ZSSC3027 Low-Power 16-Bit Sensor Signal Conditioner IC Brief Description Benefits The ZSSC3027 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3027 can perform offset, st nd span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be 2 configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3027 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3027 provides accelerated signal processing in order to support high-speed control, safety, and real-time sensing applications. It complements ZMDI’s ZSSC30x6 products. Integrated 18-bit calibration math DSP Fully corrected signal at digital output One-pass calibration minimizes calibration costs No external trimming, filter, or buffering components required Highly integrated CMOS design Excellent for low-voltage and low-power battery applications Optimized for operation in calibrated resistive sensor modules Physical Characteristics Supply voltage range: 1.7 to 3.6V Operating mode current consumption: 930µA (typical) Sleep State current: 20nA (typical) Temperature resolution: <0.003K/LSB Operation temperatures: –40°C to +85°C Small die size Delivery options: die for wafer bonding Available Support ZSSC3026 Evaluation Kit can be used to evaluate ZSSC3027 capabilities Support Documentation ZSSC3027 Application Example Features Flexible, programmable analog front-end design; up to 16-bit scalable, charge-balancing twosegment analog-to-digital converter (ADC) Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) Internal auto-compensated temperature sensor Digital compensation of individual sensor offset; st nd 1 and 2 order digital compensation of sensor st nd gain as well as of 1 and 2 order temperature gain and offset drift Layout optimized for stacked-die bonding for high-density chip-on-board assembly Typical sensor elements can achieve accuracy of better than ±0.10% FSO** @ -40 to 85°C * I2C™ is a trademark of NXP. ** FSO = Full Scale Output. For more information, contact ZMDI via [email protected] © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01— August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3027 Low-Power 16-Bit Sensor Signal Conditioner IC ZSSC3027 Block Diagram VDDB Vreg int VTP VTN Temperature Reference Sensor VDD AGND / CM Generator Bias Current Generator Power Ctr. Voltage Regulator VSS Sensor Bridge Multiplexer ZSSC3027 INP INN A PreAmplifier D 18-bit DSP Core (Calculations, Communication) 16 Bit VSSB SPI Applications Barometric altitude measurement for portable navigation or emergency call systems Altitude measurement for car navigation Inside hard disk pressure measurement Weather forecast Fan control Industrial, pneumatic, and liquid pressure High-resolution temperature measurements Power-ON Reset Clock Generator Ring Oscillator EOC System Control Unit MTP ROM I²CTM SCLK/SCL SS MOSI/SDA MISO SEL Ordering Information (See section 6 in the data sheet for additional options for delivery) Sales Code Description Delivery Package ZSSC3027AC1B Die—temperature range: –40°C to +85 °C Wafer (304µm) unsawn, tested ZSSC3027AC6B Die—temperature range: –40°C to +85 °C Wafer (725µm) unsawn, tested ZSSC3027AC7C Die—temperature range: –40°C to +85°C Wafer (200µm) unsawn, tested ZSSC3027AI1D Engineering samples, die—temperature range: –40°C to +85°C Dice in waffle pack (304µm) ZSSC3026-KIT Evaluation Kit for ZSSC3026, including boards, cable, software, and 1 ZSSC3026 PQFN24 sample (equivalent to ZSSC3027—kit is recommended for evaluation of the capabilities of the ZSSC3027) Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building 11th Floor, Unit JA-1102 670 Sampyeong-dong Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01—August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.