 Ω transmission line structures. The capacitors that
provide ac-coupling are located near the clock output
SMA connectors.
Internal Regulator Compensation
The Si5321-EVB contains pad locations for a resistor
and a capacitor between the VDD25 node and ground.
The resistor pads are populated with a 0 Ω resistor. The
capacitor pads are populated with a low ESR 33 µF
tantalum capacitor. This is the suggested compensation
circuit for Si5321 devices.
The second issue is noise filtering. For this, more
capacitance is usually better. For the two cases
described above, the 330 µF case provides greater
noise filtering. However, the large case size of the
330 µF capacitor might make it impractical for many
applications. The Si5321 device is specified with the
33 µF cap.
Default Jumper Settings
The default jumper settings for the Si5321-EVB board
are given in Table 1. These settings configure the board
for operation from a 3.3 V supply.
Table 1. Si5321-EVB Assembly Rev B-01 Default Jumper/Switch Settings
Location
Signal
State
Notes
JP6
VSEL33
1
Internal Regulator enabled
JP1
VDD33
Open
3.3 V plane not connected to 2.5 V plane
JP5
VALTIME
0
100 ms Validation Time
FEC[0]
0
No FEC scaling
FEC[1]
0
No FEC scaling
FEC[2]
0
No FEC scaling
BWSEL[0]
0
Loop Filter Bandwidth = 800 Hz
BWSEL[1]
1
Loop Filter Bandwidth = 800 Hz
INFRQSEL[0]
1
Clock IN = 19.44 MHz
INFRQSEL[1]
0
Clock IN = 19.44 MHz
INFRQSEL[2]
0
Clock IN = 19.44 MHz
FRQSEL[0]
1
Clock Out = 622.08 MHz
FRQSEL[1]
1
Clock Out = 622.08 MHz
FRQSEL[2]
0
Clock Out = 622.08 MHz
BWBOOST
1
Selected bandwidth not doubled
FXDDELAY
0
Fixed Delay disabled
LED ENABLE
On
LED Indicators enabled
JP7
Rev. 0.4
3
Rev. 0.4
3.3V
3.3V
41
38
35
32
29
26
23
20
17
14
11
8
5
2
41
38
35
32
29
26
23
20
17
14
11
8
5
2
2
2
1x3 HEADER
1
3
JP2
14x3 HEADER
1
3
4
6
7
9
10
12
13
15
16
18
19
21
22
24
25
27
28
30
31
33
34
36
37
39
40
42
JP1
101-0161
SW1
R9
4.99k, 0603
1
3
1
3
4
6
7
9
10
12
13
15
16
18
19
21
22
24
25
27
28
30
31
33
34
36
37
39
40
42
power connector, 2 pin
POS2
L1
1
3
2
0, 0402
JP4
2
FXDDELAY
VALTIME
BWSEL[0]
BWSEL[1]
BWBOOST
FEC[0]
FEC[1]
FEC[2]
OUTFRQSEL[0]
OUTFRQSEL[1]
R10
1
3
C7
2200pf, 0603
ClkIn-
ClkIn+
RSTN/CAL
C6
0.1uf, 0603
OUTFRQSEL[2]
INFRQSEL[0]
INFRQSEL[1]
INFRQSEL[2]
C5
33uf, 3528
VSEL33
+
0, 0402
R5
R3
49.9, 0603
0.1uf, 0603
C14
2
2
1
3
4
6
7
9
1
3
4
6
7
9
JP7
8
5
2
CAL_ACTV
DH_ACTV
LOS
C16
Spare, 0402
+
C11
330uf, 7343
8
5
2
JP6
TMOD[2]
TMOD[1]
R1
REXT
RSTN/CAL
VALTIME
FXDDELAY
BWBOOST
VSEL33
BWSEL[0]
BWSEL[1]
FEC[0]
FEC[1]
FEC[2]
FRQSEL[0]
FRQSEL[1]
FRQSEL[2]
INFRQSEL[0]
INFRQSEL[1]
INFRQSEL[2]
CLKIN+
CLKIN-
3.3V
0, 0603
C12
330uf, 7343
R6
10k, 0402
H2
H3
H4
B4
D2
C2
B1
C1
A3
A2
B2
H5
H8
B3
F1
G1
H1
D1
E1
+
DEV_ID[0]
DEV_ID[1]
DEV_ID[2]
DEV_ID[3]
DEV_ID[4]
DEV_ID[5]
ANAOUT
HEADER 3x2
2 2
4 4
6 6
1
3
5
TMOD[0]
1
3
5
RSTN/CAL
VALTIME
FXDDELAY
BWBOOST
VSEL33
BWSEL[0]
BWSEL[1]
FEC[0]
FEC[1]
FEC[2]
OUTFRQSEL[0]
OUTFRQSEL[1]
OUTFRQSEL[2]
INFRQSEL[0]
INFRQSEL[1]
INFRQSEL[2]
C10
330uf, 7343
C15
Spare, 0402
+
2.5V
+
2.5V
C13
33uf, 3528
U1
Si5321_revB
1
3
5
7
9
11
13
JP8
1
3
5
7
9
11
13
2
4
6
8
10
12
14
2
4
6
8
10
12
14
RES/TMOD[0]
RES/TMOD[1]
RES/TMOD[2]
NC/ANAOUT
NC/DEV_ID[0]
NC/DEV_ID[1]
NC/DEV_ID[2]
NC/DEV_ID[3]
NC/DEV_ID[4]
NC/DEV_ID[5]
CAL_ACTV
DH_ACTV
LOS
CLKOUT+
CLKOUT-
Figure 1. Si5321-EVB Schematic
For engineering test purposes only. Not
needed for customer application.
3.3V
JP3
1
0, 0402
R2
49.9, 0603
R4
C8
22pf, 0603
1
D3
D4
D5
E3
E4
E5
VDD33
VDD33
VDD33
VDD33
VDD33
VDD33
3.3V
D6
D7
E6
E7
F3
F4
F5
F6
F7
VDD25
VDD25
VDD25
VDD25
VDD25
VDD25
VDD25
VDD25
VDD25
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
C3
C4
C5
C6
C7
E2
F2
G2
G3
G4
G5
G6
G7
G8
600 ohm, 1206
C8
B7
B6
B5
A6
A5
A4
A7
A8
B8
E8
D8
F8
H6
H7
TMOD[0]
TMOD[1]
TMOD[2]
ANAOUT
DEV_ID[0]
DEV_ID[1]
DEV_ID[2]
DEV_ID[3]
DEV_ID[4]
DEV_ID[5]
CAL_ACTV
DH_ACTV
LOS
ClkOut+
ClkOut-
1
1
SMA, notch fit
BODY
SIG
J2
SMA, notch fit
BODY
SIG
J1
CAL_ACTV
2
2
G
ClkIn+
ClkIn-
Q2
FDN337N
LN1371G
D1
LOS
ClkOut+
ClkOut-
R7
4.99k, 0603
0.1uf, 0603
C2
0.1uf, 0603
C1
D
S
POS1
D2
G
LN1274R
J3
BODY
SIG
1
J4
BODY
SIG
1
3
Q1
FDN337N
2
2
3.3V
1x3 HEADER
JP5
2
2
R8
4.99k, 0402
1
3
SMA, notch fit
0.1uf, 0603
C4
1
SMA, notch fit
0.1uf, 0603
C3
D
4
S
J5
Si 5321- EV B
Si5321-EVB
Bill of Materials
Reference
Description
Manufacturer
Part Number
C1,C2,C3,C4,C6,C14
C5,C13
C7
C8
C10,C11,C12
C15,C16
D1
D2
JP1
JP2,JP4,JP5
JP3
JP6
JP7
JP8
J1,J2,J3,J4
J5
L1
Q1,Q2
R1
R3,R2
R4,R5,R10
R6
R7,R8
R9
SW1
U1
0.1uf, 0603
33uf, 3528
2200pf, 0603
22pf, 0603
330uf, 7343
Spare, 0402
LED, SM, green
LED, SM, red
14x3 HEADER
1x3 HEADER
1x2 HEADER
HEADER 3x2
5x3
7x2 Header
SMA, notch fit
power connector, 2 pin
600 ohm, 1206
MOS, SM, FDN337N
0, 0603
49.9, 0603
0, 0402
10k, 0402
60.4, 0402
4.99k, 0603
101-0161
Si5321_revB
Venkel
Venkel
Venkel
Venkel
Venkel
C0603X7R160-104KNE
TA6R3TCR336KBR
C0603X7R160-222KNE
C0603C0G500-220KNE
TA6R3TCR337KER
Panasonic
Panasonic
LN1371G
LN1274R
Johnson Components
Phoenix Contact
MURATA
Fairchild
Venkel
Venkel
Venkel
Venkel
Venkel
Venkel
Mouser
Silicon Laboratories
82 SMA-S50-0-45
140-A-111-02 1729018
BLM31A601S
FDN337N
CR0603-16W-000T
CR0603-16W-49R9FT
CR0402-16W-000T
CR0402-16W-1002FT
CR0402-16W-60R4FT
CR0603-16W-4991FT
101-0161
Si5321-BC
Rev. 0.4
5
Si 5321- EV B
Figure 2. Si5321-EVB Top Silkscreen
6
Rev. 0.4
Si5321-EVB
Figure 3. Si5321-EVB—Layer 1, Component Side
Rev. 0.4
7
Si 5321- EV B
Figure 4. Si5321-EVB—Layer 2, High Speed Signals
8
Rev. 0.4
Si5321-EVB
Figure 5. Si5321-EVB—Layer 3, GND
Rev. 0.4
9
Si 5321- EV B
Figure 6. Si5321-EVB—Layer 4, VDD 2.5
10
Rev. 0.4
Si5321-EVB
Figure 7. Si5321-EVB—Layer 5, GND
Rev. 0.4
11
Si 5321- EV B
Figure 8. Si5321-EVB—Layer 6, VDD 3.3
12
Rev. 0.4
Si5321-EVB
Figure 9. Si5321-EVB—Layer 7, GND
Rev. 0.4
13
Si 5321- EV B
Figure 10. Si5321-EVB—Layer 8, Bottom
14
Rev. 0.4
Si5321-EVB
Figure 11. Si5321-EVB Bottom Silkscreen
Rev. 0.4
15
Si 5321- EV B
Document Revision Change List
Revision 0.1 to Revision 0.4
Updated to reflect Rev. D printed circuit boards.
Default jumper settings added.
Evaluation Board Assembly Revision History
16
Assembly Level
PCB Rev.
Si5321 Rev.
B-01
Rev. C
Rev. B
Assembly Notes
Assemble per BOM rev B-01
Rev. 0.4
Si5321-EVB
Notes:
Rev. 0.4
17
Si 5321- EV B
Contact Information
Silicon Laboratories Inc.
4635 Boston Lane
Austin, TX 78735
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Email: [email protected]
Internet: www.silabs.com
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
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18
Rev. 0.4