ROHM BD1204GWL

LED Drivers for LCD Backlights
Backlight LED Driver
for Small LCD Panels (Charge Pump Type)
BD1204GWL
No.10040EAT07
●Description
BD1204GWL is 3ch or 4ch parallel LED driver for the portable instruments.
This IC is equipped with an automatic transition charge pump and 16-step LED drivers. Hence this IC realizes high efficiency
and high accuracy drive of LEDs. Additionally, this IC can synchronize LED drive with external PWM signal. This IC is best
suited to turn on white LEDs that require high-accuracy LED brightness control.
●Features
1) 3ch or 4ch parallel LED driver is mounted
2) 16-step LED current adjust function
3) LED current matching is 5: 5% or less
4) Driving control via a single-line digital control interface
5) Automatic transition charge pump type DC/DC converter (×1, ×1.5, ×2)
6) High efficiency achieved (Maximum over 93%)
7) It transits for the most suitable power operating by the LED terminal processof the 4th light when 3 light driving
8) Various protection functions such as output voltage protection and thermal shutdown circuit are mounted.
9) The input external PWM is possible and the back light control interlocked with the motion picture is possible.
10) Package: UCSP50L1 (Thick 0.55mm MAX, Pin pitch 0.4mm) CSP14pin package
●Absolute maximum ratings (Ta=25℃)
Parameter
Power supply voltage
Input voltage ( EN , PWMIN )
Power dissipation
Symbol
Ratings
Unit
VMAX
7
V
Vdin
GND-0.3 ~ VBAT+0.3
V
Pd
840
mW
Operating temperature range
Topr
-30 ~ +85
℃
Storage temperature range
Tstg
-55 ~ +150
℃
Note 1) The measurement value which was mounted on the PCB by ROHM.
When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted, this loss will decrease 6.72mW/℃
if Ta is higher than or equal to 25℃.
●Operating Conditions (Ta = -30 ~ 85 ℃)
Parameter
Operating power supply voltage
Symbol
Limits
Unit
VBAT
2.7 ~ 5.5
V
*This chip is not designed to protect itself against radioactive rays.
*This material may be changed on its way to designing.
*This material is not the official specification.
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1/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Electrical Characteristics (Unless otherwise noted, Ta = +25oC, VBAT=3.6V)
Parameter
Symbol
Limits
Units
Conditions
Min.
Typ.
Max.
Iq
-
0.1
1
μA
Current Consumption1
Idd1
-
41.3
42.5
mA
Current Consumption2
Idd2
-
82.6
83.9
mA
fOSC
0.56
0.85
1.14
MHz
LED maximum current
ILED-max
18
20
22
mA
LED current accuracy
ILED-diff
-
-
10.0
%
LED current matching
ILED-match
-
0.5
5.0
%
VLED
-
0.15
0.25
V
Minimum voltage from LED1 to LED4 pins
Low threshold voltage
VIL
-
-
0.4
V
EN , PWMIN
High threshold voltage
VIH
1.4
-
-
V
EN , PWMIN
High level Input current
IIH
-
0
1
μA
EN = VBAT, PWMIN = VBAT
Low level Input current
IIL
-1
0
-
μA
EN = 0V, PWMIN = 0V
Minimum EN High time
THI
0.05
-
100
μs
Described in Fig.5
Minimum EN Low time
TLO
0.3
-
100
μs
Described in Fig.5
EN Off Timeout
TOFF
1
-
-
ms
Described in Fig.5
Latch time
TLAT
1
-
-
ms
Described in Fig.5
Access available time
Tacc
1
-
5
ms
Described in Fig.5
Current Consumption
Quiescent Current
EN=0V
x 1.0 Mode
Include LED current (40mA)
x 2.0 Mode
Include LED current (40mA)
Charge Pump
Oscillator frequency
Current Source
LED control voltage
VBAT≥3.0V
LED current setting is 10.0mA,
LED terminal voltage is 1.0V
LED current setting is 10.0mA,
LED terminal voltage is 1.0V
Logic control terminal
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2/12
2010.02 - Rev.A
Technical Note
BD1204GWL
C2P
C2N
C1P
C1N
●Block Diagram
×1, ×1.5, ×2
Charge pump
VBAT
VOUT
Over Voltage
Protect
Charge Pump
Mode Control
EN
PWMIN
OSC
Enable/
Brightness
Control
Vout Control
TSD
LED1
LED2
LED3
4
LED4
LED4 DET
Current
DAC
ISET
GND
Pin number 14pin
Fig. 1 Block Diagram
●Pin Configuration
[Bottom View]
D
LED2
LED1
C
LED3
EN
VBAT
C1N
C1P
index
B
LED4
A
GND
1
PWMIN
C2P
ISET
VOUT
C2N
2
3
4
Fig. 2 Pin Configuration
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3/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Package Outline
Lot No.
1.85±0.05
1PIN MARK
1204
0.55MAX
0.1±0.05
1.85±0.05
S
S
0.325±0.05
0.06
14-φ0.2±0.05
A
0.05 A B
(φ0.15)INDEX POST
B
C
B
P=0.4×3
D
A
1
0.325±0.05
2
3
4
P=0.4×3
(Unit: mm)
Fig. 3 Package Dimension
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4/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Pin Descriptions
Terminal
Pin No.
No.
Pin Name
In/Out
Type
Function
VBAT
-
A
Power supply
1
D3
2
C4
C1P
In/Out
A
Flying capacitor pin positive (+) side
3
D4
C1N
In/Out
B
Flying capacitor pin negative (-) side
4
B4
C2P
In/Out
A
Flying capacitor pin positive (+) side
5
A4
C2N
In/Out
B
Flying capacitor pin negative (-) side
6
A3
VOUT
Out
A
Charge pump output
7
C2
EN
In
C
ON/OFF and dimming control
8
D2
LED1
Out
A
LED current driver output 1
9
D1
LED2
Out
A
LED current driver output 2
10
C1
LED3
Out
A
LED current driver output 3
11
B1
LED4
Out
A
LED current driver output 4
12
B3
PWMIN
In
C
PWM Control
13
A1
GND
-
D
GND
14
A2
ISET
Out
B
LED standard current
●Pin ESD Type
Type B
Type A
VBAT
Type C
VBAT
PAD
PAD
PAD
GND
GND
GND
Type D
VBAT
PAD
Fig. 4 Pin ESD Type
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5/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Separate Function Description
(1) LED driver
a) Register access control protocol
LED current is controlled by only EN terminal. It is possible to access the register inside of this chip by using the
protocol below. Accessing the registers with using this protocol operates LED driver ON/OFF and selecting the mode.
Moreover, MAX current can be outputted without Clock input to EN terminal by holding H zone of fixed time after EN
terminal starting.
< When setting current level >
T LAT
THI
Tacc
T pulse
EN
1
T OFF
TLO
n-1
2
LED Current Setting
n
(N? 16)
0
0
n
(Notes) TaccMIN < Tpulse < TaccMAX Please input a pulse on this condition
< When starting by MAX setup >
T accMAX
T OFF
EN
LED Current Setting
1
0
0
Fig.5 Register access protocol
Tacc
TLAT
TLAT
TLAT
TLAT
EN
16pulse
15pulse
14pulse
13pulse
1mA
0.5mA
LED Current
OFF
0.125mA
0.25mA
Fig.6 Slope control example
( Note )
・In the case of N > 16, BD1204GWL selects the mode of N = 16.
・LED current is changed by the pulse of EN pin.
Be careful to noise of EN signal.
・Reset BD1204GWL when the set is unusual. (Keep EN=L over Toff time.)
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2010.02 - Rev.A
Technical Note
BD1204GWL
b) LED current level
The interface records rising edges of the EN pin and decodes them into 16 different indicated in following table.
Data
Output current [mA]
Data
Output current [mA]
1
20.0
9
5.0
2
17.0
10
4.0
3
14.0
11
3.0
4
12.0
12
2.0
5
10.0
13
1.0
6
8.5
14
0.5
7
7.0
15
0.25
8
6.0
16
0.125
(RISET=120 kΩ)
Moreover, LED current can be set up with the resistance RISET connected to ISET terminal,
and the maximum current is decided by the following formula.
ILEDmax [A] = 2.4/ RISET [kΩ] (Typ)
(2) Charge pump
a) Description of operations
Pin voltage comparison takes place at Vout control section, and then Vout generation takes place so that the LED
cathode voltage with the highest Vf is set to 0.15V. A boost rate is changed automatically to a proper one at the
Charge Pump Mode Control section so that operation can take place at possible low boost rate. In addition, when the
VOUT output is short-circuited to GND, the leak current is suppressed via the overcurrent protection function.
b) Soft start function
BD1204GWL have a soft start function that prevents the rush current.
TOFF
EN/LED*
VOUT
ILED
Soft Start
Ordinal mode
* EN/LED is an internal enable
Fig.7 Soft Start
c) Automatic boost rate change
The boost rate automatically switches to the best mode.
* (×1 mode  ×1.5 mode) or (×1.5 mode  ×2 mode)
If a battery voltage drop occurs BD1204GWL cannot maintain the LED constant current, and then mode transition
begins.
* (×1.5 mode  ×1 mode) or (×2 mode  ×1.5 mode)
If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins.
(3) UVLO (Under Voltage Lock Out)
If the input voltage falls below 2.2V(Typ.), BD1204GWL is shut down to prevent malfunction due to ultra-low voltage.
(4) OVP (Over Voltage Protection)
This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external
factors.
(5) Thermal shutdown (TSD)
To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the
chip temperature rises over 175ºC. In addition, it turns on the output if the temperature returns to the normal
temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown
detection temperature must be set to below 175ºC in thermal design.
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2010.02 - Rev.A
Technical Note
BD1204GWL
(6) Power sequence
EN signal must be released after VBAT voltage enough rise up.
Prohibit the VBAT rise up during EN=”H”.
VBAT
EN
Fig.8
Power sequence
(7) PWM control
PWM control by the external terminal (PWMIN) is possible.
It becomes PWM operation that used LED current by a register setup as the base and is the best for the brightness
compensation by external control. If the application with is not use PWM, PWMIN pin must be short to VBAT.
E N /L E D *
In te rn a l S o ft-S ta rt T im e
VOUT
N o n -P W M
P W M IN in p u t
PWMIN
L E D C u rre n t
P W M IN in p u t
LED Current
L
Compulsion OFF
H
Normal operation
L E D C u rre n t
Fig.9 External PWM input solution
It is possible to make it a PWMIN input before EN/LED* is “H”.
A PWM drive becomes effective after the time of LED current standup.
When rising during PWM operation, as for the standup time of VOUT, only the rate of PWM Duty becomes late.
Appearance may be influenced when extremely late frequency and extremely low Duty are inputted.
Please secure over 120 μs “H” sections at the time of PWM pulse Force.
EN/LED* is an internal enable signal
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8/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Application Circuit Example (4 light with PWM)
C2=1μF
C2P
C1N
C1P
C2N
C1=1μF
Battery
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
VOUT
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
From
CPU
PWMIN
OSC
Enable/
Brightness
Control
Vout Control
LED1
TSD
From
LCM
LED2
LED3
LED4
LED4 DET
4
Current
DAC
ISET
120kΩ
GND
Fig.10 Application Circuit Example 1
●Application Circuit Example (3 light with PWM)
C2=1μF
C2P
C1P
C2N
C1N
C1=1μF
Battery
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
VOUT
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
From
CPU
PWMIN
OSC
Enable/
Brightness
Control
From
LCM
Vout Control
LED1
TSD
LED2
LED3
4
LED4 DET
Current
DAC
LED4
ISET
120kΩ
GND
Fig.11 Application Circuit Example 2
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9/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Application Circuit Example (4 light without PWM)
C2=1μF
C2P
C1P
C2N
C1N
C1=1μF
Battery
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
VOUT
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
From
CPU
Battery
OSC
Enable/
Brightness
Control
Vout Control
LED1
TSD
PWMIN
LED2
LED3
LED4 DET
4
Current
DAC
LED4
ISET
120kΩ
GND
Fig.12 Application Circuit Example 3
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10/12
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Technical Note
BD1204GWL
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and ground lines.
Especially, when there are ground pattern for small signal and ground pattern for large current included the external
circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between
the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric
transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin
and the power supply or the ground pin, the ICs can break down.
(5)Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6)Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower
than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input
pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to
the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8)Thermal shutdown circuit
This LSI builds in a thermal shutdown circuit. When junction temperatures become detection temperature or higher, the
thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the
LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)in
actual states of use.
(10) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a
function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our
company person in charge.
(11) About the rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of ground wiring, and routing of wiring.
(12) About this document
This document is the design materials to design a set. So, the contents of the materials aren't always guaranteed. Please
design application by having fully examination and evaluation include the external elements.
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11/12
2010.02 - Rev.A
Technical Note
BD1204GWL
●Ordering part number
B
D
1
Part No.
2
0
4
Part No.
G
W
L
-
Package
GWL:UCSP50L1
E
2
Packaging and forming specification
E2: Embossed tape and reel
UCSP50L1(BD1204GWL)
<Tape and Reel information>
0.06 S
0.05 A B
A
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
D
B
C
B
P=0.4×3
(φ0.15)INDEX POST
0.55MAX
1.85±0.05
14- φ 0.2±0.05
Tape
0.325±0.05
1.85±0.05
0.1±0.05
1PIN MARK
A
0.325±0.05
1
2
3
1pin
4
P=0.4×3
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(Unit : mm)
Reel
12/12
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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R1010A