ROHM BU16024KV

HDMI Switch ICs
1 for input 1 output buffer with
Termination sense
correspondence
(Sync with HPD_SINK)
BU16024KV
No.09063EDT03
●Description
BU16024KV is 1 for input 1output HDMI/DVI buffer LSI. Each port supports 2.25Gbps. (HDMI 1.3a).
This device control is simple. It requires only 3.3V and a few GPIO controls.
Terminated resistors(50Ω) are integrated at each input port. When HPD_SINK is L, termination resistors are turned off.
TMDS inputs are high impedance.
This device is integrated equalization function and DDC buffer function, so It can adapt long cable.
●Features
1) Supports 2.25 Gbps signaling rate for 480i/p, 720i/p, and 1080i/p resolution to 12-bit color depth
2) Compatible with HDMI 1.3a
3) 5V tolerance to all DDC and HPD_SINK inputs
4) Integrated DDC buffer
5) Integrated switchable 50Ωreceiver termination
6) Integrated equalizer circuit to adapt long cable
7) Selectable output De-Emphasis Supports
8) High Impedance outputs when disabled
9) HBM ESD protection exceed 10kV
10) 3.3-V supply operation
11) 48-Pin VQFP package
12) ROHS compatible
●Applications
Digital TV, DVD Player, Set-Top-Box, Audio Video Receiver, Digital Projector, DVI or HDMI Switch Box, PC
●Line up matrix
Part No.
Power
Supply
(V)
ESD
(KV)
BU16020KV
3 to 3.6
10
BU16018KV
3 to 3.6
10
BU16027KV
3 to 3.6
10
BU16006KV
3 to 3.6
10
BU16024KV
3 to 3.6
10
Input
(ch)
HDMI
4ch
HDMI
3ch
HDMI
3ch
HDMI
2ch
HDMI
1ch
Output
(ch)
Data rate
(Gbps)
Hot
Plug
Control
Termination
Sense
Correspondence
Switching
Method
DDC
Buffer
Equalizer
De emphasis
Package
RoHS
2
Yes
VQFP100
Yes
Yes
VQFP80
Yes
VQFP64
Yes
VQFP64
Yes
VQFP48C
Yes
HDMI 1ch
2.7
Yes
Yes
GPIO/I C
Yes
Yes
(adaptive)
HDMI 1ch
2.25
Yes
Yes
GPIO
Yes
Yes
HDMI 1ch
2.25
Yes
Yes
GPIO
Yes
Yes
HDMI 1ch
2.25
Yes
Yes
GPIO
Yes
Yes
HDMI 1ch
2.25
Yes
Yes
-
Yes
Yes
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© 2009 ROHM Co., Ltd. All rights reserved.
1/17
Yes
(Always ON)
Yes
(Always ON)
Yes
2009.05 - Rev.D
Technical Note
BU16024KV
●OUTSIDE DIMENSION CHART
BU16024KV
1PIN MARK
Lot No.
Figure 1-1 Outside dimension chart
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© 2009 ROHM Co., Ltd. All rights reserved.
2/17
2009.05 - Rev.D
Technical Note
BU16024KV
●BLOCK DIAGRAM
VSADJ
OE
PRE
VCC
RINT
Y4
A4
B4
TMDS
Rx
TMDS
Driver
TMDS
Rx
TMDS
Driver
Z4
VCC
RINT
Y3
A3
B3
Z3
VCC
RINT
Y2
A2
TMDS
Driver
TMDS
Rx
B2
Z2
VCC
RINT
Y1
A1
TMDS
Rx
TMDS
Driver
Z1
B1
SCL
SCL_SINK
SDA
SDA_SINK
I2CEN
SELREF
HPD
HPD_SINK(*)
(*) when HPD_SINK = “L”. Termination resistor is turned off.
Figure 2-1 Block Diagram
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© 2009 ROHM Co., Ltd. All rights reserved.
3/17
2009.05 - Rev.D
Technical Note
BU16024KV
●PIN EXPLANATION
1). PIN ASSIGNMENT
SDA
Vcc
GND
SELREF
Vcc
SDA_SINK
SCL_SINK
GND
TEST2
33
32
31
30
29
28
27
26
25
VSADJ
SCL
35
34
TEST3
37
24
38
23
39
22
40
21
41
20
16024KV
(48-pin VQFP)
42
43
44
19
18
17
12
11
HPD_SINK
GND
Z1
Y1
Vcc
Z2
Y2
GND
Z3
Y3
Vcc
NC
TEST1
Y4
Z4
10
7
OEB
9
6
8
5
Vcc
I2CEN
PRE
4
GND
GND
3
13
2
14
48
A14
15
47
B14
16
46
1
45
TEST0
HPD
GND
B11
A11
Vcc
B12
A12
GND
B13
A13
Vcc
NC
36
(TOP VIEW)
Figure 3-1 Pin Location
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© 2009 ROHM Co., Ltd. All rights reserved.
4/17
2009.05 - Rev.D
Technical Note
BU16024KV
2). PIN LIST
TERMINAL
NAME
No.
B1, B2, B3, B4
39, 42, 45, 2
A1, A2, A3, A4
40, 43, 46, 3
Z1, Z2, Z3, Z4
22, 19, 16, 11
Y1, Y2, Y3, Y4
21, 18, 15, 10
HPD
37
HPD_SINK
24
SCL
34
SDA
33
SCL_SINK
27
SDA_SINK
28
I/O
DESCRIPTION
I
I
O
O
O
I
I/O
I/O
I/O
I/O
TMDS Negative inputs
TMDS Positive inputs
TMDS Negative outputs
TMDS Positive outputs
Hot plug detector output
Hot plug detector input
DDC Bus clock line to source
DDC Bus data line to source
DDC Bus clock line to sink
DDC Bus data line to sink
TMDS Compliant voltage swing control(via 4.64kΩ to
GND)
I2C Repeater enable
Low : High-Z High : Active
SCL_SINK/SDA_SINK Output voltage select
Open or GND connect (recommend)
Open or GND connect (recommend)
TMDS Output enable
Low : Active High : High-Z
TMDS Output de-emphasis adjustment
Low : OFF High : ON
VSADJ
35
I
I2CEN
6
I
SELREF
TEST0, 1, 2, 3
N.C
30
1, 12, 25, 36
13, 48
I
I
OEB
7
I
PRE
8
I
VCC
GND
5, 14, 20, 29,
32, 41, 47
4, 9, 17, 23,
26, 31, 38, 44
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© 2009 ROHM Co., Ltd. All rights reserved.
-
Power supply
-
Ground
5/17
2009.05 - Rev.D
Technical Note
BU16024KV
●
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
TMDS Input Stage
TMDS Output Stage
VDD
VDD
50Ω
50Ω
A
B
Control Input Stage
VDD
VDD
Y
Z
PRE
OE
10mA
R-Side I2C Input/Output Stage
T-Side I2C Input/Output Stage
VDD
SCL_SINK
SDA_SINK
SCL
SDA
Control Input Stage
VDD VDD
Control Input Stage
VDD
HPD_SINK
VDD
VDD VDD
SELREF
HPD Output Stage
VDD
I2 CEN
HPD
Figure 4-1 I/O pin schematic diagram
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© 2009 ROHM Co., Ltd. All rights reserved.
6/17
2009.05 - Rev.D
Technical Note
BU16024KV
●ERECTRICAL SPECIFICATIONS
1.) ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted)
ITEM
MIN.
TYP.
MAX.
Supply voltage (Vcc)
-0.3
4.0
SCL,
SCL_SINK,
SDA,
SDA_SINK,
-0.3
6.0
HPD_SINK input voltage
Differential input voltage
2.5
4
PRE, I2CEN, SELREF, OEB input voltage
-0.3
4
Power dissipation
1200 ※1
Storage temperature range
-55
125
※70mm×70mm×1.6mm glass epoxy board mount.(Reverse Cu occupation rate:15mm×15mm)
When it’s used by than Ta=25℃, it’s reduced by 12mW/℃.
2.) RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
Supply voltage
TA
Operating free-air temperature
TMDS DIFFERENTIAL PINS (A/B)
VID
Receiver peak-to-peak differential input voltage
VIC
Input common mode voltage
RVSADJ
Resistor for TMDS compliant voltage swing range
AVCC
TMDS output termination voltage, see Figure 5-1
RT
Termination resistance, see Figure 5-1
Signaling rate
STATUS(HPD_SINK)
VIH
LVTTL High-level input voltage
VIL
LVTTL Low-level input voltage
DDC PINS (SCL_SINK, SDA_SINK,SDA,SCL)
VI(DDC)
Input voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
7/17
UNIT
V
V
V
V
mW
℃
MIN.
3.0
0
TYP.
3.3
-
MAX.
3.6
70
UNIT
V
℃
150
VCC-0.6
4.6
3
45
0
4.64
3.3
50
-
1560
VCC+0.01
4.68
3.6
55
2.25
mVp-p
V
kΩ
V
Ω
Gbps
2.4
GND
-
5.5
0.8
V
V
GND
-
5.5
V
2009.05 - Rev.D
Technical Note
BU16024KV
3.) ELECTRICAL CHARACTERISTICS
Over recommended operating conditions (unless otherwise noted)
LIMITS
SYMBOL
PARAMETER
Icc
Supply current
PD
Power dissipation
TMDS DIFFERENTIAL PINS (A/B; Y/Z)
Single-ended high-level output
VOH
voltage
Single-ended low-level output
VOL
voltage
Single-ended low-level swing
VSWING
voltage
Overshoot of output differential
VOD(O)
voltage
Undershoot
of
output
VOD(U)
differential voltage
VOD(pp)
RINT
⊿VOC(SS)
Steady state output differential
voltage with de-emphasis
Input termination resistance
Change in steady-state
common-mode output voltage
between logic states
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© 2009 ROHM Co., Ltd. All rights reserved.
TEST CONDITIONS
VIH = Vcc,VIL = Vcc-0.4V,RVSADJ =
4.64kΩ
RT = 50Ω,AVcc = 3.3V
Am/Bm = 2.25 Gbps HDMI data
pattern,
m = 2,3,4
A1/B1 = 225 MHz clock
VIH = Vcc,VIL = Vcc-0.4V,RVSADJ =
4.64kΩ
RT = 50Ω,AVcc = 3.3V
Am/Bm = 2.25Gbps HDMI data
pattern,
m = 2,3,4
A1/B1 = 225 MHz clock
TYP.(1)
MAX.
-
140
170
mA
-
480
700
mW
AVcc 10
AVcc 600
AVcc = 3.3V,
RT = 50Ω,PRE = 0V
PRE = Vcc
Am/Bm = 225 Mbps HDMI data
pattern,
m = 2,3,4
A1/B1 = 225 MHz clock
VIN = 2.9V
8/17
UNIT
MIN.
-
AVcc +
10
AVcc 400
mV
mV
400
-
600
mV
-
6%
15%
2xVswing
-
12%
25%
2xVswing
600
-
920
mVp-p
45
50
55
Ω
-
5
-
mV
2009.05 - Rev.D
Technical Note
BU16024KV
SYMBOL
PARAMETER
DDC Input and output
Tx (SDA_SINK , SCL_SINK )
IlkR①
Input leak current,
MIN.
LIMITS
TYP.(1)
MAX
VI = 5.5V
-10
-
10
uA
TEST CONDITIONS
UNIT
IlkT②
Input leak current,
VI = Vcc
-10
-
10
uA
IOHT
IILT
High-level output current
Low-level input current
VO = 3.6V
VIL = GND
Low-level
RL = 4.7kΩ
100
250
400
10
10
0.57
0.72
0.87
-
uA
uA
VOLT
-10
-10
0.43
0.58
0.73
-
VI = 5.5V
VI = Vcc
VO = 3.6V
VIL = GND
IOUT = 4mA
-10
-10
-10
-10
-
-
10
10
10
10
0.2
uA
uA
uA
uA
V
IOH = - 8mA
IOL = 8mA
2.4
0
-
Vcc
0.4
V
V
VIH = Vcc
VIL = GND
-10
-10
-
10
10
uA
uA
VIH = Vcc
VIL = GND
-45
-45
-
45
45
uA
uA
output voltage
Low-level input voltage below
output
low-level voltage
Rx (SDA, SCL)
Il kR①
Input leak current
Il kR②
Input leak current
I OHR
High-level output current
I I LR
Low-level input current
VOLR
Low-level output voltage
STATUS PINS ( HPD )
VOH (TT L) TTL High–level output voltage
VOL (TT L)
TTL Low–level output voltage
CONTROL PINS (PRE, OEB)
IIH
High–level digital input current
IIL
Low–level digital input current
VOLT - VIL
SELREF = NC
SELREF= GND
SELREF = Vcc
SELREF = NC
SELREF= GND
SELREF = Vcc
V
mV
CONTROL PINS (I2CEN, SELREF,)
IIH
IIL
High–level digital input current
Low–level digital input current
STATUS PINS (HPD_SINK)
II H
High–level digital input current
VIH = 5.5V
VIH = Vcc
10
5
50
30
100
80
uA
uA
II L
Low–level digital input current
VIL = GND
-10
-
10
uA
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© 2009 ROHM Co., Ltd. All rights reserved.
9/17
2009.05 - Rev.D
Technical Note
BU16024KV
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
TMDS DIFFERENTIAL PINS (Y/Z)
Propagation
delay
time
tPLH
low-high-level output
Propagation
delay
time
tPHL
high-low-level output
Differential output signal rise
tr
See Figure5-2, AVCC = 3.3V,
time (20%-80%)
RT = 50Ω, PRE =”H”
Differential output signal fall
tf
time (20%-80%)
tsk(p)
Pulse skew (|tPHL - tPLH |)
Intra-pair differential skew, see
tsk(D)
Figure5-3
DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK)
Propagation delay time,
tpdLHTR
low-to-high-level output Tx to
(DDC)
Rx
RL = 4.7KΩ CL = 100pF
Propagation delay time,
tpdHLTR
high-to-low-level output Tx to
(DDC)
Rx
Propagation delay time,
tpdLHRT
low-to-high-level output Rx to
(DDC)
Tx
RL = 1.67KΩ CL = 400pF
Propagation delay time,
tpdHLRT
high-to-low-level output Rx to
(DDC)
Tx
tr Tx(DDC) Tx output Rise time
RL = 4.7KΩ CL = 100pF
tf Tx(DDC) Tx output Fall time
tr Rx(DDC) Rx output Rise time
CL=10pF
tf Rx(DDC) Rx output Fall time
CIO
Input/output capacitance
STATUS PINS(HPD)
Propagation delay time,
tpdLH(HPD) low-to-high-level output from
HPD_SINK to HPD
Propagation delay time,
tpdHL(HPD) high-to-low-level output from
HPD_SINK to HPD
Switch time from port select to
tsx(HPD)
the latest valid status of HPD
UNIT
MIN.
TYP.(1)
MAX.
-
320
-
ps
-
335
-
ps
-
120
-
ps
-
120
-
ps
-
15
-
ps
-
25
-
ps
-
650
-
ns
-
200
-
ns
-
500
-
ns
-
350
-
ns
-
800
150
950
50
-
ns
ns
ns
ns
VI=0V
15
pF
CL=10pF
-
5
-
ns
CL=10pF
-
5
-
ns
CL=10pF
-
8
-
ns
Note:
All typical values are at 25℃ and with a 3.3V supply.
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© 2009 ROHM Co., Ltd. All rights reserved.
10/17
2009.05 - Rev.D
Technical Note
BU16024KV
●MEASUREMENT SYMBOL AND CIRCUIT
AVCC
RT
RT
Zo = RT
TMDS
Receiver
Zo = RT
TMDS
Driver
Figure 5-1 Termination for TMDS Output Driver
Vcc
R INT
R INT
A
V ID
VA
TMDS
Driver
CL
0.5pF
Z
TMDS
Receiver
B
VB
RT
Y
AV CC
RT
VY
VZ
V ID = V A - V B
V swing = V Y - V Z
DC Coupled
AC Coupled
VA
Vcc V
Vcc+0.2 V
VB
Vcc-0.4 V
Vcc-0.2 V
VID
0.4 V
VIC
VID(pp)
0V
-0.4 V
tPLH
tPLH
80%
Vswing
VOD(O)
VOD(pp)
20%
tf
100%
0V Differential
0%
tr
VOD(U)
VOC
△VOC(SS)
Figure 5-2 Timing Test Circuit and Definitions
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© 2009 ROHM Co., Ltd. All rights reserved.
11/17
2009.05 - Rev.D
Technical Note
BU16024KV
VY
VCH
50%
VZ
VOL
tsk(D)
Figure 5-3 Definition of Intra-Pair Differential Skew
VDD
2
HPD_SINK
VDD
2
HPD
tpdHL(HPD)
tpdLH(HPD)
tpdHLRT(DDC) tpdLHRT(DDC)
SDA_SINK
80%
20%
tpdHLTR(DDC)
tpdLHTR(DDC)
1.5V
V IL
SDA
80%
20%
1.5V
tfTX(DDC)
trTX(DDC)
RX to TX
tfRX(DDC)
trRX(DDC)
TX to RX
Figure 5-4 DDC and HPD Timing Definitions
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© 2009 ROHM Co., Ltd. All rights reserved.
12/17
2009.05 - Rev.D
Technical Note
BU16024KV
1). Y and Z terminal ESD Diode notice.
Y and Z terminals are connected ESD diode.
When VCC+0.4 < AVCC.
BU16024KV flow leak current from AVCC to VCC.
In order to pass the compliance test.
You must use mandatory application, refer Figure 6-1 for “Repeater” or “output Buffer” application.
If you use “Repeater” or “output Buffer”
power down
controler
10kΩ
AVCC
VCC
10kΩ
10kΩ
TEST0
TEST2
TEST1
Figure 6-1 Leak current control
2). HPD_SINK Pull down resistance.
HPD_SINK is a 5V tolerant structure shown in Figure 6-2.
It needs some drive current to pull down HPD_SINK "H" to "L"([email protected]_SINK=2V).
So to pull down HPD_SINK, please use 10kΩ(or under 10kΩ) resistor.
VCC
BU16024KV
HPD_SINK
10kΩ
Figure 6-2 HPD_SINK I/O schematic
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© 2009 ROHM Co., Ltd. All rights reserved.
13/17
2009.05 - Rev.D
Technical Note
BU16024KV
3). About don’t use terminal.
Unused TMDS input channel can be opened.
BU16024KV
Vcc
R INT
R INT
RT
A
TMDS
Receiver
Y
TMDS
Driver
B
AVcc
Z
RT
Figure 6-3 TMDS Input Fail-Safe Recommendation
Unused DDC Buffers of R side polled up to Vdd .
VCC
4.7k
T
RSCL
RSDA
TSCL
TSDA
R
Figure 6-4 DDC Buffers in BU16024KV
Open unused HPDn.
Figure 6-5 Open unused HPDn
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© 2009 ROHM Co., Ltd. All rights reserved.
14/17
2009.05 - Rev.D
Technical Note
BU16024KV
4). About serial connect notice.
When HDMI sw output connect to other HDMI sw input like following application.
There is possibility that. 1080p(12bit) image isn’t displayed. It’s depend on receiver IC characteristic.
When system is required 1080p (12bit), Rohm doesn’t recommend serial connect application.
Vcc
RINT
Vcc
RINT
RINT
RINT
RT
A
TMDS
Receiver
TMDS
Driver
B
Y
A
Z
B
TMDS
Receiver
TMDS
Driver
Y
Z
AVCC
RT
Figure 6-6 serial connect notice
5). AC Coupling capable.
Figure 6-7 AC Coupling capable
6). Offset voltage appearance.
If differential input is opened, offset voltage appear at differential output OE is set to low to avoid it.
Figure 6-8 Offset voltage avoid
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© 2009 ROHM Co., Ltd. All rights reserved.
15/17
2009.05 - Rev.D
Technical Note
BU16024KV
7). Limitation of Master and slave direction.
Figure 6-9 Limitation of Master and slave direction
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© 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.05 - Rev.D
Technical Note
BU16024KV
Ordering part number
B U 1 6 0 2 4
ROHM model name
K V
E 2
Package type
VQFP48C
Packaging and forming specification
E2 =Reel-shaped emboss taping
Package specification
VQFP48C
<Tape and Reel information>
9.0±0.2
7.0±0.1
36
25
Embossed carrier tape
Quantity
1500pcs
0.5±0.15
0.75
48
13
1
1PIN MARK
Direction
of feed
E2
direction is the 1pin of product is at the upper left when you hold
( The
)
reel on the left hand and you pull out the tape on the right hand
+0.05
0.145 -0.03
1.6MAX
0.75
12
1.0±0.2
24
7.0 ± 0.1
9.0 ± 0.2
37
Tape
0.1 ± 0.05
1.4 ± 0.05
4 +6
–4
0.5±0.1
0.08 S
+0.05
0.22 -0.04
0.08
1pin
M
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.05 - Rev.D
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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