ZSSC3026 Low Power 16 Bit Sensor Signal Conditioner IC Brief Description Benefits The ZSSC3026 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high resolution altimeter module applications, the ZSSC3026 can st nd perform offset, span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. • The measured and corrected bridge values are provided at the digital output pins, which can be 2 configured as I C* (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory. Programming the ZSSC3026 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The digital mating is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines. Features • • • • • • • • * Flexible, programmable analog front-end design; up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC) Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) Internal auto-compensated temperature sensor Digital compensation of individual sensor offset; st nd 1 and 2 order digital compensation of sensor gain st nd Digital compensation of 1 and 2 order temperature gain and offset drift Intelligent power management unit Layout customized for die-die bonding with sensor for high-density chip-on-board assembly Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 110°C • • • • • Integrated 18-bit calibration math DSP Fully corrected signal at digital output Minimize calibration costs through the one-pass calibration concept No external trimming components required Highly integrated CMOS design Excellent for low-voltage and low-power battery applications Physical Characteristics • • • • • • • Supply voltage range: 1.8 to 3.6V Current consumption: 1mA (operating mode) Sleep State current: 50nA (typical) Temperature resolution: <0.003K/LSB Operation temperatures: –40°C to +85°C –40°C to +110°C Small die size: 1.5mm² Delivery options: die for wafer bonding, bumped die for Flip Chip, PQFN24 Typical Applications The ZSSC3026 is designed for operation in calibrated resistive (pressure) sensor modules: • • • • • • Barometric altitude measurement for portable navigation Altitude measurement for emergency call systems Altitude measurement for car navigation Inside hard disk pressure measurement Weather forecast Fan control ZSSC3026 Application Example. 2 I C is a registered trademark of NXP. © 2012 ZMD AG — Rev. 1.02 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to changes without notice. ZSSC3026 Low Power 16 Bit Sensor Signal Conditioner IC ZSSC3026 Block Diagram Ordering Information Ordering Examples * Description Package ZSSC3026CC1B Temperature range: –40°C to +85 °C, Consumer-Level: Parameter according Data Sheet Chips, Wafer (304um) unsawn, tested ZSSC3026CI1B Temperature range: –40°C to +85 °C, Industrial-Level: 10 years MTP-Data Retention Chips, Wafer (304um) unsawn, tested ZSSC3026CI4 Temperature range: –40°C to +110 °C, Industrial PQFN24 4x4, tested ZSSC30x6KIT Evaluation Kit for ZSSC30x6 Product Family Boards, cable, software-CD, 1 sample * Please contact ZMDI Sales for additional options. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Zentrum Mikroelektronik Dresden AG, Japan Office ZMD FAR EAST, Ltd. ZMD America, Inc. Grenzstrasse 28 01109 Dresden Germany 8413 Excelsior Drive Suite 200 Madison, WI 53717 USA Phone Fax Phone Fax +49 (0)351.8822.7.772 +49 (0)351.8822.87.772 +1 (608) 829-1987 +1 (631) 549-2882 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan Phone Fax +81.3.6895.7410 +81.3.6895.7301 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone Fax +886.2.2377.8189 +886.2.2377.8199 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are PRELIMINARY and subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise © 2012 ZMD AG — Rev. 1.02 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.