Kit Description & Design Guidelines Rev. 1.00 / May 2015 ZAMC4100 Application Kit V1.0 For the ZAMC4100 Actuator and Motor Controller IC Automotive ASICs and Industrial ASSPs Multi-Functional and Robust ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines Important Notes Restrictions in Use ZMDI’s ZAMC4100 Application Board is designed for ZAMC4100 evaluation under application specific environmenta conditions, e.g. thermal performance. ZMDI’s Application Kit must not be used for module production or production test setups. Disclaimer Zentrum Mikroelektronik Dresden AG (ZMD AG) shall not be liable for any damages arising out of defects resulting from (i) delivered hardware (ii) non-observance of instructions contained in this manual and in any other documentation provided to user, or (iii) misuse, abuse, use under abnormal conditions, or alteration by anyone other than ZMD AG. To the extent permitted by law, ZMD AG hereby expressly disclaims and user expressly waives any and all warranties, whether express, implied, or statutory, including, without limitation, implied warranties of merchantability and of fitness for a particular purpose, statutory warranty of non-infringement, and any other warranty that may arise by reason of usage of trade, custom, or course of dealing. Contents 1 Introduction ....................................................................................................................................................... 4 1.1. Contents of Kit ........................................................................................................................................... 4 1.2. ZAMC4100 Application Board ................................................................................................................... 4 1.3. Pin and Signal Description ........................................................................................................................ 5 2 Hardware Description ....................................................................................................................................... 7 2.1. Power Supply............................................................................................................................................. 7 2.2. Local Interconnect Network (LIN) .............................................................................................................. 7 2.3. Position Sensing ........................................................................................................................................ 8 2.4. External Temperature Measurement ......................................................................................................... 8 2.5. High-Side Drives (HS1-HS4), ECM ........................................................................................................... 9 2.6. Half-Bridge Drives (HB1-HB4) ................................................................................................................... 9 2.7. JTAG Connector (J1) ............................................................................................................................... 10 2.8. General Purpose Input / Outputs (GPIO 0 to 7) ...................................................................................... 10 3 Application Design Guidelines........................................................................................................................ 11 4 Related Documents ........................................................................................................................................ 14 5 Glossary ......................................................................................................................................................... 15 6 Document Revision History ............................................................................................................................ 15 Appendix A: Schematic ......................................................................................................................................... 16 Appendix B: Bill of Materials .................................................................................................................................. 17 Appendix C: PCB Layout ....................................................................................................................................... 18 Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 2 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines List of Figures Figure 1.1 Figure 2.1 Figure 2.2 Figure 2.3 Figure 2.4 Figure 2.5 Figure 2.6 Figure 2.7 Figure 2.8 Figure 3.1 Figure 3.2 Figure 3.3 Figure 3.4 Figure 3.5 Figure 3.6 ZAMC4100 Application Board ............................................................................................................ 4 ZAMC4100 Application Kit – Power Supply ....................................................................................... 7 ZAMC4100 Application Kit – LIN ........................................................................................................ 7 Application Kit – Position Sense ......................................................................................................... 8 ZAMC4100 Application Kit – Analog Inputs ........................................................................................ 8 ZAMC4100 Application Kit – High-Side Drivers ................................................................................. 9 ZAMC4100 Application Kit – Half-Bridge Drivers ............................................................................... 9 ZAMC4100 Application Kit – JTAG Interface ................................................................................... 10 ZAMC4100 Application Kit – JPIOs .................................................................................................. 10 ZAMC4100 Application Kit – PCB Structure ..................................................................................... 11 Motor Driver Position ........................................................................................................................ 12 Signal Vias Placement ...................................................................................................................... 12 Component Package and Recommended Footprint ........................................................................ 13 Multi-via Connections ....................................................................................................................... 13 Local Heat-Sinks ............................................................................................................................... 14 List of Tables Table 1.1 Table 6.1 Component Description ...................................................................................................................... 5 Bill of Materials.................................................................................................................................. 17 For more information, contact ZMDI via [email protected]. Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 3 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 1 Introduction This document describes the use of the ZAMC4100 Application Kit. 1.1. Contents of Kit The kit consists of one part: the ZAMC4100 Application Board. 1.2. ZAMC4100 Application Board The enclosed ZAMC4100 Application Kit is designed for evaluation of the ZAMC4100 Actuator and Motor Controller’s performance under conditions typical for the intended application. It can be used for quick user prototyping, thermal performance evaluation under environmental stress, EMC components selection, etc. Note: The on-board ZAMC4100 device is unprogrammed. Figure 1.1 ZAMC4100 Application Board Power Supply & Driver Outputs LIN Test & Debug Analog Inputs Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 1.3. Pin and Signal Description See the schematic in Appendix A and Figure 1.1 for the connection points and signals given in Table 1.1. Table 1.1 Component Description Connector/ Test Point Signal(s) J1 JTAG Interface for MCU firmware download J2 VBAT Power supply input J3 GND Power ground. All signals are referenced to this voltage J4 EC_M Electrochromatic glass driver output J5 LIN Local Interconnect Network (LIN) J6 HS1 High-side driver output 1 J7 HS2 High-side driver output 2 J8 HS3 High-side driver output 3 J9 HS4 High-side driver output 4 J10 AIN3 General purpose ADC input J11 GPIOs General purpose logical I/Os J12 AIN4 General purpose ADC input J13 AGND J14 HB1 Half-bridge driver output 1 J15 HB2 Half-bridge driver output 2 J16 HB3 Half-bridge driver output 3 J17 HB4 Half-bridge driver output 4 J18 S_P Positive power supply for external position sensors J19 AIN1 Analog input for external position sensor 1 J20 AIN2 Analog input for external position sensor 2 J21 S_N Negative power supply for external position sensors JP1 3.3V Connects the internal ZAMC4100 3.3V regulator output to JTAG connector JP2 TEST Connect TEST pin to GND when not used; mandatory for normal operation JP3 TRSTN Connect TRSTN pin to GND when not used for enhanced EMC robustness JP4 TCK Kit Description May 11, 2015 Function Reference signal ground for off-board analog sensors Connect TCK pin to GND when not used for enhanced EMC robustness © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines Connector/ Test Point Signal(s) JP5 TMS If TMS pin is not used, connect it to GND for enhanced EMC robustness JP6 AIN3 If AIN3 pin is not used, connect it to GND for enhanced EMC robustness JP7 AIN4 Enables the on-board temperature sensor JP8 S_N Connects the negative reference ADC input to GND in ratiometric mode TP1 STO Used for debugging; in NORMAL Mode this is the internal ZAMC4100 poweron reset (POR) signal TP2 TEST Used for debugging TP3 VSSA Sense ground reference point for analog input signals X1 to X8 GPIO0 to 7 Kit Description May 11, 2015 Function If not used, connect GPIOs to GND; if used, add pull-down resistors or filtering capacitors here © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 2 2.1. Hardware Description Power Supply Reverse polarity protection is provided by the Q1 P MOSFET with low ON-resistance and a low driving voltage (see Figure 2.1). PS_VDDE is the supply for the output drivers. VDDE supplies the remaining circuits in the ZAMC4100 (microcontroller, communication, ADC, etc.). The values of R2 and C8 in the snubber circuit are typical, and might differ from one application to another. Figure 2.1 ZAMC4100 Application Kit – Power Supply 2.2. Local Interconnect Network (LIN) The kit’s LIN interface allows bidirectional communication with the ZAMC4100. * The value shown in Figure 2.2 for C10 is the maximum value specified by the LIN 2.2/SAE J2602-2 standard. The actual value is application-specific since the LIN bus capacitance depends on cable length and number of LIN nodes. Figure 2.2 ZAMC4100 Application Kit – LIN Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 7 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 2.3. Position Sensing The ZAMC4100 controller provides power supplies (S_P and S_N) for external potentiometers. They are used for sensing the mirror position signals: AIN1 and AIN2. Test point TP3 is a reference ground point. Figure 2.3 Application Kit – Position Sense 2.4. External Temperature Measurement Analog inputs AIN3 and AIN4 allow connections to external sensors. The onboard temperature sensor Q2 can be connected to AIN4 if JP7 is closed. If AIN3 is not used, use a jumper on JP6 to ground the AIN3 pin to improve EMC. TP3 is a reference ground point. Figure 2.4 ZAMC4100 Application Kit – Analog Inputs Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 2.5. High-Side Drives (HS1-HS4), ECM There are four high-side drivers that allow control of external loads. Contemporary vehicle-side mirror modules offer features that can be managed with these drivers, including heater (anti-fog feature), paddle lamps, blind-spot indication, and electrochromatic (ECM) glass. Figure 2.5 ZAMC4100 Application Kit – High-Side Drivers 2.6. Half-Bridge Drives (HB1-HB4) Four half-bridge drivers allow control of three DC motors typically used for control of X / Y position and folding/ unfolding of a mirror. Figure 2.6 ZAMC4100 Application Kit – Half-Bridge Drivers Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 2.7. JTAG Connector (J1) The ZAMC4100 offers a JTAG interface for programming and debugging. All the JTAG signals have weak pull-up resistors on board (100kΩ). The pin descriptions for the dedicated connector (J1) and signal explanations are given in Figure 2.7. Figure 2.7 ZAMC4100 Application Kit – JTAG Interface 2.8. Pin № Signal 1 TRST N Test Reset 2 TCK Test Clock 3 3V3 3.3V Supply Voltage (optional if JP1 is ON) 4 TMS Test Mode Select 5 TDI Test Data In 6 TDO Test Data Out 7, 8 GND Ground Function General Purpose Input / Outputs (GPIO 0 to 7) The ZAMC4100 has eight general-purpose input/outputs, which are accessible on J11. X1 to X8 are provisional footprints, which can be used to fit external components depending on the application. Figure 2.8 ZAMC4100 Application Kit – JPIOs Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 10 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 3 Application Design Guidelines This chapter provides recommended design rules for PCB layout in order to achieve optimal performance. Layout design should ensure the following: Low noise analog input signals (position sensor, temperature sensor, etc.) Low-ohm tracks for the high current drivers Heat dissipation for the power components Electromagnetic compatibility (EMC) Compact design These requirements are fulfilled by using a four-layer PCB structure as shown in Figure 3.1. Figure 3.1 ZAMC4100 Application Kit – PCB Structure Via ZAMC4100 Top Heatsink Copper Layers Inner 1 Isolation Inner 2 Bottom Heat Path The main layer functions are the following: Top: components, power supply traces, local heat-sinks Inner 1: heat sink, electrical shield between signal traces Inner 2: signal layer, heat sink Bottom: heat sink, electrical shield Electroless nickel immersion gold (ENIG) finish is recommended for the bottom layer and no solder mask. Each copper layer should be at least 2oz (70µm) thick. Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines When designing a motor driver application board, the following rules are recommended: 1. The main power is dissipated by the ZAMC4100. It should be placed in the center of the PCB as shown in Figure 3.2. Figure 3.2 Motor Driver Position Motor Driver 2. Signal vias can block temperature dissipation in all layers if improperly placed and close to each other. Heat dissipation should be from the motor driver to the board periphery as shown in Figure 3.3. Figure 3.3 Signal Vias Placement Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 12 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 3. Power dissipated in QFN package should be led away through the thermal pad. The footprint should contain a pad with vias grid as shown in Figure 3.5. Figure 3.4 Component Package and Recommended Footprint 4. Avoid layer changes for power supply tracks (i.e., route on top layer only). 5. When a high current track switches to an internal layer, its width should be doubled. This will compensate for the temperature increase of the tracks due to power dissipation. 6. Vias increase the line resistance and impedance. Use a multi-via if a track layer is changed. Use high-current traces for the drivers, which keeps the line resistance low Use bypass capacitors, which keeps the equivalent impedance low Figure 3.5 Multi-via Connections 7. Place stitching vias with a direct connection to copper pours (no thermal relief) in order to achieve Level ground potentials, which prevents current ground loops on the board Level PCB temperature among different layers Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 13 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 8. Use PCB copper areas as local heat sinks for components where needed. Components' pads should have a direct connection to the copper pour (no thermal relief) to retain high temperature conductance, as shown in Figure 3.6. Figure 3.6 Local Heat-Sinks 9. Using thin input and sense signals tracks is recommended for low capacitance and better EMI immunity. However, due to the double copper layer thickness (70µm) keep these tracks at least 0.2mm (8 mil) wide. 10. The bypass capacitors should be placed as close to the ZAMC4100 as possible. This improves the board EMC. 11. Connectors should be placed at the board periphery. 12. Through-hole pads for soldering wires should be used. This improves both electrical and mechanical connections. 13. Multi-layer ceramic capacitors X7R and COG/NPO are recommended. 4 Related Documents Note: X_xy refers to the latest version of the document. Document File Name ZAMC4100 Actuator and Motor Controller Data Sheet ZAMC4100_Data_Sheet_RevX_xy.pdf ZAMC4100 Evaluation Kit Description ZAMC4100_Evaluation_Kit_Description_revX_xy.pdf Visit the ZAMC4100 product page www.zmdi.com/zamc4100 on ZMDI’s website www.zmdi.com or contact your nearest sales office for the latest version of these documents. Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 14 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines 5 Glossary Term Description ASIC Application Specific Integrated Circuit ASSP Application Specific Standard Product LIN Local Interconnect Network ECM Electrochromatic Mirror EMC Electromagnetic Compatibility EMI Electromagnetic Interference ENIG Electroless Nickel Immersion Gold PCB Printed Circuit Board 6 Document Revision History Revision Date Description 1.00 May 11, 2015 First release of document. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Kit Description May 11, 2015 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 15 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines Appendix A: Schematic Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 16 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines Appendix B: Bill of Materials Table 6.1 Bill of Materials № Designator 1 C1, C25, C28 2 Package Manufacturer Cap 100nF 50V X7R 0603 Multicomp MC0603B104K500CT 3 C2, C3 Cap 4.7µF 50V X7R 1206 Multicomp MC1206B475K500CT 2 3 C4, C7, C19, C20, C26, C27 Cap 10nF 50V X7R 0603 Vishay VJ0603Y103KXASW1BC 6 4 C5, C6 Cap 68nF 50V X7R 0603 TDK CGA3E2X7R1H683K080AA 2 5 C8 Cap 330nF 50V X7R 0805 TDK C2012X7R1H334K125AA 1 C9, C11, C12, Cap 4.7nF 50V X7R C13, C14, C15, C16, C17, C18 0603 Multicomp MC0603B472K500CT 9 Cap 220pF 100V COG 0603 Multicomp MC0603N221J100CT 1 6 Component Description Part Number Quantity 7 C10 8 C21, C22, C23 Cap 47nF 50V X7R 0603 TDK CGA3E2X7R1H473K080AA 3 9 C24 Cap 220nF 50V X7R 0603 TDK C1608X7R1H224K080AB 1 10 D1 Sch Diode 30V 200mA SOD-123 NXP BAT54H,115 1 11 D2 TVS LIN 12 J1 Header Male 2x4 RA Gold 13 L1 14 SOT-23 ON NUP1105LT1G Semiconductor TH 1.27mm FCI Ferrite Bead 800R 8A 2220 Laird Technologies L2 Ferrite Bead 600R 200mA 0603 Murata 15 Q1 N MOSFET 40V 20A [email protected] Power 33 16 Q2 NPN 40V 200mA 17 R1 18 1 20021122-0000D1LF 1 HR2220V801R-10 1 BLM18BD601SN1D 1 Fairchild FDMC8462 1 SOT-23 NXP MMBT3904 1 Res 4.7R 1% 250mW 1206 WELWYN ASC1206-4R7FT5 1 R2 Res 10R 1% 125mW 0805 WELWYN ASC0805-10RFT5 1 19 R3 Res 2.2M 1% 50V 0603 WELWYN ASC0603-2M2FT5 1 20 R4 Res 47R 1% 1W 2512 WELWYN ASC2512-47RFT4 1 21 R5 Res 100k 1% 0603 Yageo RC0603FR-13100KL 1 22 R6, R7 Res 1k 1% 100ppm 0603 WELWYN ASC0603-1K0FT5 2 23 RN1 Res Matrix 4x100k 1206 Vishay CRA06S083100KFKTR 1 24 U1 ZMDI Mirror Controller QFN64 9x9mm ZMDI ZAMC4100GA 1 25 J1 - Mating Female Connector 2x4 1.27mm 3M 45108-010030 + 3448-45108 1 Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 17 of 18 ZAMC4100 Application Kit V1.0 Kit Description & Design Guidelines Appendix C: PCB Layout Top Layer and Service Print Inner Layer 1 Inner Layer 2 Bottom Layer, Top View Kit Description May 11, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 18 of 18