Data Sheet

ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
Brief Description
Benefits
The ZSSC3027 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3027 can perform offset,
st
nd
span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
2
configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Programming the ZSSC3027 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory.
The ZSSC3027 provides accelerated signal processing in order to support high-speed control, safety,
and real-time sensing applications. It complements
ZMDI’s ZSSC30x6 products.
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Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
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Supply voltage range: 1.7 to 3.6V
Operating mode current consumption:
930µA (typical)
Sleep State current: 20nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding
Available Support
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ZSSC3026 Evaluation Kit can be used to
evaluate ZSSC3027 capabilities
Support Documentation
ZSSC3027 Application Example
Features
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Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing twosegment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
st
nd
1 and 2 order digital compensation of sensor
st
nd
gain as well as of 1 and 2 order temperature
gain and offset drift
Layout optimized for stacked-die bonding for
high-density chip-on-board assembly
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO** @ -40 to 85°C
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
For more information, contact ZMDI via [email protected]
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01— August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
ZSSC3027
Low-Power 16-Bit Sensor Signal Conditioner IC
ZSSC3027
Block Diagram
VDDB
Vreg int
VTP
VTN
Temperature
Reference
Sensor
VDD
AGND / CM
Generator
Bias Current
Generator
Power Ctr.
Voltage
Regulator
VSS
Sensor
Bridge
Multiplexer
ZSSC3027
INP
INN
A
PreAmplifier
D
18-bit DSP Core
(Calculations,
Communication)
16 Bit
VSSB
SPI
Applications
 Barometric altitude measurement for
portable navigation or emergency call
systems
 Altitude measurement for car navigation
 Inside hard disk pressure measurement
 Weather forecast
 Fan control
 Industrial, pneumatic, and liquid pressure
 High-resolution temperature measurements
Power-ON
Reset
Clock
Generator
Ring
Oscillator
EOC
System
Control
Unit
MTP
ROM
I²CTM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
Ordering Information (See section 6 in the data sheet for additional options for delivery)
Sales Code
Description
Delivery Package
ZSSC3027AC1B
Die—temperature range: –40°C to +85 °C
Wafer (304µm) unsawn, tested
ZSSC3027AC6B
Die—temperature range: –40°C to +85 °C
Wafer (725µm) unsawn, tested
ZSSC3027AC7C
Die—temperature range: –40°C to +85°C
Wafer (200µm) unsawn, tested
ZSSC3027AI1D
Engineering samples, die—temperature range: –40°C to +85°C
Dice in waffle pack (304µm)
ZSSC3026-KIT
Evaluation Kit for ZSSC3026, including boards, cable, software, and 1 ZSSC3026 PQFN24 sample
(equivalent to ZSSC3027—kit is recommended for evaluation of the capabilities of the ZSSC3027)
Sales and Further Information
www.zmdi.com
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
11th Floor, Unit JA-1102
670 Sampyeong-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.01—August 24, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner.